Article comprising a stacked array of electronic subassemblies

Claim 1

An article, comprising: (a) at least two primary substrates, each having two substantially planar, parallel major surfaces which are electrically insulating, each primary substrate incorporating at least one thermally conductive layer, to be referred to as a "thermally conductive member;" (b) means for supporting the primary substrates along a stacking direction, here referred to as "vertical", such that the primary substrates are in a stacked relationship and the major surfaces are substantially perpendicular to the vertical direction; (c) spacer means included between the at least two primary substrates such that the spacer means are in touching contact with a major surface of each of the at least two primary substrates and the primary substrates are separated by a predetermined distance, the spacer means comprising multiple, essentially independent channels for conducting electricity in a substantially vertical direction; (d) impelling means for causing a coolant fluid to pass substantially in the vertical direction through at least a portion of the stack; (e) a pattern of electric conductors formed on at least one major surface of each primary substrate, the conduction pattern overlying the thermally conductive member, such that at least one conductor pattern on a given primary substrate is electrically connected to a conductor pattern on the other primary substrate through at least two independent channels in the spacer means that are included between the primary substrates; and (f) at least two electronic integrated circuits overlying and in electrical contact with each conductor pattern such that at least a portion of the heat generated by the integrated circuits flows into the underlying thermally conductive member, wherein (g) each primary substrate is divided into an interior region and a peripheral region at least partially surrounding the interior region, each conductor pattern overlies a corresponding interior region, and each peripheral region is perforated by a pattern of holes such that heat flowing from integrated circuits into the corresponding thermally conductive member can flow toward the holes; (h) the impelling means cause the coolant fluid to pass through at least some of the holes of each primary substrate; and (i) the predetermined distance between primary substrates is adapted to cooperate with the hole patterns to create turbulence in the coolant flow which enhances thermal contact between the coolant fluid and at least one major surface of each base member, resulting in efficient heat exchange at the major surface.