US5001591A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film magnetic head
Assignee: TDK Corp
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Filing: 1989-03-17
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Granted: 1991-03-19
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Expires: 2009-03-17
Abstract
Abstract According to the invention, there is provided a laminar magnetic head having bonding pads formed in so many layers and laminated with laminar component devices and circuits so that the surface areas of the bonding pads can be significantly enlarged without altering the arrangement of the lower layers of devices and circuits. Such a design ensures miniaturization and realization of a complex structure of a magnetic head as well as an enhancement of the workability and strength of the lead wires of the head for connection with by simply altering the patter of arrangement of the bonding pads and without significantly altering the production process that can involve a rise of manufacturing cost.
Inventors
- 👤 Keishi Nakashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:34
CPC Classifications
G; G11; G11B; G11B5/00; G11B5/127; G11B5/31; G11B5/3103
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
120 words
A thin film magnetic head comprising: magnetic head circuits including a plurality of devices interconnected by thin film lamination, and having first and second lead terminals; first and second bonding pads formed above said first and second lead terminals, wherein at least one of said bonding pads extends over both of said first and second lead terminals; and an insulator layer interposed between said lead terminals and said bonding pads, said insulator layer including a first opening to permit interconnection of said first bonding pad to one of said first and second lead terminals, and said insulator layer including a second opening to permit interconnection of said second bonding pad to the other of said first and second lead terminals.
Claim 2
Dependent Claim
120 words
A thin film magnetic head comprising: magnetic head circuits including a plurality of devices interconnected by thin film lamination, and having first and second lead terminals; first and second bonding pads formed above said first and second lead terminals, wherein at least one of said bonding pads extends over both of said first and second lead terminals; and an insulator layer interposed between said lead terminals and said bonding pads, said insulator layer including a first opening to permit interconnection of said first bonding pad to one of said first and second lead terminals, and said insulator layer including a second opening to permit interconnection of said second bonding pad to the other of said first and second lead terminals.
Claim 3
Dependent Claim
55 words
A thin film magnetic head as in claim 1, wherein one of said first and second bonding pads includes a portion which extends above said devices, and wherein said thin film magnetic head further includes a second insulator layer interposed between said devices and said portion of said bonding pad which extends above said devices.
References Cited (Backward Citations)
US4219853A
Cited
US4317149A
Cited
US4405960A
Cited
US4809103A
Cited
US4759118A
Cited
US4800454A
Cited
US4823205A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-18 | 1994-09-17 | 1995-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-18 | 1998-09-17 | 1999-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-18 | 2002-09-17 | 2003-03-19 | $7700.00 | Window Closed / Lapsed |