Shielded printed circuit board

Claim 2

A shielded circuitry assembly, comprising: a multi-layer circuit board, having: a) a plurality of internal layers, each with a ground plane defined around a perimeter of a wiring surface thereof, each said ground plane having exposed edge surfaces, b) a top layer, adapted to receive electrical components, c) a plurality of tab through-holes, extending through the entire circuit board, including through the internal layers, and the top layer, and in contact with each said ground plane of each said internal layer, d) an edge plating, connecting said exposed edge surfaces of said ground planes to one another, and extending around at least a majority of a perimeter of said multi-layer circuit board, and e) a plurality of component through-holes, extending through the circuit board, enabling connection with wiring traces on the internal layers; and a shielding assembly, coupled to said top layer of said multi-layer circuit board, and having tabs which are located in said tab through-holes and make electrical contact with said each ground layer, said shielding assembly having a perimeter with inner surfaces defining an inner shielded area therewithin, and having a top surface of a similar size to said perimeter for closing said inner shielded area beneath said top surface.

Claim 3

An assembly as in claim 1 wherein said edge plating is formed with breakers breaks, each said break having a length which is substantially a wavelength of an operating frequency divided by four.

Claim 4

An assembly as in claim 1 wherein said top surface has at least one hole therein, said hole enabling communication with circuitry on said top layer.

Claim 5

An assembly as in claim 1, wherein said top surface is integral with said surfaces defining said perimeter.

Claim 6

An assembly as in claim 1 wherein said top surface is attached to said surfaces defining said inner shielded area, and further comprising a conductive substance for attaching said top surface to said perimeter.

Claim 7

An assembly as in claim 5 further comprising a connector, spaced from said shielding assembly, for conducting signals to and from circuitry within said shielding assembly; means for filtering signals from said connector, said filtering means located within said shielded area at a position closest to said connector.

Claim 8

An assembly as in claim 6 wherein said filtering means also includes means for optically isolating said signals from signals within said shielded area.

Claim 9

An assembly as in claim 4, wherein said conducting substance comprises conducting metal tape, and wherein said circuit board also has a surface for accepting circuitry outside of said shielded area.

Claim 10

A shielded circuitry assembly, comprising: a multi-layer circuit board, having: a) a plurality of internal layers, each with a ground plane which has exposed edge surfaces, b) a top layer, adapted to receive electrical components, c) a plurality of tab through-holes, extending through the internal layers, and the top layer, and in contact with each said ground plane of each said internal layer, d) an edge plating, connecting said exposed edge surfaces of said ground planes to one another, and extending around a perimeter of said multi-layer board, and e) a plurality of component through-holes, extending through the circuit boards, enabling connection with wiring traces on the internal layers; and a shielding assembly, including a cover, and coupled to said top layer of said multi-layer circuit board, and having tabs which are located in said tab through-holes and make electrical contact with said each ground layer, said shielding assembly having a perimeter with inner surfaces defining an inner shielded area therewithin, a top portion of said perimeter forming a cover receiving surface, extending around said perimeter and facing upwards, and including a top surface, coupled to said cover receiving surface an biased thereagainst and means for connecting said cover to said cover receiving surface said means being electrically conductive.

Claim 11

A shielded circuitry assembly, comprising: a multi-layer circuit board, having: a) a plurality of internal layers, each with a ground plane which has exposed edge surfaces, b) a top layer, adapted to receive electrical components, c) a plurality of tab through-holes, extending through the internal layers, and the top layer, and in contact with each said ground plane of each said internal layer, d) an edge plating, connecting said exposed edge surfaces of said ground planes to one another, and extending around a perimeter of said multi-layer board, and e) a plurality of component through-holes, extending through the circuit boards, enabling connection with wiring traces on the internal layers; and a shielding assembly, including a cover, and coupled to said top layer of said multi-layer circuit board, and having tabs which are located in said tab through-holes and make electrical contact with said each ground layer, said shielding assembly having a perimeter with inner surfaces defining an inner shielded area therewithin, a top portion of said perimeter forming a cover receiving surface, extending around said perimeter and facing upwards, and including a top surface, coupled to said cover receiving surface an biased thereagainst and means for connecting said cover to said cover receiving surface said means being electrically conductive.

Claim 12

An assembly as in claim 9 wherein said edge plating is formed with breakers breaks, each said break having a length which is substantially a wavelength of an operating frequency divided by four.

Claim 13

An assembly as in claim 9 wherein said top surface is formed with at least one hole therein, said hole enabling communication with circuitry on said top layer.

Claim 14

An assembly as in claim 9 wherein said connecting means is formed of conducting metal tape.

Claim 15

An assembly as in claim 9 further comprising a connector, spaced from said shielding assembly, for conducting signals to and from circuitry within said shielding assembly.

Claim 16

An assembly as in claim 13 further comprising means for filtering signals from said connector, said filtering means located within said shielded area at a position closest to said connector.

Claim 17

An assembly as in claim 14 wherein said filtering means also includes means for optically isolating said signals from signals within said shielded area.

Claim 18

An assembly as in claim 15 wherein said circuit board also has a surface for accepting circuitry outside of said shielded area.

Claim 19

A shielded multi-layer circuit board, comprising: a) a plurality of internal layers, each with a ground plane defined around a perimeter of a wiring surface thereof, each said ground plane having exposed edge surfaces, b) a top layer, adapted to receive electrical components, c) a plurality of tab through-holes, formed through the entire circuit board, including through the internal layers, and the top layer, and each tab through-hole in contact with each said ground plane of each said internal layer, d) an edge plating, connecting said exposed edge surfaces of said ground planes to one another, and extending around a perimeter of said multi-layer board, and e) a plurality of component through-holes, formed through the circuit board, enabling connection with wiring traces on the internal layers; and a shielding assembly, coupled to said top layer of said multi-layer circuit board, and having tabs which are located in said tab through-holes and make electrical contact with said each ground layer, said shielding assembly having a perimeter with inner surfaces defining an inner shielded area therewithin.

Claim 20

A shielded multi-layer circuit board, comprising: a) a plurality of internal layers, each with a ground plane defined around a perimeter of a wiring surface thereof, each said ground plane having exposed edge surfaces, b) a top layer, adapted to receive electrical components, c) a plurality of tab through-holes, formed through the entire circuit board, including through the internal layers, and the top layer, and each tab through-hole in contact with each said ground plane of each said internal layer, d) an edge plating, connecting said exposed edge surfaces of said ground planes to one another, and extending around a perimeter of said multi-layer board, and e) a plurality of component through-holes, formed through the circuit board, enabling connection with wiring traces on the internal layers; and a shielding assembly, coupled to said top layer of said multi-layer circuit board, and having tabs which are located in said tab through-holes and make electrical contact with said each ground layer, said shielding assembly having a perimeter with inner surfaces defining an inner shielded area therewithin.