US5075962A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming leads
Assignee: Cypress Semiconductor Corp
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Filing: 1991-03-05
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Granted: 1991-12-31
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Expires: 2011-03-05
Abstract
Abstract The present invention is a method of creating a ring surrounding a chip carrier having a lead frame premolded to a carrier body or housing. The ring is comprised of a first premolded section having a first predetermined shape and a second premolded section having a second predetermined shape. A non-conductive adhesive material is applied to a mating side of each of said sections. These first and second sections are combined to form the ring in which certain portions of the first section mate into the second section through matching holes in the metal lead frame of the chip carrier package. The resulting chip carrier ring is positioned in a short distance from the carrier body relative to the length of any of the four sides of the carrier body in order to gain mechanical strength provided by the plurality of leads, thus avoiding the substantial bending of individual leads.
Inventors
- 👤 William R. Gibson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49204; Y10T29/49208; Y10T29/49222
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
191 words
A method of assembling electronic components comprising: a) providing a two-section ring having a first section and a second section, each section having (1) a cavity, (2) a rim, (3) alignment means for aligning the ring to a package containing a semiconductor device and a peripherally extending leadframe which includes leads comprising first lead segments peripherally extending from said package to said ring and second lead segments peripherally extending from said first lead segments beyond said ring, and (4) means for connecting said first and second sections together with said package and leadframe; b) placing said package and leadframe on one side of said first section, said package overlying said cavity and said leadframe overlying said rim of said first section; c) joining said first section, said second section and said semiconductor device and leadframe into a single integrated unit using said alignment means such that said first and second sections are aligned with each other and engage said leadframe without substantially altering the shape of said leadframe; and d) then separating said ring from said leadframe along the interface between said first and second lead segments, thereby forming connecting leads.
Claim 2
Independent Claim
191 words
A method of assembling electronic components comprising: a) providing a two-section ring having a first section and a second section, each section having (1) a cavity, (2) a rim, (3) alignment means for aligning the ring to a package containing a semiconductor device and a peripherally extending leadframe which includes leads comprising first lead segments peripherally extending from said package to said ring and second lead segments peripherally extending from said first lead segments beyond said ring, and (4) means for connecting said first and second sections together with said package and leadframe; b) placing said package and leadframe on one side of said first section, said package overlying said cavity and said leadframe overlying said rim of said first section; c) joining said first section, said second section and said semiconductor device and leadframe into a single integrated unit using said alignment means such that said first and second sections are aligned with each other and engage said leadframe without substantially altering the shape of said leadframe; and d) then separating said ring from said leadframe along the interface between said first and second lead segments, thereby forming connecting leads.
Claim 3
Dependent Claim
38 words
The method of claim 1 wherein said means for connecting said first section of said ring are inserted into said means for connecting said second section of said ring and become an inseparable integral part of said package.
Claim 4
Dependent Claim
29 words
The method of claim 1 where said means for connecting said first and second sections of said ring comprise mating pins and mating holes which become inseparable upon engagement.
Claim 5
Dependent Claim
23 words
The invention of claim 1 where said first section and second section engage said leadframe using adhesive material to form an integral ring.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-30 | 1995-07-01 | 1995-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-30 | 1999-07-01 | 1999-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-30 | 2003-07-01 | 2003-12-31 | $7700.00 | Window Closed / Lapsed |