Delamination resistant ceramic capacitor and method of making same

Claim 1

In a delamination resistant monolithic multilayer ceramic capacitive device comprising a plurality of ceramic dielectric layers and a plurality of metallic electrode layers interposed between said dielectric layers, the improvement which comprises discrete intervening layers interposed between said dielectric and electrode layers, said intervening layers being comprised of a combination of a ceramic material compatible with and fused to said dielectric layers, and metallic materials compatible with and fused to the metal of said electrode layers.

Claim 7

The method of manufacturing a multilayer ceramic capacitive device which includes the steps of forming a plurality of preforms, said preforms including a green ceramic dielectric layer, depositing a first pattern on an upper surface of said layers, said pattern being comprised of a mixture of ceramic particles and metallic particles, said ceramic particles being fusible to the ceramic of said dielectric layer under sintering conditions, depositing an electrode forming second pattern over and in registry with said first pattern, said second pattern comprising metallic particles in higher concentration than the concentration of metallic particles of said first pattern, the metal components of said second pattern being comprised of the same composition as or miscible with the metallic components of said first pattern under sintering conditions, depositing a third pattern over and in registry with said second pattern, the composition of said third pattern being the same as the composition of said first pattern, thereafter stacking a plurality of said preforms one atop the other such that the third patterns of said preforms engage the lower surfaces of the dielectric layers of the next adjacent preforms and the patterns of adjacent said preforms are in partial registry, thereafter sintering said stacked preforms to form a monolith wherein ceramic components of said first and third patterns are fused to the dielectric layers abutting said first and second patterns and the metallic components of said first and third patterns are bonded to metallic components of said second patterns.

Claim 8

The method of manufacturing a multilayer ceramic capacitive device which includes the steps of forming a plurality of preforms, said preforms including a green ceramic dielectric layer, depositing a first pattern on an upper surface of said layers, said pattern being comprised of a mixture of ceramic particles and metallic particles, said ceramic particles being fusible to the ceramic of said dielectric layer under sintering conditions, depositing an electrode forming second pattern over and in registry with said first pattern, said second pattern comprising metallic particles in higher concentration than the concentration of metallic particles of said first pattern, the metal components of said second pattern being comprised of the same composition as or miscible with the metallic components of said first pattern under sintering conditions, depositing a third pattern over and in registry with said second pattern, the composition of said third pattern being the same as the composition of said first pattern, thereafter stacking a plurality of said preforms one atop the other such that the third patterns of said preforms engage the lower surfaces of the dielectric layers of the next adjacent preforms and the patterns of adjacent said preforms are in partial registry, thereafter sintering said stacked preforms to form a monolith wherein ceramic components of said first and third patterns are fused to the dielectric layers abutting said first and second patterns and the metallic components of said first and third patterns are bonded to metallic components of said second patterns.

Claim 13

The method of manufacturing a multilayer ceramic capacitive device which includes the step of fabricating a preform including a green dielectric layer comprised of ceramic particles and a binder, forming a pair of intervening layers comprised of ceramic particles, binder, and particulate metal, sandwiching said dielectric layer between said intervening layers, applying an electrode forming composition including particulate metal material to the surfaces of said intervening layers remote from said dielectric layer, the metal of said electrode layer, when molten, being miscible with the molten metal incorporated in said intervening layers, and thereafter heating said preform for a time sufficient to drive off said binder, melt said particulate metal materials, and sinter said ceramic particle.

Claim 14

The method of manufacturing a multilayer ceramic capacitive device which includes the step of fabricating a preform including a green dielectric layer comprised of ceramic particles and a binder, forming a pair of intervening layers comprised of ceramic particles, binder, and particulate metal, sandwiching said dielectric layer between said intervening layers, applying an electrode forming composition including particulate metal material to the surfaces of said intervening layers remote from said dielectric layer, the metal of said electrode layer, when molten, being miscible with the molten metal incorporated in said intervening layers, and thereafter heating said preform for a time sufficient to drive off said binder, melt said particulate metal materials, and sinter said ceramic particle.