Abstract A method of forming digit lines on a semiconductor wafer having integrated circuits comprises the following consecutive steps: selectively processing the wafer to produce a desired array of dynamic random access memory cells having associated word lines and exposed active areas, the word lines being defined by electrically conductive regions comprised of a polysilicon/high conductive material sandwich structure and having side and top electrically insulated regions comprised of oxide; providing a layer of doped epitaxial monocrystalline silicon atop exposed active areas to a height which is below the uppermost portions of the electrically insulated regions atop the word lines, and above the height of the uppermost portions of the word line electrically conductive regions; providing a layer of electrically insulating oxide atop the wafer, the electrically insulating layer having a lowest point which is higher than the height of the doped epitaxial silicon layer; planarizing the electrically insulating layer by removing electrically insulating material to provide a substantially planar upper layer of electrically insulating material at a height which is substantially coincident with a common height of the uppermost portions of the tops of the electrically insulated regions of the word lines; etching vias into the electrically insulating layer which generally align with doped epitaxial silicon; depositing an electrically conductive doped polysilicon layer atop the planarized and etched electrically insulating oxide layer; and etching the doped polysilicon layer to form desired substantially planar digit lines.
A method of forming digit lines on a semiconductor wafer having integrated circuits, the method comprising the following consecutive steps: selectively processing the wafer to produce a desired array of dynamic random access memory cells having associated word lines and having exposed active areas, the word lines being defined by electrically conductive regions comprised of a polysilicon/high conductive material sandwich structure and having side and top electrically insulated regions comprised of oxide; providing a layer of doped epitaxial monocrystalline silicon atop exposed active areas to a height which is everywhere below the uppermost portions of the electrically insulated regions atop the word lines, and everywhere above the height of the uppermost portions of the word line electrically conductive regions; providing a layer of an electrically insulating oxide atop the wafer, the electrically insulating layer having a lowest height which is higher than the height of the doped epitaxial silicon layer; planarizing the electrically insulating layer by removing electrically insulating material to provide a substantially planar upper layer of electrically insulating material at a height which is substantially coincident with a common height of the uppermost portions of the tops of the electrically insulated regions of the word lines; etching vias into the electrically insulating layer which generally align with doped epitaxial silicon; depositing an electrically conductive doped polysilicon layer atop the planarized and etched electrically insulating oxide layer; and etching the doped polysilicon layer to form desired substantially planar digit lines.
Claim 2
Independent Claim
241 words
A method of forming digit lines on a semiconductor wafer having integrated circuits, the method comprising the following consecutive steps: selectively processing the wafer to produce a desired array of dynamic random access memory cells having associated word lines and having exposed active areas, the word lines being defined by electrically conductive regions comprised of a polysilicon/high conductive material sandwich structure and having side and top electrically insulated regions comprised of oxide; providing a layer of doped epitaxial monocrystalline silicon atop exposed active areas to a height which is everywhere below the uppermost portions of the electrically insulated regions atop the word lines, and everywhere above the height of the uppermost portions of the word line electrically conductive regions; providing a layer of an electrically insulating oxide atop the wafer, the electrically insulating layer having a lowest height which is higher than the height of the doped epitaxial silicon layer; planarizing the electrically insulating layer by removing electrically insulating material to provide a substantially planar upper layer of electrically insulating material at a height which is substantially coincident with a common height of the uppermost portions of the tops of the electrically insulated regions of the word lines; etching vias into the electrically insulating layer which generally align with doped epitaxial silicon; depositing an electrically conductive doped polysilicon layer atop the planarized and etched electrically insulating oxide layer; and etching the doped polysilicon layer to form desired substantially planar digit lines.