Apparatus for and method of mounting electronic components

Claim 2

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; an X-Y table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the X-Y table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which is disposed over said X-Y table, and which photographs printed patterns and component information of the printed circuit board; an image processor operatively associated with the camera which stores therein known patterns corresponding to all pad patterns printed on printed circuit boards and known letter patterns indicating types of electronic components, and which processes an image photographed by said camera and recognizes the letter pattern and the pad patterns on the printed circuit board agreeing with the known patterns, to recognize the type of the component from the recognized letter pattern and to recognize coordinates of pads near the letter pattern, thereby to determine a mounting position and a mounting angle of the recognized electronic component; and control means operatively associated with the image processor for controlling the component feed means, the X-Y table, and the component mounting means so that the recognized type of electronic component is mounted on the determined position of the printed circuit board at the determined mounting angle on the basis of the information from said image processor.

Claim 3

An electronic-component mounting apparatus according to claim 1, wherein said image processor has an algorithm which recognizes the large number of electronic components to be mounted on the printed circuit boards, and which determines orders of mounting the electronic components on the printed circuit boards.

Claim 4

An electronic-component mounting apparatus according to either of claims 1 and 2, wherein said image processor processes the image supplied from said camera, so as to evaluate X-, Y- and θ-coordinates of the electronic components to-be-mounted on said X-Y table.

Claim 5

An electronic-component mounting apparatus according to claim 3, further comprising data optimum-edit program generation means operatively associated with the image processor and the control means for determining an order of mounting the electronic components so as to attain a shortest time for mounting the electronic components on the whole printed circuit board, on the basis of the type data of the electronic components-to-be-mounted and the X-, Y- and θ-coordinate data of the mounting positions of the electronic components as obtained from said image processor.

Claim 6

An electronic-component mounting apparatus according to claim 2, further comprising means operatively associated with the image processor and the control means for successively moving said X-Y table in accordance with CAD data in the case where the printed circuit boards are fabricated with a CAD technique, the electronic components being mounted on the predetermined positions on the basis of the CAD data and information from said image processor.

Claim 7

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; an X-Y table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the X-Y table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which is disposed over said X-Y table, and which photographs printed patterns of the printed circuit board and component information thereof near the printed patterns; an image processor operatively associated with the camera which processes an image photographed by said camera, to recognize a type of the electronic component to-be-mounted from a letter pattern indicating the component information and to evaluate coordinates of pad patterns near the component and recognize the mounting position and a mounting attitude of the electronic component to-be-mounted; and control means operatively associated with the image processor for controlling the component feed means, the X-Y table, and the component mounting means so that the recognized type of electronic component to-be-mounted is mounted on the recognized position of the printed circuit board at the recognized attitude on the basis of the information from said image processor.

Claim 8

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; an X-Y table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the X-Y table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which is disposed over said X-Y table, and which photographs printed patterns of the printed circuit board and component information thereof near the printed patterns; an image processor operatively associated with the camera which processes an image photographed by said camera, to recognize a type of the electronic component to-be-mounted from a letter pattern indicating the component information and to evaluate coordinates of pad patterns near the component and recognize the mounting position and a mounting attitude of the electronic component to-be-mounted; and control means operatively associated with the image processor for controlling the component feed means, the X-Y table, and the component mounting means so that the recognized type of electronic component to-be-mounted is mounted on the recognized position of the printed circuit board at the recognized attitude on the basis of the information from said image processor.

Claim 9

An electronic-component mounting apparatus according to claim 6, wherein said image processor recognizes all the electronic components to be mounted on the printed circuit board and determines an order of mounting the electronic components on the printed circuit board, by means of a data optimum-edit program which attains a shortest mounting time.

Claim 10

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; a table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which photographs printed patterns on the printed circuit board and component information near the printed patterns; an image processor operatively associated with the camera which processes an image photographed by said camera, to recognize the mounting positions and mounting attitudes of the electronic components to-be-mounted and to generate a mounting order program for determining an order of mounting the electronic components to-be-mounted on the printed circuit board; and control means operatively associated with the image processor for controlling the component feed means, the table, and the component mounting means so that the electronic components to-be-mounted are successively mounted in the determined order on the recognized positions of the printed circuit board at the recognized attitudes on the basis of the information from said image processor.

Claim 11

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; a table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which photographs printed patterns on the printed circuit board and component information near the printed patterns; an image processor operatively associated with the camera which processes an image photographed by said camera, to recognize the mounting positions and mounting attitudes of the electronic components to-be-mounted and to generate a mounting order program for determining an order of mounting the electronic components to-be-mounted on the printed circuit board; and control means operatively associated with the image processor for controlling the component feed means, the table, and the component mounting means so that the electronic components to-be-mounted are successively mounted in the determined order on the recognized positions of the printed circuit board at the recognized attitudes on the basis of the information from said image processor.

Claim 12

An electronic-component mounting apparatus according to claim 8, wherein said image processor generates the mounting order and determines rough mounting positions of the components to-be-mounted on the basis of CAD data in the case where the printed circuit board is fabricated with a CAD technique, and processes the image from said camera to recognize the precise mounting positions and the mounting attitudes of the components to-be-mounted.

Claim 13

An electronic-component mounting method comprising the steps of photographing printed patterns on a printed circuit board and component information near the printed patterns, recognizing a letter pattern indicative of the component information and pad patterns near the letter pattern from an image photographed, recognizing a type of the electronic component to-be-mounted from the letter pattern and a mounting position and a mounting attitude of the electronic component to-be-mounted from the pad patterns, and mounting the predetermined electronic component on the predetermined position of the printed circuit board at the predetermined attitude on the basis of the above information.

