US5048181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making thick film circuit housing assembly design
Assignee: Visteon Global Technologies Inc
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Filing: 1990-11-19
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Granted: 1991-09-17
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Expires: 2010-11-19
Abstract
Abstract A housing and a pressure seal structure for use with a thick film circuit having a pressure sensor and terminals includes a base plate below the thick film circuit, a top housing above the thick film circuit covering the pressure sensor and an intermediate rubber ring between the housing and the thick film circuit. A coupling force is applied between the base plate and the top housing to draw the two together and apply a sealing force to the rubber ring and establish a pressure seal at the rubber ring.
Inventors
- 👤 Duane M. Grider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:08
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/14; G01L19/142; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0055; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
142 words
A method of fabricating a thick film integrated circuit assembly with a circuit board, a pressure sensor, and an electrical terminal including the steps of: forming a housing with a cavity for receiving the pressure sensor; positioning a sealing ring around the pressure sensor on the thick film circuit board; positioning the housing on the thick film circuit board so the sealing ring is adjacent the periphery of the cavity; positioning the housing on the thick film circuit board so the sealing ring is adjacent the periphery of the cavity; positioning a base plate adjacent the side of the thick film circuit board opposite from the housing; and applying a coupling force between the base plate and the housing so that the housing presses on the sealing ring and forms a pressure seal between the housing and the thick film circuit board.
Claim 2
Independent Claim
142 words
A method of fabricating a thick film integrated circuit assembly with a circuit board, a pressure sensor, and an electrical terminal including the steps of: forming a housing with a cavity for receiving the pressure sensor; positioning a sealing ring around the pressure sensor on the thick film circuit board; positioning the housing on the thick film circuit board so the sealing ring is adjacent the periphery of the cavity; positioning the housing on the thick film circuit board so the sealing ring is adjacent the periphery of the cavity; positioning a base plate adjacent the side of the thick film circuit board opposite from the housing; and applying a coupling force between the base plate and the housing so that the housing presses on the sealing ring and forms a pressure seal between the housing and the thick film circuit board.
Claim 3
Dependent Claim
95 words
A method of fabricating a thick film integrated circuit assembly as recited in claim 1 further comprising the steps of: forming a tapered terminal guide opening in the housing; forming a tapered guide bar coupled to the electrical terminal, the tapered guide bar and the guide opening cooperating so as to provide a self-centering force; and wherein the step of positioning the housing and applying a coupling force includes guiding the tapered guide bar into the tapered terminal guide opening so as to provide a self-centering action for the terminal with respect to the housing.
Claim 4
Dependent Claim
32 words
A method of fabricating a thick film integrated circuit assembly as recited in claim 2 wherein said step of applying a coupling force includes screwing the base plate and the housing together.
Claim 5
Independent Claim
159 words
A method of fabricating a thick film integrated circuit having a thick film circuit board and a self-centering terminal including the steps of: forming a terminal row having a plurality of parallel legs each having an angled foot portion for connection to said thick film circuit board; forming a longitudinal tie bar extending perpendicular to the legs and connecting the legs to each other for stabilization; connecting the terminal to said thick film circuit board at the same time other components are connected to the thick film circuit board; forming a self-centering terminal by forming a tapered base around the base of said terminal, said base tapering towards said terminal termination; forming a tapering receiving opening in a connector shell around said thick film integrated circuit for receiving said tapered base of said terminal; and forming a pressure cavity in the connector shell for providing pressure isolation around a portion of the surface of the thick film integrated circuit.
Claim 6
Independent Claim
159 words
A method of fabricating a thick film integrated circuit having a thick film circuit board and a self-centering terminal including the steps of: forming a terminal row having a plurality of parallel legs each having an angled foot portion for connection to said thick film circuit board; forming a longitudinal tie bar extending perpendicular to the legs and connecting the legs to each other for stabilization; connecting the terminal to said thick film circuit board at the same time other components are connected to the thick film circuit board; forming a self-centering terminal by forming a tapered base around the base of said terminal, said base tapering towards said terminal termination; forming a tapering receiving opening in a connector shell around said thick film integrated circuit for receiving said tapered base of said terminal; and forming a pressure cavity in the connector shell for providing pressure isolation around a portion of the surface of the thick film integrated circuit.
Claim 7
Independent Claim
155 words
A method of fabricating a thick film integrated circuit assembly with a thick film circuit board, a pressure sensor and a terminal including the steps of: forming a housing with a first cavity for receiving the pressure sensor and a second cavity with tapered sides for receiving the terminal; positioning the housing adjacent a first side of the circuit board; positioning a guide bar with tapered sides around the terminal for cooperating with the second cavity to position the terminal with respect to the housing; positioning a sealing ring around the pressure sensor on the thick film circuit, so as to surround the opening of the first cavity; positioning a base plate adjacent the second side of the circuit board; and applying a coupling force between the base plate and the housing so that the housing presses on the sealing ring and forms a pressure seal between the housing and the thick film circuit board.
Claim 8
Independent Claim
155 words
A method of fabricating a thick film integrated circuit assembly with a thick film circuit board, a pressure sensor and a terminal including the steps of: forming a housing with a first cavity for receiving the pressure sensor and a second cavity with tapered sides for receiving the terminal; positioning the housing adjacent a first side of the circuit board; positioning a guide bar with tapered sides around the terminal for cooperating with the second cavity to position the terminal with respect to the housing; positioning a sealing ring around the pressure sensor on the thick film circuit, so as to surround the opening of the first cavity; positioning a base plate adjacent the second side of the circuit board; and applying a coupling force between the base plate and the housing so that the housing presses on the sealing ring and forms a pressure seal between the housing and the thick film circuit board.
Claim 9
Dependent Claim
55 words
A method of fabricating a thick film integrated circuit assembly as recited in claim 5 further including the steps of: fitting the thick film circuit to the housing so that the thick film circuit is supported by the housing; and supporting the base plate by the combination of the housing and the thick film circuit.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-16 | 1995-03-18 | 1995-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-16 | 1999-03-18 | 1999-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-16 | 2003-03-18 | 2003-09-17 | $7700.00 | Window Closed / Lapsed |