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US5081005A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for reducing chemical interaction between copper features and photosensitive dielectric compositions

Assignee: Boeing Co
•
Filing: 1989-03-24
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Granted: 1992-01-14
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Expires: 2009-03-24
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Abstract

Abstract The surface of metallic features are coated with a desensitizer composition comprising an amino-silane to reduce the likelihood of chemical interaction between the metallic feature and a photosensitive functional group that is included in a dielectric composition that is coated over the metallic features. The chemical interaction adversely affects the photosensitivity of the dielectric composition and, thus, inhibits the formation of complete and well defined via interconnections through the dielectric composition.

Inventors

  • 👤 Kishore K. Chakravorty
  • 👤 Jay M. Cech

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 14:35
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/11; G03F7/075; G03F7/0755; H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/057; H10W20/071; H10W20/074; H10W20/077; H10W20/081; H05; H05K; H05K3/00; H05K3/38; H05K3/389; H05K3/46; H05K3/4644; Y; Y10; Y10S; Y10S430/00; Y10S430/155; Y10S430/162

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 104 words
A method of providing a patterned layer of a dielectric composition comprising a polyimide precursor that includes a photosensitive functional group, the method comprising: (a) applying a desensitizer composition comprising an amino-silane to a surface of a metallic feature, said photosensitive functional group being capable of chemically interacting with said metallic feature to alter the photosensitivity of said dielectric composition, the dielectric composition including a poly(amic acid) reacted to provide a photosensitive functional group therein; (b) coating said desensitizer composition comprising said amino-silane and said surface of said metallic feature with said dielectric composition; and (c) photolithographically patterning said layer of said dielectric composition.
Claim 2
Independent Claim 104 words
A method of providing a patterned layer of a dielectric composition comprising a polyimide precursor that includes a photosensitive functional group, the method comprising: (a) applying a desensitizer composition comprising an amino-silane to a surface of a metallic feature, said photosensitive functional group being capable of chemically interacting with said metallic feature to alter the photosensitivity of said dielectric composition, the dielectric composition including a poly(amic acid) reacted to provide a photosensitive functional group therein; (b) coating said desensitizer composition comprising said amino-silane and said surface of said metallic feature with said dielectric composition; and (c) photolithographically patterning said layer of said dielectric composition.
Claim 3
Dependent Claim 11 words
The method of claim 1, wherein said metallic feature comprises copper.
Claim 4
Dependent Claim 46 words
The method of claim 1, wherein said amino-silane is represented by the formula: ##STR2## wherein R 1 , R 2 , R 3 , R 5 , and R 6 are hydrogen or a lower alkyl radical, and wherein R 4 is a lower alkyl radical.
Claim 5
Dependent Claim 38 words
The method of claim 1, wherein said desensitizer composition comprising said amino-silane chemically alters said surface of said metallic feature such that said likelihood of chemical interaction between said photosensitive functional group and said metallic feature is reduced.
Claim 6
Dependent Claim 31 words
The method of claim 2, wherein said desensitizer composition comprising said amino-silane when applied to said surface of said metallic feature has a thickness ranging between about 20 and 100 angstroms.
Claim 7
Dependent Claim 36 words
The method of claim 1, wherein step (c) further comprises: photolithographically patterning fine geometry features into said layer of said dielectric composition, said fine geometry features having a width ranging between about 5 and 20 microns.
Claim 8
Dependent Claim 23 words
The method of claim 6, wherein said fine geometry features are via interconnects defined by an opening about 5 to 20 microns wide.

References Cited (Backward Citations)

US3508983A Cited
US3520683A Cited
US3615538A Cited
JPS55125631A Cited
JPS59151149A Cited
US4786569A Cited
US4732858A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-01-13 1995-07-15 1996-01-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-01-13 1999-07-15 2000-01-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-01-13 2003-07-15 2004-01-14 $7700.00 Window Closed / Lapsed

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