Injection molding die apparatus for use in the production of substrate of optical disk

Claim 1

An injection molding die apparatus comprising: a stationary die part having a mirror-finished surface; a movable die part movable in an axial direction towards and away from said stationary die part and provided with a stamper fixed thereto; an outer peripheral ring having one end axially slidably fitting around the outer periphery of said movable die part, said outer peripheral ring being capable of making contact at its other end with said stationary die part when said movable die part has been moved close to said stationary die part, so as to form a die cavity in cooperation with said mirror-finished surface of said stationary die plate and said stamper on said movable die part, said die cavity being capable of receiving a molten plastic material injected thereto so that an optical disk substrate is formed by injection molding; a first ejection mechanism including a rod member extending through the center of said movable die part and through the center of said stamper such that the end of said rod serves as a portion of said stamper defining said cavity, said first ejection mechanism further including an actuating means for causing said rod member to project from said stamper in the axial direction; and a second ejection mechanism including pins fixed to said outer peripheral ring and projected towards said movable die part and elastic members supported by said movable die part and positioned to press said pins against said outer peripheral ring to urge the ring towards said stationary die part in the axial direction through said pins; wherein, when said movable die part is moved away from said stationary die part after the injection molding, the end of said rod member of said movable die part is projected from said stamper so as to separate the central portion of said optical disk substrate which is held in close contact with said mirror-finished surface of said stationary die part and, at the same time, said outer peripheral ring is caused to move relative to said movable die part so as to be kept in contact with said stationary die part thereby to separate the outer peripheral portion of said optical disk substrate from said stamper.