US5086966A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Palladium-coated solder ball
Assignee: Novartis AG
•
Filing: 1990-11-05
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Granted: 1992-02-11
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Expires: 2010-11-05
Abstract
Abstract A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.
Inventors
- 👤 Cynthia M. Melton
- 👤 Carl J. Raleigh
- 👤 Steven Scheifers
- 👤 William Beckenbaugh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:39
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; B23K1/00; B23K1/20; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0435; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12181; Y10T428/12493; Y10T428/12687; Y10T428/12771; Y10T428/12861; Y10T428/12875
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
96 words
In a method for soldering onto a metallic substrate, said method comprising contacting the substrate with a solder body composed of a lead-tin alloy and heating at a temperature and for a time sufficient to reflow the solder alloy onto the substrate, whereby upon cooling the reflowed alloy bonds to the metal substrate, the improvement comprising depositing palladium onto the solder body surface prior to heating the solder alloy in contact with the substrate to enhance wetting of the substrate by the solder alloy during reflow and thereby improve bonding of the solder to the substrate.
Claim 2
Dependent Claim
96 words
In a method for soldering onto a metallic substrate, said method comprising contacting the substrate with a solder body composed of a lead-tin alloy and heating at a temperature and for a time sufficient to reflow the solder alloy onto the substrate, whereby upon cooling the reflowed alloy bonds to the metal substrate, the improvement comprising depositing palladium onto the solder body surface prior to heating the solder alloy in contact with the substrate to enhance wetting of the substrate by the solder alloy during reflow and thereby improve bonding of the solder to the substrate.
Claim 3
Dependent Claim
97 words
In a method for solder bonding a tin-lead alloy body to a copper substrate, said method comprising heating the solder body in contact with the substrate at a temperature and for a time sufficient to liquify the solder alloy and cooling to bond the alloy to the metal substrate, the improvement comprising pretreating the solder body to apply a discontinuous palladium deposit prior to heating the solder alloy in contact with the substrate, said deposit being effective to enhance wetting of the substrate by the liquid alloy and thereby improve bonding of the solder to the substrate.
Claim 4
Dependent Claim
97 words
In a method for solder bonding a tin-lead alloy body to a copper substrate, said method comprising heating the solder body in contact with the substrate at a temperature and for a time sufficient to liquify the solder alloy and cooling to bond the alloy to the metal substrate, the improvement comprising pretreating the solder body to apply a discontinuous palladium deposit prior to heating the solder alloy in contact with the substrate, said deposit being effective to enhance wetting of the substrate by the liquid alloy and thereby improve bonding of the solder to the substrate.
Claim 5
Dependent Claim
110 words
In a method for solder bonding a tin-lead alloy body to a copper substrate, said method comprising heating the solder body in contact with the substrate at a temperature and for a time sufficient to liquify the solder alloy and cooling to bond the alloy to the metal substrate, the improvement comprising pretreating the solder body prior to solder contact with the substrate, said pretreatment comprising immersing the body with an aqueous suspension containing palladium/tin colloidal particles to apply said particles onto the surface of the body, and immersing the colloid-coated body in an aqueous fluoboric acid solution to dissociate the colloidal particles and form a discontinuous palladium deposit thereon.
Claim 6
Dependent Claim
110 words
In a method for solder bonding a tin-lead alloy body to a copper substrate, said method comprising heating the solder body in contact with the substrate at a temperature and for a time sufficient to liquify the solder alloy and cooling to bond the alloy to the metal substrate, the improvement comprising pretreating the solder body prior to solder contact with the substrate, said pretreatment comprising immersing the body with an aqueous suspension containing palladium/tin colloidal particles to apply said particles onto the surface of the body, and immersing the colloid-coated body in an aqueous fluoboric acid solution to dissociate the colloidal particles and form a discontinuous palladium deposit thereon.
Claim 7
Dependent Claim
26 words
A solder ball composed of a suitable tin and lead solder alloy and having a surface, and comprising a palladium deposit on said solder ball surface.
Claim 8
Dependent Claim
26 words
A solder ball composed of a suitable tin and lead solder alloy and having a surface, and comprising a palladium deposit on said solder ball surface.
Claim 9
Dependent Claim
18 words
A solder ball composed of a tin-base lead alloy and comprising a surface carrying a discontinuous palladium deposit.
Claim 10
Dependent Claim
18 words
A solder ball composed of a tin-base lead alloy and comprising a surface carrying a discontinuous palladium deposit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-10 | 1995-08-12 | 1996-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-10 | 1999-08-12 | 2000-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-10 | 2003-08-12 | 2004-02-11 | $7700.00 | Window Closed / Lapsed |