Low temperature Michael addition reactions

Claim 1

A process for the alkylation of β-dicarbonyl compounds having the structure formula: ##STR9## wherein R is selected from the group consisting of H, hydrocarbyl moieties, and substituted hydrocarbyl moieties; with the proviso that no R-group is sufficiently acidic to neutralize the base catalyst employed for said alkylation; and X is selected from the group consisting of OR, NR 2 , CR 3 , aromatic or substituted aromatic moieties having 6 to 10 carbon atoms, and polymeric moieties with an α,β-unsaturated compound having the structural formula: ##STR10## wherein R' is H, methyl, CN acetyl, or --CO 2 R; wherein R is as defined above; R" is selected from the group consisting of H, methyl, methoxy, ethoxy, and --CO 2 R; wherein R is as defined above; and X' is selected from the group consisting of OR, NR 2 and CR 3 ; wherein R is as defined above; C 1 -C 20 alkyl or substituted alkyl; C 6 -C 10 aryl or substituted aryl; and a polymeric moiety with the proviso that no group R', R", X or X' is sufficiently acidic to neutralize the base catalyst employed for said alkylation; said process comprising contacting said β-dicarbonyl compound and said α,β-unsaturated compound in the presence of at least one base selected from the group consisting of compounds having the structural formula: ##STR11## wherein R 1 ═C 1 -C 20 alkyl, aryl, aralkyl or alkaryl moiety; R 2 , R 3 and R 4 are each independently selected from H, C 1 -C 20 alkyl or aralkyl, wherein any two or more of R 1 , R 2 , R 3 and R 4 can be interconnected as part of a ring structure; and ##STR12## wherein each of R 5 -R 9 are independently selected from H, C 1 -C 20 alkyl or aralkyl, wherein any two or more of R 5 -R 9 can be interconnected as part of a ring structure wherein said contacting results in crosslinking of a thermoset material comprising said β-dicarbonyl compound and said α,β-unsaturated compound and wherein said thermoset material is first applied to a substrate and subjected to a preliminary curing at a temperature in the range of 10°-40° C., followed by a second curing treatment at a temperature in the range of 40°-120° C.