Multi-layer ceramic substrate assembly and a process for manufacturing same

Claim 2

A multi-layer ceramic substrate assembly comprising: a multi-layer ceramic substrate including a via-conductor and having a surface; a first soldering pad on the surface of said substrate, said first soldering pad having an outermost surface of a metal wettable with a solder; a second soldering pad on the surface of said substrate remote from said first soldering pad, said second soldering pad having an outermost surface of a metal wettable with a solder; a connecting pattern on the surface of said substrate, said connecting pattern electrically connecting said first and second soldering pads, said connecting pattern having an outermost surface; and a solder dam on a portion of the outermost surface of said connecting pattern, said solder dam being made of a material not wettable with a solder.

Claim 3

An assembly according to claim 1, wherein said first and second soldering pads are made of one of the group consisting of gold, silver, and nickel.

Claim 4

An assembly according to claim 1, wherein said solder dam is made of one of the group consisting of titanium, chromium, ruthenium, rhodium, molybdenum, tungsten, and titanium-nickel.

Claim 5

An assembly according to claim 3, wherein said solder dam is titanium-nickel intermetallic compound.

Claim 6

An assembly according to claim 1, further comprising a first solder having a first melting point on said first soldering pad and a second solder having a second melting point lower than the first melting point on said second soldering pad.

Claim 7

An assembly according to claim 5, wherein said first solder is gold-tin and said second solder is tin.

Claim 8

An assembly according to claim 5, further comprising a pin soldered to said first soldering pad by said first solder such that said pin stands erect on the outermost surface of said first soldering pad.

Claim 9

An assembly according to claim 1, wherein said second soldering pad is used for modification of an electric circuit in the multi-layer ceramic substrate assembly.

Claim 10

An assembly according to claim 1, wherein the outermost surface of said connecting pattern includes an electrically interrupted portion, and wherein said solder dam is formed on the electrically interrupted portion of said connecting pattern.

Claim 11

A process for manufacturing a multi-layer ceramic substrate assembly, comprising the steps of: forming a first electric conductor metal pattern on a surface of a multi-layer ceramic substrate having a via-conductor, said pattern including first, second and third portions, the first and second portions being electrically connected by the third portion in said pattern, the first portion of said pattern being electrically connected with said via-conductor, said first electric conductor metal pattern having an outermost surface; forming a first soldering pad of a second electric conductor metal on the first portion of the outermost surface of said pattern, said first soldering pad including an outermost surface wettable with a solder; forming a second soldering pad of a third electric conductor metal on the second portion of the outermost surface of said pattern, said second soldering pad including an outermost surface wettable with a solder; depositing a reactive metal over the entire exposed outermost surface of said pattern, said first soldering pad and said second soldering pad; forming a solder dam by reacting said reactive metal selectively with said first electric conductor metal at the third portion of the outermost surface of said pattern to form a material not wettable with a solder; and selectively etching said metal remaining at least on said first and second soldering pads, wherein said first and second soldering pads are wettable with a solder and said solder dam is not wettable with a solder.

Claim 12

A process for manufacturing a multi-layer ceramic substrate assembly, comprising the steps of: forming a first electric conductor metal pattern on a surface of a multi-layer ceramic substrate having a via-conductor, said pattern including first, second and third portions, the first and second portions being electrically connected by the third portion in said pattern, the first portion of said pattern being electrically connected with said via-conductor, said first electric conductor metal pattern having an outermost surface; forming a first soldering pad of a second electric conductor metal on the first portion of the outermost surface of said pattern, said first soldering pad including an outermost surface wettable with a solder; forming a second soldering pad of a third electric conductor metal on the second portion of the outermost surface of said pattern, said second soldering pad including an outermost surface wettable with a solder; depositing a reactive metal over the entire exposed outermost surface of said pattern, said first soldering pad and said second soldering pad; forming a solder dam by reacting said reactive metal selectively with said first electric conductor metal at the third portion of the outermost surface of said pattern to form a material not wettable with a solder; and selectively etching said metal remaining at least on said first and second soldering pads, wherein said first and second soldering pads are wettable with a solder and said solder dam is not wettable with a solder.

Claim 13

A process according to claim 8, wherein said second and third conductor metals are one of the group consisting of gold and alloys thereof, said first conductor metal pattern is nickel, said reactive metal is titanium, and said solder dam is a titanium-nickel intermetallic compound.

Claim 14

A process according to claim 8, further comprising the step of bonding a first solder having a first melting point on the outermost surface of said first soldering pad and a second solder having a second melting point lower than the first melting point on the outermost surface of said second soldering pad.

Claim 15

A process according to claim 12, wherein said first solder is gold-tin and said second solder is tin.

Claim 16

A process according to claim 10, further comprising the step of soldering a pin to said first soldering pad by said first solder such that said pin stands erect on the outermost surface of said first soldering pad.

Claim 17

A process according to claim 10, wherein said second soldering pad is used for modification of an electric circuit in the multi-layer ceramic substrate assembly.

Claim 18

A process according to claim 8, further comprising the step of forming a body conductor copper layer on the multi-layer ceramic layer, and wherein said pattern is nickel formed on said body conductor copper layer.

Claim 19

A process according to claim 10, further comprising the step of forming an insulating layer on the surface of the multi-layer ceramic layer.

Claim 20

A process according to claim 8, wherein said step of forming said solder dam includes the substep of forming an electrically interrupted portion on the outermost portion of said pattern.