Claim 14

An electronic-component mounting method comprising the steps of photographing printed patterns on a printed circuit board and component information near the printed patterns, recognizing a letter pattern indicative of the component information and pad patterns near the letter pattern from an image photographed, recognizing a type of the electronic component to-be-mounted from the letter pattern and a mounting position and a mounting attitude of the electronic component to-be-mounted from the pad patterns, and mounting the predetermined electronic component on the predetermined position of the printed circuit board at the predetermined attitude on the basis of the above information.

Claim 15

An electronic-component mounting method comprising the steps of photographing printed patterns on a printed circuit board and component information on types of components near the printed patterns, recognizing letter patterns indicative of the component information and pad patterns near the letter patterns from an image photographed, recognizing the types of the electronic components to-be-mounted from the letter patterns and mounting positions and mounting attitudes of the electronic components to-be-mounted from the pad patterns, further determining an order of mounting the electronic components to-be-mounted on the printed circuit board, and subsequently mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes successively in the predetermined order.

Claim 16

An electronic-component mounting method comprising the steps of photographing printed patterns on a printed circuit board and component information on types of components near the printed patterns, recognizing letter patterns indicative of the component information and pad patterns near the letter patterns from an image photographed, recognizing the types of the electronic components to-be-mounted from the letter patterns and mounting positions and mounting attitudes of the electronic components to-be-mounted from the pad patterns, further determining an order of mounting the electronic components to-be-mounted on the printed circuit board, and subsequently mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes successively in the predetermined order.

Claim 17

An electronic-component mounting method comprising the steps of: photographing printed patterns on a printed circuit board and component information on types of components near the printed patterns; determing the types and a mounting order of the electronic components to-be-mounted on the basis of an image photographed and CAD data in the case where the printed circuit board is fabricated with a CAD technique; further recognizing mounting positions and mounting attitudes of the electronic components to-be-mounted; and subsequently mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes successively in the predetermined order.

Claim 18

An electronic-component mounting method comprising the steps of: photographing printed patterns on a printed circuit board and component information on types of components near the printed patterns; determing the types and a mounting order of the electronic components to-be-mounted on the basis of an image photographed and CAD data in the case where the printed circuit board is fabricated with a CAD technique; further recognizing mounting positions and mounting attitudes of the electronic components to-be-mounted; and subsequently mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes successively in the predetermined order.

Claim 19

An electronic-component mounting method comprising the steps of storing known pad patterns which correspond to all pad patterns printed on a printed circuit board, and known letter patterns which indicate electronic components; photographing printed patterns on a printed circuit board and component information near the printed patterns; recognizing letter patterns aggreeing with the known letter patterns from an image photographed, and also recognizing pad patterns agreeing with the known pad patterns near the recognized letter patterns; recognizing types of the electronic components to-be-mounted from the recognized letter patterns and mounting positions and mounting attitudes of the electronic components to-be-mounted from the recognized pad patterns; and successively mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes on the basis of the above information.

Claim 20

An electronic-component mounting method comprising the steps of storing known pad patterns which correspond to all pad patterns printed on a printed circuit board, and known letter patterns which indicate electronic components; photographing printed patterns on a printed circuit board and component information near the printed patterns; recognizing letter patterns aggreeing with the known letter patterns from an image photographed, and also recognizing pad patterns agreeing with the known pad patterns near the recognized letter patterns; recognizing types of the electronic components to-be-mounted from the recognized letter patterns and mounting positions and mounting attitudes of the electronic components to-be-mounted from the recognized pad patterns; and successively mounting the predetermined electronic components on the predetermined positions of the printed circuit board at the predetermined attitudes on the basis of the above information.

Claim 21

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; an X-Y table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the X-Y table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which is disposed on said X-Y table, and which photographs printed patterns and component information of the printed circuit board; memory means for storing known patterns corresponding to all pad patterns printed on printed circuit boards and known letter patterns indicating types of electronic components; processing means operatively associated with the camera and the memory means for processing an image photographed by said camera, to recognize letter patterns on the printed circuit board and pad patterns near the letter patterns as agreeing with the known patterns stored in said memory means; image processing means operatively associated with the processing means for recognizing the types of the electronic components to-be-mounted from the recognized letter patterns and also recognizing coordinates of pads from the recognized pad patterns, thereby to determine the mounting positions and mounting angles of the electronic components to-be-mounted; and control means operatively associated with the image processing means for controlling the component feed means, the X-Y table, and the component mounting means to mount the recognized types of electronic components to-be-mounted on the determined positions of the printed circuit board at the determined mounting angles on the basis of the information from said image processing means.

Claim 22

An electronic-component mounting apparatus comprising: component feed means for feeding electronic components; an X-Y table on which a printed circuit board is placed; component mounting means operatively associated with the component feed means and the X-Y table for mounting the electronic components from said component feed means on predetermined positions of the printed circuit board; a camera which is disposed on said X-Y table, and which photographs printed patterns and component information of the printed circuit board; memory means for storing known patterns corresponding to all pad patterns printed on printed circuit boards and known letter patterns indicating types of electronic components; processing means operatively associated with the camera and the memory means for processing an image photographed by said camera, to recognize letter patterns on the printed circuit board and pad patterns near the letter patterns as agreeing with the known patterns stored in said memory means; image processing means operatively associated with the processing means for recognizing the types of the electronic components to-be-mounted from the recognized letter patterns and also recognizing coordinates of pads from the recognized pad patterns, thereby to determine the mounting positions and mounting angles of the electronic components to-be-mounted; and control means operatively associated with the image processing means for controlling the component feed means, the X-Y table, and the component mounting means to mount the recognized types of electronic components to-be-mounted on the determined positions of the printed circuit board at the determined mounting angles on the basis of the information from said image processing means.