US5022035A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser device
Assignee: Mitsubishi Electric Corp
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Filing: 1990-02-13
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Granted: 1991-06-04
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Expires: 2010-02-13
Abstract
Abstract A semiconductor laser device includes a heat sink having a plurality of element mounting portions, each having an element mounting surface and an insulator separating the element mounting portions from each other. A semiconductor laser element is arranged on each element mounting surface and a corresponding light receiving element for each laser element is disposed for monitoring the emitted laser light. External control circuits for adjusting the laser outputs of the respective laser elements are located outside the laser device package.
Inventors
- 👤 Kazuyoshi Hasegawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:27
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/02208; H01S5/02212; H01S5/06; H01S5/068; H01S5/0683; H01S5/40; H01S5/4025; H01S5/4031; H01S5/4043
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
102 words
A semiconductor laser device comprising: a laminated heat sink comprising at least two electrically conductive element mounting portions, each element mounting portion having an element mounting surface, and an electrical and thermal insulator electrically and thermally isolating the element mounting portions from each other, said element mounting portions being laminated with said electrical and thermal insulator therebetween; a semiconductor laser element mounted to each of the element mounting surfaces; and a light receiving element corresponding to each laser element for monitoring light emitted by the respective laser element disposed proximate the element mounting surface on which the corresponding laser element is mounted.
Claim 2
Dependent Claim
102 words
A semiconductor laser device comprising: a laminated heat sink comprising at least two electrically conductive element mounting portions, each element mounting portion having an element mounting surface, and an electrical and thermal insulator electrically and thermally isolating the element mounting portions from each other, said element mounting portions being laminated with said electrical and thermal insulator therebetween; a semiconductor laser element mounted to each of the element mounting surfaces; and a light receiving element corresponding to each laser element for monitoring light emitted by the respective laser element disposed proximate the element mounting surface on which the corresponding laser element is mounted.
Claim 3
Dependent Claim
42 words
A semiconductor laser device as defined in claim 1 wherein said element mounting portions of said heat sink are selected from the group consisting of silver, copper, and iron, and said insulator is selected from the group consisting of alumina and quartz.
Claim 4
Dependent Claim
54 words
A semiconductor laser device as defined in claim 1 including a stem including a base and a plurality of mutually electrically isolated terminals passing through the base wherein the heat sink and light receiving elements are mounted on the base and the laser element and light receiving elements are electrically connected to respective terminals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-03 | 1994-12-03 | 1995-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-03 | 1998-12-03 | 1999-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-03 | 2002-12-03 | 2003-06-04 | $7700.00 | Window Closed / Lapsed |