Method of mass-producing integrated circuit devices using strip lead frame

Claim 1

A method of mass-producing IC devices comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of types of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns having the same dimensions in said partitions of the same type, separating said respective conductor patterns as individual IC device substrates from said ribbonlike substrate, classifying said IC device substrates according to the types of said conductor patterns, sending said IC device substrates having the same conductor pattern to the same dedicated assembling line, fixing a semiconductor IC die on each said IC device substrate, and wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern.

Claim 2

A method of mass-producing IC devices comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of types of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns having the same dimensions in said partitions of the same type, separating said respective conductor patterns as individual IC device substrates from said ribbonlike substrate, classifying said IC device substrates according to the types of said conductor patterns, sending said IC device substrates having the same conductor pattern to the same dedicated assembling line, fixing a semiconductor IC die on each said IC device substrate, and wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern.

Claim 7

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns of a first type in one of said partitions and forming a plurality of conductor patterns of a second type in at least one of the remaining partitions, separating said respective conductor patterns as individual IC device substrates from said ribbonlike substrate, classifying said IC device substrates according to the types of the conductor patterns, sending said IC device substrates having the conductor patterns of the same type to the same dedicated assembling line, fixing a semiconductor IC die on each said IC device substrate, and wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern.

Claim 8

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns of a first type in one of said partitions and forming a plurality of conductor patterns of a second type in at least one of the remaining partitions, separating said respective conductor patterns as individual IC device substrates from said ribbonlike substrate, classifying said IC device substrates according to the types of the conductor patterns, sending said IC device substrates having the conductor patterns of the same type to the same dedicated assembling line, fixing a semiconductor IC die on each said IC device substrate, and wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern.

Claim 12

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of same conductor patterns in said partitions of the same type, separating said respective partitions from said ribbonlike substrate, classifying said separated partitions according to the types, sending said partitions of the same type to the same dedicated assembling lines, fixing a semiconductor IC die on each of the conductor patterns in each said partition, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating the plurality of conductor patterns in each said partition.

Claim 13

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of same conductor patterns in said partitions of the same type, separating said respective partitions from said ribbonlike substrate, classifying said separated partitions according to the types, sending said partitions of the same type to the same dedicated assembling lines, fixing a semiconductor IC die on each of the conductor patterns in each said partition, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating the plurality of conductor patterns in each said partition.

Claim 17

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns of a first type in one of said partitions and forming a plurality of conductor patterns of a second type in at least one of the remaining partitions, separating said respective partitions from said ribbonlike substrate, classifying said separated partitions into groups according to the types of the conductor patterns, sending said partitions of the same group to the same dedicated assembling line, fixing a semiconductor IC die on each of the conductor patterns in each said partition, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating said plurality of conductor patterns in each said partition.

Claim 18

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming a plurality of conductor patterns of a first type in one of said partitions and forming a plurality of conductor patterns of a second type in at least one of the remaining partitions, separating said respective partitions from said ribbonlike substrate, classifying said separated partitions into groups according to the types of the conductor patterns, sending said partitions of the same group to the same dedicated assembling line, fixing a semiconductor IC die on each of the conductor patterns in each said partition, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating said plurality of conductor patterns in each said partition.

Claim 22

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming conductor patterns of a plurality of types in each said partition in an arrangement following a prescribed order from one of said edge portions, thereby forming a plurality of types of rows of said conductor patterns along the length direction of said ribbonlike substrate, separating said plurality of types of rows and cutting said rows with prescribed lengths to form a plurality of types of strip substrates, the strip substrates of the same type including a plurality of said conductor patterns of only the same type, classifying said strip substrates according to the types, sending said strip substrates of the same type to the same dedicated assembling line, fixing a semiconductor IC die on each of the conductor patterns in each said strip substrate, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating the plurality of conductor patterns in said strip substrate.

Claim 23

A method of mass-producing IC devices, comprising the steps of: forming index holes at prescribed intervals in edge portions of both sides of a ribbonlike insulating substrate along its length direction, said index holes defining a plurality of partitions crossing said ribbonlike substrate in its width direction, forming conductor patterns of a plurality of types in each said partition in an arrangement following a prescribed order from one of said edge portions, thereby forming a plurality of types of rows of said conductor patterns along the length direction of said ribbonlike substrate, separating said plurality of types of rows and cutting said rows with prescribed lengths to form a plurality of types of strip substrates, the strip substrates of the same type including a plurality of said conductor patterns of only the same type, classifying said strip substrates according to the types, sending said strip substrates of the same type to the same dedicated assembling line, fixing a semiconductor IC die on each of the conductor patterns in each said strip substrate, wire-bonding an electrode on said semiconductor IC die to corresponding conductors in said conductor pattern, and thereafter separating the plurality of conductor patterns in said strip substrate.