US5068866A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser apparatus
Assignee: Panasonic Holdings Corp
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Filing: 1989-10-30
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Granted: 1991-11-26
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Expires: 2009-10-30
Abstract
Abstract A laser chip is directly disposed on a support member through a mounting arrangement and a support member, the laser chip, and peripheral parts thereof are integrally sealed within a transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.
Inventors
- 👤 Masaru Wada
- 👤 Kunio Itoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:58
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/028; H01S5/022; H01S5/023; H01S5/0232; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; H01S5/02208; H01S5/02212; H01S5/02218; H01S5/02234; H01S5/02325; H01S5/06; H01S5/068; H01S5/0683; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
91 words
A semiconductor laser apparatus comprising: a laser chip having a high reflectivity film formed on at least one end surface of a cavity thereof; a photodiode chip; a support member for supporting said laser chip through a mount member and for supporting said diode chip so as to receive a laser beam radiated from said laser chip in a backward direction, said support member being an end portion of a metal lead; a transparent plastic resin for encapsulating said laser chip, said support member, said mount member and said photodiode chip.
Claim 2
Dependent Claim
91 words
A semiconductor laser apparatus comprising: a laser chip having a high reflectivity film formed on at least one end surface of a cavity thereof; a photodiode chip; a support member for supporting said laser chip through a mount member and for supporting said diode chip so as to receive a laser beam radiated from said laser chip in a backward direction, said support member being an end portion of a metal lead; a transparent plastic resin for encapsulating said laser chip, said support member, said mount member and said photodiode chip.
Claim 3
Dependent Claim
23 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is made of a dielectric film or a metal film.
Claim 4
Dependent Claim
22 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed on both end surfaces of said cavity.
Claim 5
Dependent Claim
51 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed on both end surfaces of said cavity, and one high reflectivity film is made of a dielectric monolayer film and the other high reflectivity film is made of a dielectric multilayer film or a metal film.
Claim 6
Dependent Claim
23 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed only at one end surface of said cavity.
Claim 7
Dependent Claim
18 words
A semiconductor laser apparatus according to claim 1, wherein the refractive index of said plastic resin is 1.54.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-25 | 1995-05-27 | 1995-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-25 | 1999-05-27 | 1999-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-25 | 2003-05-27 | 2003-11-26 | $7700.00 | Window Closed / Lapsed |