US5067047A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit pack with inboard jet cooling
Assignee: Nokia Bell Labs
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Filing: 1990-05-11
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Granted: 1991-11-19
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Expires: 2010-05-11
Abstract
Abstract Disclosed is a means for cooling heat generating components mounted on the front surface of printed circuit boards. A conduit member is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes in the board establish cooling jets directed at the components from the plenum.
Inventors
- 👤 Kaveh Azar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:31
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2029; H05K7/20345; H05K1/00; H05K1/02; H05K1/0272; H05K2201/00; H05K2201/06; H05K2201/064; H05K2201/09; H05K2201/09009; H05K2201/09063; Y; Y10; Y10S; Y10S165/00; Y10S165/908; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
122 words
A fluid-cooled circuit pack comprising: a circuit board having front and back major surfaces with at least one heat generating component mounted on the front surface; conduit means connectable to a source of compressed fluid and attached to the back surface of said circuit board to form a sealed plenum for conducting cooling fluid in a direction essentially parallel to said surfaces to a predetermined area at the back surface of said board; and at least one hole in said circuit board connected to said conduit means, said hole extending from the back surface to the front surface in sufficient proximity to said component to form a cooling jet impinging on said component when said conduit means is connected to said source.
Claim 2
Dependent Claim
122 words
A fluid-cooled circuit pack comprising: a circuit board having front and back major surfaces with at least one heat generating component mounted on the front surface; conduit means connectable to a source of compressed fluid and attached to the back surface of said circuit board to form a sealed plenum for conducting cooling fluid in a direction essentially parallel to said surfaces to a predetermined area at the back surface of said board; and at least one hole in said circuit board connected to said conduit means, said hole extending from the back surface to the front surface in sufficient proximity to said component to form a cooling jet impinging on said component when said conduit means is connected to said source.
Claim 3
Dependent Claim
34 words
The circuit pack according to claim 1 wherein a plurality of holes is formed in said circuit board in the vicinity of said component to form a plurality of jets directed to said component.
Claim 4
Dependent Claim
29 words
The circuit pack according to claim 2 wherein at least one of said holes is oriented at an oblique angle to the front and back surfaces of the board.
Claim 5
Dependent Claim
19 words
The circuit pack according to claim 1 further comprising a source of compressed fluid connected to said conduit means.
Claim 6
Dependent Claim
12 words
The circuit pack according to claim 4 wherein the fluid is air.
Claim 7
Dependent Claim
26 words
The circuit pack according to claim 1 wherein the at least one hole is circular and has a diameter in the range 0.0254 to 0.254 cm.
Claim 8
Dependent Claim
24 words
The circuit pack according to claim 4 wherein the source of compressed air has a pressure in the range 1.38 to 4.14×10 5 pa.
Claim 9
Dependent Claim
26 words
The circuit pack according to claim 1 wherein the conduit means comprises a second circuit board mounted in a parallel spaced relationship with said first board.
Claim 10
Dependent Claim
51 words
The circuit pack according to claim 1 wherein the conduit means comprises a second board mounted adjacent to the back surface of the circuit board and including channels formed in the surface of the second board adjacent to the circuit board for directing the flow of fluid to said predetermined area.
Claim 11
Dependent Claim
41 words
The circuit pack according to claim 1 further comprising means for connecting the conduit means to the source of compressed fluid through an edge of the conduit means which is perpendicular to the front and back surfaces of the circuit board.
Claim 12
Dependent Claim
41 words
The circuit pack according to claim 10 where the means for connecting the conduit means comprises a nozzle which fits into a plenum formed on a backplane when the circuit pack is inserted in a shelf extending perpendicular to the backplane.
Claim 13
Dependent Claim
42 words
The circuit pack according to claim 1 further comprising means for connecting the conduit means to the source of compressed fluid through a surface of the conduit means which is essentially parallel to the front and back surfaces of the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-18 | 1995-05-20 | 1995-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-18 | 1999-05-20 | 1999-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-18 | 2003-05-20 | 2003-11-19 | $7700.00 | Window Closed / Lapsed |