Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
118 words
A high-conductivity copper alloy consisting essentially of 6N copper and at least one element selected from the group consisting of, by weight, 10 to 100 ppm indium, 10 to 1000 ppm silver, 10 to 300 ppm cadmium, 10 to 50 ppm tin, 10 to 50 ppm antimony, 3 to 30 ppm lead, 3to 30 ppm bismuth, 3 to 30 ppm zirconium, 3 to 50 ppm titanium, and 3 to 30 ppm hafnium, wherein the amount of sulfur as an unavoidable impurity is controlled to less than 3 ppm, the amount of oxygen as an unavoidable impurity is controlled to less than 5 ppm, and the total amount of other unavoidable impurities is controlled to less than 3 ppm.
Claim 2
Dependent Claim
118 words
A high-conductivity copper alloy consisting essentially of 6N copper and at least one element selected from the group consisting of, by weight, 10 to 100 ppm indium, 10 to 1000 ppm silver, 10 to 300 ppm cadmium, 10 to 50 ppm tin, 10 to 50 ppm antimony, 3 to 30 ppm lead, 3to 30 ppm bismuth, 3 to 30 ppm zirconium, 3 to 50 ppm titanium, and 3 to 30 ppm hafnium, wherein the amount of sulfur as an unavoidable impurity is controlled to less than 3 ppm, the amount of oxygen as an unavoidable impurity is controlled to less than 5 ppm, and the total amount of other unavoidable impurities is controlled to less than 3 ppm.
Claim 3
Dependent Claim
119 words
A high-conductivity copper alloy consisting essentially of 6N copper and at least one element selected from the group consisting of, by weight, 30 to 80 ppm silver, 100 to 800 ppm silver, 30 to 150 ppm cadmium, 20 to 40 ppm tin, 20 to 40 ppm antimony, 10 to 25 ppm lead, 10 to 25 ppm bismuth, 5 to 20 ppm zirconium, 5 to 30 ppm titanium, and 5 to 20 ppm hafnium, wherein the amount of sulfur as an unavoidable impurity is controlled to less than 3 ppm, the amount of oxygen as an unavoidable impurity is controlled to less than 5 ppm, and the total amount of other unavoidable impurities is controlled to less than 3 ppm.
Claim 4
Dependent Claim
119 words
A high-conductivity copper alloy consisting essentially of 6N copper and at least one element selected from the group consisting of, by weight, 30 to 80 ppm silver, 100 to 800 ppm silver, 30 to 150 ppm cadmium, 20 to 40 ppm tin, 20 to 40 ppm antimony, 10 to 25 ppm lead, 10 to 25 ppm bismuth, 5 to 20 ppm zirconium, 5 to 30 ppm titanium, and 5 to 20 ppm hafnium, wherein the amount of sulfur as an unavoidable impurity is controlled to less than 3 ppm, the amount of oxygen as an unavoidable impurity is controlled to less than 5 ppm, and the total amount of other unavoidable impurities is controlled to less than 3 ppm.
Claim 5
Dependent Claim
12 words
A wire formed from copper alloy according to claim 1 or 2.
Claim 6
Dependent Claim
13 words
A magnet wire formed from copper alloy according to claim 1 or 2.
Claim 7
Dependent Claim
17 words
A lead wire for an electronic component formed from copper alloy according to claim 1 or 2.
Claim 8
Dependent Claim
17 words
A lead member for tape automated bonding formed from copper alloy according to claim 1 or 2.
Claim 9
Dependent Claim
16 words
A member for a printed-circuit board formed from copper alloy according to claim 1 or 2.