US5060049A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multiple resistivity wiring apparatus
Assignee: Niterra Co Ltd
•
Filing: 1990-07-18
•
Granted: 1991-10-22
•
Expires: 2010-07-18
Abstract
Abstract A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.
Inventors
- 👤 Kozo Yamasaki
- 👤 Kouichi Mouri
- 👤 Naomiki Kato
- 👤 Mitsuru Hirano
- 👤 Michael A. Schmitt
- 👤 Bidyut Bhattacharyya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 20:19
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W44/00; H10W44/401; H10W70/62; H10W70/66
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
68 words
A wiring apparatus comprising: a substrate formed of an electrically insulative ceramic; a pattern formed on a surface of said substrate, said pattern including a plurality of first wirings composed of a first metallized material having an electrical resistivity of a first value; and a plurality of second wirings composed of a second metallized material having an electrical resistivity of a second value different from said first value.
Claim 2
Dependent Claim
68 words
A wiring apparatus comprising: a substrate formed of an electrically insulative ceramic; a pattern formed on a surface of said substrate, said pattern including a plurality of first wirings composed of a first metallized material having an electrical resistivity of a first value; and a plurality of second wirings composed of a second metallized material having an electrical resistivity of a second value different from said first value.
Claim 3
Dependent Claim
43 words
The wiring apparatus according to claim 1, wherein the wiring pattern further includes a plurality of third wirings, each composed of said first metallized material and said second metallized material, said second metallized material being in electrical contact with said first metallized material.
Claim 4
Dependent Claim
71 words
The wiring apparatus according to claim 1, wherein each of said first and second metallized materials is composed of a high melting-point metal and an insulating refractory material, said insulating refractory material in said first metallized material being of a different percentage by weight than said second metallized material, said insulating refractory material being no greater than approximately 30 percent by weight for each of said first and second metallized materials.
Claim 5
Dependent Claim
14 words
The wiring apparatus according to claim 1, wherein said high melting-point metal includes molybdenum.
Claim 6
Dependent Claim
14 words
The wiring apparatus according to claim 1, wherein said high melting-point metal includes tungsten.
Claim 7
Dependent Claim
98 words
A multilayer wiring apparatus, comprising: a multilayer substrate including a plurality of laminated layers, said laminated layers formed of an electrically insulative ceramic; a plurality of first wirings forming a pattern and composed of a first metallized material having an electrical resistivity of a first value, said plurality of first wirings being formed on a surface of a first layer; and a plurality of second wirings forming a pattern and composed of a second metallized material having an electrical resistivity of a second value, said plurality of second wirings being formed on a surface of a second layer.
Claim 8
Dependent Claim
98 words
A multilayer wiring apparatus, comprising: a multilayer substrate including a plurality of laminated layers, said laminated layers formed of an electrically insulative ceramic; a plurality of first wirings forming a pattern and composed of a first metallized material having an electrical resistivity of a first value, said plurality of first wirings being formed on a surface of a first layer; and a plurality of second wirings forming a pattern and composed of a second metallized material having an electrical resistivity of a second value, said plurality of second wirings being formed on a surface of a second layer.
Claim 9
Dependent Claim
40 words
The multilayer wiring apparatus according to claim 6, further including a plurality of third wirings, each composed on said first metallized material and said second metallized material, said second metallized material being in electrical contact with said first metallized material.
Claim 10
Dependent Claim
29 words
The multilayer wiring apparatus according to claim 7, wherein said both first metallized material and said second metallized material of the third wirings are formed on a same layer.
Claim 11
Dependent Claim
27 words
The multilayer wiring apparatus according to claim 7, wherein said first metallized material and said second metallized material of the third wirings are formed on different layers.
Claim 12
Dependent Claim
72 words
The multilayer wiring apparatus according to claim 6, wherein each of said first and second metallized materials is composed of a high melting-point metal and a insulating refractory material, said insulating refractory material in said first metallized material being of a different percentage by weight than said second metallized material, said insulating refractory material being no greater than approximately 30 percent by weight for each of said first and second metallized materials.
Claim 13
Dependent Claim
15 words
The multilayer wiring apparatus according to claim 6, wherein said high melting-point metal includes molybdenum.
Claim 14
Dependent Claim
15 words
The multilayer wiring apparatus according to claim 6, wherein said high melting-point metal includes tungsten.
Claim 15
Dependent Claim
18 words
The multilayer wiring apparatus according to claim 6, wherein said ceramic comprises alumina (Al 2 O 3 ).
Claim 16
Dependent Claim
15 words
The multilayer wiring apparatus according to claim 6, wherein said ceramic comprises aluminum nitride (AlN).
Claim 17
Dependent Claim
16 words
The multilayer wiring apparatus according to claim 6, wherein said ceramic comprises tinania (TiO 2 ).
Claim 18
Dependent Claim
14 words
The multilayer wiring apparatus according to claim 6, wherein said ceramic comprises beryllia (BeO).
Claim 19
Dependent Claim
17 words
The wiring apparatus according to claim 1, wherein said ceramic comprises alumina (Al 2 O 3 ).
Claim 20
Dependent Claim
14 words
The wiring apparatus according to claim 1, wherein said ceramic comprises aluminum nitride (AlN).
Claim 21
Dependent Claim
15 words
The wiring apparatus according to claim 1, wherein said ceramic comprises titania (TiO 2 ).
Claim 22
Dependent Claim
13 words
The wiring apparatus according to claim 1, wherein said ceramic comprises beryllia (BeO).
References Cited (Backward Citations)
US3927815A
Cited
JPS59169163A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-21 | 1995-04-22 | 1995-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-21 | 1999-04-22 | 1999-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-21 | 2003-04-22 | 2003-10-22 | $7700.00 | Window Closed / Lapsed |