Laser induced electrical connection of integrated circuits

Claim 1

A process for electrically connecting an electronic element to a motherboard comprising the steps of: (a) providing a motherboard having an electronic element mounted on the surface thereof, said motherboard having at least one electrical connection site and said electronic element having at least one electrical connection site and having sides which extend upwardly and inwardly away from said surface of said motherboard, wherein said electrical connection site of said motherboard and said electrical connection site of said electronic element are non-planar with respect to each other; (b) applying a sufficient amount of a radiation sensitive metallic conversion compound to said motherboard and electronic element to form a metallic conversion coating extending at least from said motherboard connection site to said electronic element connection site; (c) selectively radiating said metallic conversion coating with a sufficient intensity of radiation at an appropriate wavelength to convert said conversion coating to a metallic electrical connection between said non-planar electrical connection sites on said motherboard and on said electronic element; and (d) removing the unconverted metallic conversion coating surrounding the metallic electrical connection to thereby provide for an electrical connection between said electronic element and said motherboard.