US5017236A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High frequency sonic substrate processing module
Assignee: Tel Manufacturing and Engineering of America Inc
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Filing: 1989-08-21
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Granted: 1991-05-21
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Expires: 2009-08-21
Abstract
Abstract A single substrate high frequency sonic processing module uses a substrate chamber dimensionally sized to the substrate for immersing the substrate in processing solution. Sonic wave permeable membranes form two ends of the substrate chamber along a sonic wave path therethrough. A sonic wave generated by a transducer external to the substrate chamber, travels through sonic wave conducting liquid in contact with the first membrane, external to the substrate chamber. The liquid is shaped by a sonic wave guide of continuously diminishing cross sectional area along the sonic wave path therethrough, thus intensifying and concentrating the sonic wave entering the substrate chamber. The sonic wave passes through the second membrane to a sonic absorbing and dissipating ante chamber. A method for sonic processing of substrates is disclosed. The individual sonic processing modules are combined into a single system for simultaneously processing plural substrates. The minimal sized substrate chamber provides effective processing with minimal processing solution, minimizing cost and disposal. The shaped wave guide concentrates and intensifies the sonic wave guide to provide enhanced processing.
Inventors
- 👤 Sherman U. Moxness
- 👤 Robert W. Grant
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:23
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0404; B; B08; B08B; B08B3/00; B08B3/04; B08B3/10; B08B3/12; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
167 words
A sonic processing module for processing a substrate comprising: a substrate chamber for maintaining a substrate immersed in liquid processing solution, said chamber minimally sized to the dimensions of the substrate, and said substrate chamber provided with first and second sonic wave permeable membranes forming first and second ends of said chamber along a sonic wave path through said chamber; means exterior to said substrate chamber for generating a sonic wave through a sonic wave conducting liquid medium, said liquid medium being in contact with the first membrane exterior to the substrate chamber, and said liquid medium shaped by a sonic wave guide to intensify and concentrate the sonic wave, said sonic wave being transmitted through said liquid medium and said first membrane to provide sonic excitation to said processing solution to enhance processing of said substrate in the substrate chamber; and means exterior to said substrate chamber in contact with the second membrane for absorbing and dissipating said sonic wave after passing through said second membrane.
Claim 2
Dependent Claim
167 words
A sonic processing module for processing a substrate comprising: a substrate chamber for maintaining a substrate immersed in liquid processing solution, said chamber minimally sized to the dimensions of the substrate, and said substrate chamber provided with first and second sonic wave permeable membranes forming first and second ends of said chamber along a sonic wave path through said chamber; means exterior to said substrate chamber for generating a sonic wave through a sonic wave conducting liquid medium, said liquid medium being in contact with the first membrane exterior to the substrate chamber, and said liquid medium shaped by a sonic wave guide to intensify and concentrate the sonic wave, said sonic wave being transmitted through said liquid medium and said first membrane to provide sonic excitation to said processing solution to enhance processing of said substrate in the substrate chamber; and means exterior to said substrate chamber in contact with the second membrane for absorbing and dissipating said sonic wave after passing through said second membrane.
Claim 3
Dependent Claim
31 words
A sonic processing module according to claim 1, wherein the sonic wave guide is of continuously diminishing cross sectional area along the length thereof and along the sonic wave path therethrough.
Claim 4
Dependent Claim
16 words
A sonic processing module according to claim 2, wherein the sonic wave guide is funnel shaped.
Claim 5
Dependent Claim
37 words
A sonic processing module according to claim 1, wherein the chamber is also of diminishing cross sectional area along the length thereof and along the sonic wave path therethrough to further intensify and concentrate the sonic wave.
Claim 6
Dependent Claim
34 words
A sonic processing module according to claim 1, wherein the substrate is a single wafer maintained within the substrate chamber so that the sonic wave travels across essentially the entire diameter of the wafer.
Claim 7
Dependent Claim
34 words
A sonic processing module according to claim 1, wherein the substrate chamber is further provided with liquid ports for flowing liquid processing solution therethrough so as to minimize gas bubble retention in the chamber.
Claim 8
Dependent Claim
15 words
A sonic processing module according to claim 1, wherein the membranes are formed of fluoropolymer.
Claim 9
Dependent Claim
25 words
A sonic processing module according to claim 1, wherein the sonic wave absorbing and dissipating means is sonic wave absorbing media in an aqueous environment.
Claim 10
Dependent Claim
19 words
A sonic processing module according to claim 8, wherein the sonic wave absorbing media are beads, fibers or brushes.
Claim 11
Dependent Claim
21 words
A sonic processing module according to claim 1, wherein the means for generating a sonic wave is a ceramic transducer array.
Claim 12
Dependent Claim
49 words
A sonic processing module according to claim 10, wherein the frequency of the sonic wave generated by the transducer array is in the range of 600 to 2000 kilohertz and is concentrated and intensified by the wave guide to 5 to 15 times the wattage density from the transducer.
Claim 13
Dependent Claim
16 words
A sonic processing module according to claim 11, wherein sonic wave frequency is about 800 kilohertz.
