US5057900A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device and a manufacturing method for the same
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1989-10-05
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Granted: 1991-10-15
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Expires: 2009-10-05
Abstract
Abstract A method for manufacturing a lead frame comprises the steps of covering, with a cover film, a die to which an electronic device is attached and a conducting section of a lead section to be electrically connected to the die, covering the whole of the die and lead section and the cover film with an inorganic protective film, and removing the cover film and the protective film formed over the cover film to partly expose the die and the conducting section for electric connection.
Inventors
- 👤 Shunpei Yamazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:04
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/458; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
57 words
An electronic device comprising: a lead frame; a device proper mounted on the lead frame; wiring for making electrical contacts between said device proper and lead frame; and a package enclosing the lead frame and the device proper, said lead frame being coated with an inorganic film except for said device proper and said wiring electric contacts.
Claim 2
Dependent Claim
57 words
An electronic device comprising: a lead frame; a device proper mounted on the lead frame; wiring for making electrical contacts between said device proper and lead frame; and a package enclosing the lead frame and the device proper, said lead frame being coated with an inorganic film except for said device proper and said wiring electric contacts.
Claim 3
Dependent Claim
26 words
The electronic device of claim 1, wherein said inorganic film is selected from the group of silicon nitride, silicon oxide, silicon carbide and DLC (Diamond-Like Carbon).
Claim 4
Dependent Claim
33 words
A leadframe for mounting a semiconductor chip thereon having a conductive surface, wherein said leadframe is covered with an inorganic film except for a portion on which an electrical contact will be made.
Claim 5
Dependent Claim
33 words
A leadframe for mounting a semiconductor chip thereon having a conductive surface, wherein said leadframe is covered with an inorganic film except for a portion on which an electrical contact will be made.
Claim 6
Dependent Claim
25 words
The leadframe of claim 3 wherein said inorganic film is selected from the group consisting of silicon nitride, silicon oxide, silicon carbide and diamond-like carbon.
References Cited (Backward Citations)
US3644801A
Cited
US4486945A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-14 | 1995-04-15 | 1995-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-14 | 1999-04-15 | 1999-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-14 | 2003-04-15 | 2003-10-15 | $7700.00 | Window Closed / Lapsed |