US5054680A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding electrical conductors
Assignee: Welding Institute England
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Filing: 1990-07-10
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Granted: 1991-10-08
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Expires: 2010-07-10
Abstract
Abstract A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested while connected to the support member and provides it with a conductor lead for connection to a carrier for use.
Inventors
- 👤 Norman R. Stockham
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 11:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/0711; H10W72/50; H10W72/07141; H10W72/07502; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/531; H10W72/533; H10W72/534; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
53 words
A method of bonding an electrical conductor to a contact of an integrated circuit device comprising bonding a conductor to a support member and to a contact of an integrated circuit device; and subsequently severing said bonded conductor to release said integrated circuit device and the bonded conductor from said conductor support member.
Claim 2
Independent Claim
53 words
A method of bonding an electrical conductor to a contact of an integrated circuit device comprising bonding a conductor to a support member and to a contact of an integrated circuit device; and subsequently severing said bonded conductor to release said integrated circuit device and the bonded conductor from said conductor support member.
Claim 3
Dependent Claim
15 words
A method according to claim 1, wherein said integrated circuit device comprises a silicon chip.
Claim 4
Dependent Claim
20 words
A method according to claim 1, wherein said conductor is in the form of one of a wire and ribbon.
Claim 5
Dependent Claim
26 words
A method according to claim 1, wherein said conductor is first bonded to said support member and the free end subsequently joined to said circuit device.
Claim 6
Dependent Claim
20 words
A method according to claim 4, wherein said conductor is broken off beyond the bond with said integrated circuit device.
Claim 7
Dependent Claim
18 words
A method according to claim 1, wherein the bonding steps are carried out using a wedge bonding technique.
Claim 8
Dependent Claim
30 words
A method according to claim 1, wherein the temporary bonds on the support member are reinforced by bonding a cap or lid to entrap said conductor on the support member.
Claim 9
Dependent Claim
17 words
A method according to claim 1, wherein said conductor is in the form of a rectangular ribbon.
Claim 10
Dependent Claim
26 words
A method according to claim 1, wherein subsequent to said severing step, the integrated circuit device is connected to a host device via the severed conductor.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |