US5079481A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plasma-assisted processing magneton with magnetic field adjustment
Assignee: Texas Instruments Inc
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Filing: 1990-08-02
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Granted: 1992-01-07
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Expires: 2010-08-02
Abstract
Abstract A magnetron plasma processing module (20) with magnetic field adjustment for magnetron-plasma-enhanced processing of a semiconductor wafer includes a magnetron housing, a plurality of magnets (44), and magnetically conductive pins (26) for varying the magnetic field distribution and strength at the semiconductor wafer (52). Top plate (34) adjustably engages magnetically conductive pins (26). A magnetically nonconductive cylinder (36) supports top plate (34) and receives pins (26) from top plate (34). Magnet assembly (40) connects to cylinder (36) and contains magnets (44). Magnet assembly (40) also has bore (82) to receive pins (26). Magnetically conductive ring (38) separates cylinder (36) from magnet assembly (40) and engages pins (26) to isolate the magnetic field from cylinder (36). Magnets (44) and extension iron bars associate with magnet assembly (40) to establish the magnetic field having adjustable uniformity. Iron bars (42) associate with magnets (44) to aid in producing a uniform magnetic field at semiconductor (52). The magnetron module (20) can be rotated to achieve uniform magnetron plasma processing.
Inventors
- 👤 Mehrdad M. Moslehi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:33
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/32623; H01J37/3266
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
60 words
A magnetron plasma processing module with magnetic field adjustment for magnetron-plasma-enhanced processing of a semiconductor device, comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of pins adjustable mounted to said housing and associated for varying said magnetic field at the semiconductor device.
Claim 2
Dependent Claim
60 words
A magnetron plasma processing module with magnetic field adjustment for magnetron-plasma-enhanced processing of a semiconductor device, comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of pins adjustable mounted to said housing and associated for varying said magnetic field at the semiconductor device.
Claim 3
Dependent Claim
116 words
The module of claim 1, wherein said housing comprises: a top plate for adjustably engaging said magnetically conductive pins; a cylinder supporting said top plate and having openings for receiving said pins from said top plate; and a magnet assembly for establishing the magnetic field, said magnet assembly comprising an iron ring adjoining said cylinder for providing support to said assembly and surrounding a bore within said assembly wherein the plurality of magnets are connected to said iron ring and surround said bore for providing the magnetic field and said assembly further comprises a plurality of extension bars associated with said magnets and surrounding said bore for producing a substantially uniform magnetic field within said bore.
Claim 4
Dependent Claim
21 words
The module of claim 2, wherein said magnet assembly is operable for producing the uniform magnetic field at the semiconductor device.
Claim 5
Dependent Claim
66 words
The module of claim 2, wherein each of said pins comprises: a stop for limiting movement of said pin into said opening; a shaft connected to said stop, and having a length at least equaling the cylindrical height of said cylinder plus the height of the magnet assembly; and a tip connected to said shaft and associated to enter said bore for adjusting said magnetic field.
Claim 6
Dependent Claim
18 words
The module of claim 4, wherein said tip comprises a block for assisting adjustment of said magnetic field.
Claim 7
Dependent Claim
26 words
The module of claim 2, wherein said pins reciprocate between said cylinder and said magnet assembly to modify the magnetic field distribution at the semiconductor device.
Claim 8
Dependent Claim
26 words
The module of claim 2, wherein said pins reciprocate between said cylinder and said magnet assembly to modify the magnetic flux density at the semiconductor device.
Claim 9
Dependent Claim
40 words
The module of claim 2, wherein said magnets mount within said magnet assembly to form at least two groups of magnets said groups having opposite polarities with respect to each other for closing magnetic field flux lines between said groups.
Claim 10
Dependent Claim
14 words
The module of claim 1, wherein said magnets produce a uniform transverse magnetic field.
Claim 11
Dependent Claim
13 words
The module of claim 1, wherein said magnets comprise a permanent magnetic material.
Claim 12
Dependent Claim
10 words
The module of claim 1, wherein said magnets comprise electromagnets.
Claim 13
Dependent Claim
11 words
The module of claim 1, wherein said magnets comprise ceramic magnets.
Claim 14
Dependent Claim
11 words
The module of claim 1, wherein said magnets comprise alnico magnets.
Claim 15
Dependent Claim
11 words
The module of claim 1, wherein said magnets comprise rare-earth magnets.
Claim 16
Dependent Claim
15 words
The module of claim 1, further comprising a rotation mechanism for rotating said magnetron module.
Claim 17
Independent Claim
120 words
A system for plasma-assisted processing of a semiconductor device using a magnetron-plasma-enhanced process, said system comprising: a magnetron with magnetic field adjustment for magnetron-plasma-enhanced processing of the semiconductor device, comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of magnetically conductive pins adjustably mounted to said housing and associated for varying said magnetic field at the semiconductor device; and a radio frequency chuck, comprising: a coolant module for extracting heat from the semiconductor device: a heating apparatus adjoining said coolant module for heating the semiconductor device; and a radio frequency plate for associating an electromagnetic radio frequency power source with the semiconductor device.
