US5031022A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film carrier for mounting IC chips
Assignee: Towa Corp
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Filing: 1990-04-27
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Granted: 1991-07-09
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Expires: 2010-04-27
Abstract
Abstract An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.
Inventors
- 👤 Toshio Yamamoto
- 👤 Tamio Saito
- 👤 Naoharu Ohikata
- 👤 Jiro Ohno
- 👤 Michio Osada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:07
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/453
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
95 words
A film carrier for mounting an IC chip, comprising: an insulation film; a plurality of conductive leads formed on said insulation film, each of said conductive leads having an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a terminal of a mounting material; and an embankment made of insulation material and formed on or in the vicinity of the outer lead portions of said conductive leads to prevent an oozing of resin when the IC chip is sealed with a resin.
Claim 2
Dependent Claim
95 words
A film carrier for mounting an IC chip, comprising: an insulation film; a plurality of conductive leads formed on said insulation film, each of said conductive leads having an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a terminal of a mounting material; and an embankment made of insulation material and formed on or in the vicinity of the outer lead portions of said conductive leads to prevent an oozing of resin when the IC chip is sealed with a resin.
Claim 3
Dependent Claim
28 words
A film carrier as claimed in claim 1, wherein said embankment extends intermittently around the periphery of said IC chip on the outer portions of said conductive leads.
Claim 4
Dependent Claim
30 words
A film carrier as claimed in claim 1, wherein said embankment extends continuously around the entire periphery of said IC chip on the outer lead portions of said conductive leads.
Claim 5
Dependent Claim
30 words
A film carrier as claimed in claim 1, wherein said embankment is spaced outwardly of the resin on the IC chip on the outer lead portions of said conductive leads.
Claim 6
Dependent Claim
25 words
A film carrier as claimed in claim 1, wherein said embankment is formed on both the top and bottom sides of the outer lead portions.
Claim 7
Dependent Claim
45 words
A film carrier as claimed in claim 5, wherein said embankment has a bottom part formed at the same time as a support ring for supporting said conductive leads is formed, and a top part formed on the top side of the outer lead portions.
Claim 8
Dependent Claim
22 words
A film carrier as claimed in claim 5, wherein said embankment is formed independently of a support ring for supporting said leads.
Claim 9
Dependent Claim
21 words
A film carrier as claimed in claim 6, wherein said embankment is made of the same material as the support ring.
Claim 10
Dependent Claim
20 words
A film carrier as claimed in claim 7, wherein said embankment is made of different material from the support ring.
Claim 11
Dependent Claim
101 words
A film carrier for mounting an IC chip, comprising: an insulation film; a plurality of conductive leads formed on said insulation film, each of said conductive leads having an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a terminal of a mounting material; and ooze preventing means, made of an insulation material and formed on or in the vicinity of the outer lead portions of said conductive leads, for preventing an oozing of resin out from between leads when the IC chip is sealed with a resin.
Claim 12
Dependent Claim
101 words
A film carrier for mounting an IC chip, comprising: an insulation film; a plurality of conductive leads formed on said insulation film, each of said conductive leads having an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a terminal of a mounting material; and ooze preventing means, made of an insulation material and formed on or in the vicinity of the outer lead portions of said conductive leads, for preventing an oozing of resin out from between leads when the IC chip is sealed with a resin.
Claim 13
Dependent Claim
31 words
A film carrier as claimed in claim 10, wherein said ooze preventing means extends intermittently around the periphery of the IC chip on the outer lead portions of said conductive leads.
Claim 14
Dependent Claim
32 words
A film carrier as claimed in claim 10, wherein said ooze preventing means extends continuously around the entire periphery of said IC chip on the outer lead portions of said conductive leads.
Claim 15
Dependent Claim
32 words
A film carrier as claimed in claim 10, wherein said ooze preventing means is spaced outwardly of the resin on the IC chip on the outer lead portions of said conductive leads.
Claim 16
Dependent Claim
27 words
A film carrier as claimed in claim 10, wherein said ooze preventing means is formed on both the top and bottom sides of the outer lead portions.
Claim 17
Dependent Claim
47 words
A film carrier as claimed in claim 14, wherein said ooze preventing means has a bottom part formed at the same time as a support ring for supporting said conductive leads is formed, and a top part formed on the top side of the outer lead portions.
Claim 18
Dependent Claim
24 words
A film carrier as claimed in claim 14, wherein said ooze preventing means is formed independently of a support ring for supporting said leads.
Claim 19
Dependent Claim
23 words
A film carrier as claimed in claim 15, wherein said ooze preventing means is made of the same material as the support ring.
Claim 20
Dependent Claim
22 words
A film carrier as claimed in claim 16, wherein said ooze preventing means is made of different material from the support ring.
References Cited (Backward Citations)
US4218701A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-08 | 1995-01-07 | 1995-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-08 | 1999-01-07 | 1999-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-08 | 2003-01-07 | 2003-07-09 | $7700.00 | Window Closed / Lapsed |