Claim 14
Dependent Claim
36 words
A sonic processing module according to claim 2, wherein the substrate chamber is maintained at a temperature within the range of 20° to 100° C. and a pressure within the range of 2 to 30 psia.
Claim 15
Dependent Claim
35 words
A sonic processing module according to claim 1, wherein the module is cooled by circulating cooling fluid exterior to the module to maintain the temperature therein within the range of 0 to 100 degrees C.
Claim 16
Dependent Claim
18 words
A sonic processing module according to claim 1, wherein the processing is cleaning with standard liquid cleaning media.
Claim 17
Independent Claim
141 words
A method for sonic processing of a substrate comprising: immersing the substrate in liquid processing solution maintained in a substrate chamber, said chamber closely sized to the dimensions of the substrate, and said chamber provided with first and second sonic wave permeable membranes forming first and second ends of said chamber along a sonic wave path through said chamber; applying sonic wave energy to the liquid processing solution and the substrate therein from a sonic wave generating means external to said chamber, by directing said wave energy through a sonic wave conducting liquid medium, said liquid medium being in contact with the first membrane exterior to the substrate chamber, and said liquid medium shaped by a sonic wave guide to intensify and concentrate the sonic wave; and absorbing and dissipating said sonic wave energy exiting said chamber through said second membrane.
Claim 18
Independent Claim
141 words
A method for sonic processing of a substrate comprising: immersing the substrate in liquid processing solution maintained in a substrate chamber, said chamber closely sized to the dimensions of the substrate, and said chamber provided with first and second sonic wave permeable membranes forming first and second ends of said chamber along a sonic wave path through said chamber; applying sonic wave energy to the liquid processing solution and the substrate therein from a sonic wave generating means external to said chamber, by directing said wave energy through a sonic wave conducting liquid medium, said liquid medium being in contact with the first membrane exterior to the substrate chamber, and said liquid medium shaped by a sonic wave guide to intensify and concentrate the sonic wave; and absorbing and dissipating said sonic wave energy exiting said chamber through said second membrane.
Claim 19
Dependent Claim
35 words
A sonic processing method according to claim 16, wherein the substrate is a single wafer maintained within the substrate chamber so that the sonic wave travels across essentially the entire diameter of the wafer surface.
Claim 20
Dependent Claim
31 words
A sonic processing method according to claim 16, wherein the sonic wave guide is of continuously diminishing cross sectional area along the length thereof and along the sonic wave path therethrough.
Claim 21
Dependent Claim
16 words
A sonic processing method according to claim 16, wherein the sonic wave guide is funnel shaped.
Claim 22
Dependent Claim
37 words
A sonic processing method according to claim 19, wherein the chamber is also of diminishing cross sectional area along the length thereof and along the sonic wave path therethrough to further intensify and concentrate the sonic wave.
Claim 23
Dependent Claim
33 words
A sonic processing method according to claim 16, wherein the substrate chamber is further provided with means for flowing liquid processing solution therethrough so as to minimize gas bubble retention in the chamber.
Claim 24
Dependent Claim
15 words
A sonic processing method according to claim 16, wherein the membranes are formed of fluoropolymer.
Claim 25
Dependent Claim
27 words
A sonic processing method according to claim 16, wherein the means for absorbing and dissipating the sonic wave is sonic wave absorbing media in an aqueous environment.
Claim 26
Dependent Claim
19 words
A sonic processing method according to claim 23, wherein the sonic wave absorbing media are beads, fibers or brushes.
Claim 27
Dependent Claim
20 words
A sonic processing method according to claim 16, wherein the means for generating a sonic wave is ceramic transducer array.
Claim 28
Dependent Claim
49 words
A sonic processing method according to claim 25, wherein the frequency of the sonic wave generated by the transducer array is in the range of 600 to 2000 kilohertz and is concentrated and intensified by the wave guide to 5 to 15 times the wattage density from the transducer.
Claim 29
Dependent Claim
16 words
A sonic processing method according to claim 26, wherein sonic wave frequency is about 800 kilohertz.
Claim 30
Dependent Claim
37 words
A sonic processing method according to claim 16, wherein the substrate chamber is maintained at a temperature within the range of 20° to 100° degrees C. and a pressure within the range of 2 to 30 psia.
Claim 31
Dependent Claim
35 words
A sonic processing method according to claim 16, wherein the module is cooled by circulating cooling fluid exterior to the module to maintain the temperature therein within the range of 0 to 100 degrees C.
Claim 32
Dependent Claim
18 words
A sonic processing method according to claim 16, wherein the processing is cleaning with standard liquid cleaning media.
Claim 33
Dependent Claim
25 words
A sonic processing system comprising a plurality of modules as described and claimed in claim 1, to provide simultaneous processing of a plurality of substrates.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-20 | 1994-11-19 | 1995-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-20 | 1998-11-19 | 1999-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-20 | 2002-11-19 | 2003-05-21 | $7700.00 | Window Closed / Lapsed |