Claim 18
Independent Claim
120 words
A system for plasma-assisted processing of a semiconductor device using a magnetron-plasma-enhanced process, said system comprising: a magnetron with magnetic field adjustment for magnetron-plasma-enhanced processing of the semiconductor device, comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of magnetically conductive pins adjustably mounted to said housing and associated for varying said magnetic field at the semiconductor device; and a radio frequency chuck, comprising: a coolant module for extracting heat from the semiconductor device: a heating apparatus adjoining said coolant module for heating the semiconductor device; and a radio frequency plate for associating an electromagnetic radio frequency power source with the semiconductor device.
Claim 19
Dependent Claim
116 words
The system of claim 16, wherein said housing comprises: a top plate for adjustably engaging said magnetically conductive pins; a cylinder supporting said top plate and having openings for receiving said pins from said top plate; and a magnet assembly for establishing the magnetic field, said magnet assembly comprising an iron ring adjoining said cylinder for providing support to said assembly and surrounding a bore within said assembly, wherein the plurality of magnets are connected to said iron ring and surround said bore for providing the magnetic field and said assembly further comprises a plurality of extension bars associated with said magnets and surrounding said bore for producing a substantially uniform magnetic field within said bore.
Claim 20
Dependent Claim
21 words
The system of claim 17, wherein said magnet assembly is operable for producing the uniform magnetic field at the semiconductor device.
Claim 21
Dependent Claim
36 words
The system of claim 17, wherein said iron ring separates said cylinder from said magnet assembly and engages said extension bars and magnets for closing the magnetic field lines on one end of the magnet poles.
Claim 22
Dependent Claim
66 words
The system of claim 17, wherein each of said pins comprises: a stop for liming movement of said pin into said opening; a shaft integral to said stop, and having a length at least equaling the cylindrical height of said cylinder plus the height of said magnet assembly; and a tip integral to said shaft and associated to enter said bore for adjusting said magnetic field.
Claim 23
Dependent Claim
21 words
The system of claim 20, wherein said tip further comprises an iron block termination for assisting adjustment of said magnetic field.
Claim 24
Dependent Claim
26 words
The system of claim 17, wherein said pins reciprocate between said cylinder and said magnet assembly to modify the magnetic flux distribution at the semiconductor device.
Claim 25
Dependent Claim
26 words
The system of claim 17 wherein said pins reciprocate between said cylinder and said magnet assembly to modify the magnetic flux strength at the semiconductor device.
Claim 26
Dependent Claim
16 words
The system of claim 17, wherein said radio frequency chuck comprises the property of being nonmagnetic.
Claim 27
Dependent Claim
39 words
The system of claim 17, wherein said coolant module further comprises a top plate and a bottom plate, said bottom plate coupled to said top plate of the coolant module and formed to permit a coolant to pass therebetween.
Claim 28
Dependent Claim
63 words
The system of claim 17, wherein said heating apparatus further comprises: a top layer of electrical insulation; a power resistor set within said top layer for generating heat energy to heat the semiconductor device; a bottom layer of electrical insulation adjoining said top layer and sealing therebetween said power resistor; and a wafer adjoining said bottom layer and structurally supporting said heating apparatus.
Claim 29
Independent Claim
110 words
A system for magnetron-plasma-enhanced processing of a semiconductor device, comprising: a semiconductor device processing reactor; a radio frequency chuck, said chuck comprising: a coolant module for extracting heat from the semiconductor device; a heating element adjoining said coolant module for heating said semiconductor device; and a radio frequency plate for associating an electromagnetic radio frequency power source with the semiconductor device; and a magnetron, said magnetron comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of pins adjustably mounted to said housing and associated for varying said magnetic field at the semiconductor device.
Claim 30
Independent Claim
110 words
A system for magnetron-plasma-enhanced processing of a semiconductor device, comprising: a semiconductor device processing reactor; a radio frequency chuck, said chuck comprising: a coolant module for extracting heat from the semiconductor device; a heating element adjoining said coolant module for heating said semiconductor device; and a radio frequency plate for associating an electromagnetic radio frequency power source with the semiconductor device; and a magnetron, said magnetron comprising: a magnetron housing; a plurality of magnets connected to said housing and associated for producing a magnetic field at the semiconductor device; and a plurality of pins adjustably mounted to said housing and associated for varying said magnetic field at the semiconductor device.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-01-06 | 1995-07-08 | 1996-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-01-06 | 1999-07-08 | 2000-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-01-06 | 2003-07-08 | 2004-01-07 | $7700.00 | Window Closed / Lapsed |