Abstract A surface grinding machine comprises a wheel head vertically movably supported; a cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of the wheel head and having an abrasive grain layer of Young's modulus (10-15)×10 4 kgf/cm 2 at the lower end of the wheel; a wheel shaft driving motor for rotating the cup-shaped diamond wheel supported by the wheel head; a servomotor for vertically moving the wheel head; a suitable number of chuck tables for fixing the surface of a III-V group compound semiconductor wafer on which elements have been fabricated; an index table for rotatably supporting the chuck tables; a chuck table driving motor for turning the chuck tables; a main shaft motor current analysis circuit for detecting the current value of the wheel shaft driving motor; a main shaft rotation number analysis circuit for detecting the number of rotations of the wheel shaft driving motor, and a feed speed control circuit for controlling the serevomotor in such a manner as to decrease the feed speed when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
A surface grinding machine, comprising: at least one wheel head supported movably in the vertical direction; at least one cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of said wheel head, said diamond wheel having an abrasive grain layer at the lower end of said diamond wheel; at least one wheel shaft driving motor for rotating said cup-shaped wheel, said motor being supported at the other end of said wheel head; at least one servomotor for vertically moving said wheel head; at least one chuck table for fixing a surface of a II-IV group compound semiconductor wafer, predetermined elements being fabricated on said surface; an index table for revolvably supporting said chuck table; a chuck driving table driving motor for turning said chuck table; said surface grinding machine further comprising: a main shaft motor current analysis circuit for detecting the current value of said wheel shaft driving motor a main shaft rotation number analysis circuit for detecting the number of revolutions of said wheel shaft driving motor; and a feed control circuit for controlling said servomotor in such a manner as to decrease, by obtaining grinding resistance from the number of revolutions the feed speed corresponding to a speed at which said wheel head moves down when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
Claim 2
Dependent Claim
237 words
A surface grinding machine, comprising: at least one wheel head supported movably in the vertical direction; at least one cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of said wheel head, said diamond wheel having an abrasive grain layer at the lower end of said diamond wheel; at least one wheel shaft driving motor for rotating said cup-shaped wheel, said motor being supported at the other end of said wheel head; at least one servomotor for vertically moving said wheel head; at least one chuck table for fixing a surface of a II-IV group compound semiconductor wafer, predetermined elements being fabricated on said surface; an index table for revolvably supporting said chuck table; a chuck driving table driving motor for turning said chuck table; said surface grinding machine further comprising: a main shaft motor current analysis circuit for detecting the current value of said wheel shaft driving motor a main shaft rotation number analysis circuit for detecting the number of revolutions of said wheel shaft driving motor; and a feed control circuit for controlling said servomotor in such a manner as to decrease, by obtaining grinding resistance from the number of revolutions the feed speed corresponding to a speed at which said wheel head moves down when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.