US5077237B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of encapsulating a semiconductor element using a resin mold having upper and lower mold half resin inflow openings
Assignee: Seiko Epson Corp
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Filing: 1990-09-17
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Granted: 1997-07-08
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Expires: 2010-09-17
Abstract
No abstract record available.
Inventors
- 👤 Akitoshi Hara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:53
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; B29C2045/1486; B29C2045/14942; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-07 | 2001-01-06 | 2001-07-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-07 | 2005-01-06 | 2005-07-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-07 | 2009-01-06 | 2009-07-08 | $7700.00 | Window Closed / Lapsed |