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US5015314A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for production of ceramic circuit board

Assignee: Fujitsu Ltd
•
Filing: 1990-01-19
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Granted: 1991-05-14
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Expires: 2010-01-19
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Abstract

Abstract A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition. The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.

Inventors

  • 👤 Hitoshi Suzuki
  • 👤 Hiromitsu Yokoyama
  • 👤 Mineharu Tsukada
  • 👤 Hiromi Ogawa
  • 👤 Nobuo Kamehara
  • 👤 Koichi Niwa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 00:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H01; H01B; H01B1/00; H01B1/14; H01B1/16

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 111 words
A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on at least one ceramic base plate for the ceramic circuit board and then (ii) firing said ceramic circuit board together with said conductive paste composition printed thereon, said paste composition consisting essentially of (a) a copper powder, (b) a vehicle composed of an organic thermally depolymerizable binder, and (c) 0.5 to 3.5 parts by weight of isopropyl tridodecylbenze sulfonyl titanate and 0.5 to 3.5 parts by weight of isopropyl triisostearoyl titanate, both based on 100 parts by weight of the copper powder.
Claim 2
Independent Claim 111 words
A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on at least one ceramic base plate for the ceramic circuit board and then (ii) firing said ceramic circuit board together with said conductive paste composition printed thereon, said paste composition consisting essentially of (a) a copper powder, (b) a vehicle composed of an organic thermally depolymerizable binder, and (c) 0.5 to 3.5 parts by weight of isopropyl tridodecylbenze sulfonyl titanate and 0.5 to 3.5 parts by weight of isopropyl triisostearoyl titanate, both based on 100 parts by weight of the copper powder.
Claim 3
Dependent Claim 16 words
A method as claimed in claim 1, where said base plate is a ceramic green sheet.
Claim 4
Dependent Claim 24 words
A method as claimed in claim 1, wherein plural ceramic base plates each having the conductive paste composition printed thereon are laminated before firing.

References Cited (Backward Citations)

JPS5874759A Cited
US4504339A Cited
US4503090A Cited
JPS59155988A Cited
US4594181A Cited
EP0177772A2 Cited
US4679320A Cited
US4772346A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-05-13 1994-11-12 1995-05-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-05-13 1998-11-12 1999-05-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-05-13 2002-11-12 2003-05-14 $7700.00 Window Closed / Lapsed

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