US5006575A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Die attach adhesive composition
Assignee: EIDP Inc
•
Filing: 1990-04-26
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Granted: 1991-04-09
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Expires: 2010-04-26
Abstract
Abstract A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.
Inventors
- 👤 Man-Sheung Chan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:41
CPC Classifications
C; C09; C09J; C09J161/00; C09J161/04; C09J161/06; H; H10; H10W; H10W20/00; H10W20/40; C08; C08K; C08K3/00; C08K3/02; C08K3/08; C09J163/00; C09J171/00; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W72/00; H10W72/30; C08L; C08L2666/00; C08L2666/02; C08L2666/14; C08L2666/16; Y; Y10; Y10S; Y10S525/00; Y10S525/93
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
71 words
An adhesive composition for attaching IC chips to high surface energy inorganic substrates comprising: (a) 60-80% by weight of flake silver particles dispersed in (b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°-160° C. and a tensile modulus of at least 1.0×10 5 psi.
Claim 2
Dependent Claim
71 words
An adhesive composition for attaching IC chips to high surface energy inorganic substrates comprising: (a) 60-80% by weight of flake silver particles dispersed in (b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°-160° C. and a tensile modulus of at least 1.0×10 5 psi.
Claim 3
Dependent Claim
15 words
The composition of claim 1 in which component (a) is 65-75% by weight flake silver.
Claim 4
Dependent Claim
16 words
The composition of claim 1 in which the thermally crosslinkable resin is a heat-reactive resole resin.
Claim 5
Dependent Claim
16 words
The composition of claim 1 containing 6 to 2% by weight of the thermally crosslinkable resin.
Claim 6
Dependent Claim
15 words
The composition of claim 1 in which the thermally crosslinkable resin is a melamine-formaldehyde resin.
Claim 7
Dependent Claim
27 words
The composition of claim 1 in which the phenoxy resin corresponds to the structural formula ##STR10## in which X is selected from the group consisting of: ##STR11##
Claim 8
Dependent Claim
10 words
The composition of claim 5 in which X is ##STR12##
Claim 9
Dependent Claim
10 words
The composition of claim 5 in which X is ##STR13##
Claim 10
Dependent Claim
10 words
The composition of claim 5 in which X is ##STR14##
Claim 11
Dependent Claim
16 words
The composition of claim 1 in which the Tg of the polymeric matrix is 100°-120° C.
Claim 12
Dependent Claim
12 words
The composition of claim 1 in the form of a self-supporting ribbon.
Claim 13
Dependent Claim
71 words
A thick film paste composition comprising (a) 60-80% by weight of finely divided flake silver particles dispersed in (b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°-160° C. and a tensile modulus of at least 1.0×10 5 psi dissolved in a nonvolatile organic solvent.
Claim 14
Dependent Claim
71 words
A thick film paste composition comprising (a) 60-80% by weight of finely divided flake silver particles dispersed in (b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°-160° C. and a tensile modulus of at least 1.0×10 5 psi dissolved in a nonvolatile organic solvent.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-08 | 1994-10-08 | 1995-04-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-08 | 1998-10-08 | 1999-04-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-08 | 2002-10-08 | 2003-04-09 | $7700.00 | Window Closed / Lapsed |