US4994938A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting of high density components on substrate
Assignee: Texas Instruments Inc
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Filing: 1988-12-28
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Granted: 1991-02-19
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Expires: 2008-12-28
Abstract
Abstract A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having bonding pads plated through the opening and fixed on the opposite sidewalls of the opening. The electrical component becomes placed in the the opening with solder paste between the bonding pads and end terminals of the electrical component. Reflow soldering techniques melt the solder paste into solder filets that solidify to fasten the electrical component within the opening in coplanar with the median plane or thickness of the board.
Inventors
- 👤 Daniel A. Baudouin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/184; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K2201/09818; H05K2201/09981; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K3/40; H05K3/403; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
189 words
A printed circuit card assembly comprising: A. a substrate of insulating material, said substrate having at least one opening through said substrate defined by sidewalls of said insulating material, said opening having dimensions between said sidewalls selected to receive an electrical component; B. circuit leads formed on said substrate, at least one lead extending into said opening to form one bonding pad on one sidewall and at least another lead extending into said opening to form another bonding pad on another sidewall, said one and another sidewalls being selected for said bonding pads to confront the terminals of the component; C. an electrical component dimensioned to fit in said opening, said component having terminals at its ends and being located in said opening with said terminals respectively confronting said one and another bonding pads; and D. a solder fillet extending between each said bonding pad and component terminal, said fillets substantially center and fasten the component in the opening both axially of the component and in the height of the opening to provide both mechanical and electrical connections between said one and another bonding pads and said component terminals.
Claim 2
Dependent Claim
189 words
A printed circuit card assembly comprising: A. a substrate of insulating material, said substrate having at least one opening through said substrate defined by sidewalls of said insulating material, said opening having dimensions between said sidewalls selected to receive an electrical component; B. circuit leads formed on said substrate, at least one lead extending into said opening to form one bonding pad on one sidewall and at least another lead extending into said opening to form another bonding pad on another sidewall, said one and another sidewalls being selected for said bonding pads to confront the terminals of the component; C. an electrical component dimensioned to fit in said opening, said component having terminals at its ends and being located in said opening with said terminals respectively confronting said one and another bonding pads; and D. a solder fillet extending between each said bonding pad and component terminal, said fillets substantially center and fasten the component in the opening both axially of the component and in the height of the opening to provide both mechanical and electrical connections between said one and another bonding pads and said component terminals.
Claim 3
Dependent Claim
45 words
The printed circuit card assembly of claim 1 in which said opening passes through said substrate, said substrate having opposed sides and a median plane between said opposed sides, and said solder fillets mounting said component substantially coplanar with the median plane of said substrate.
Claim 4
Dependent Claim
25 words
The printed circuit card assembly of claim 1 in which said substrate has a thickness and the component has a thickness less than said substrate.
Claim 5
Dependent Claim
27 words
The printed circuit card assembly of claim 1 in which said one and another bonding pads oppose one another and said component has terminals on opposed ends.
Claim 6
Dependent Claim
44 words
The printed circuit card assembly of claim 1 in which each bonding pad occurs on one of said sidewalls and adjacent parts of adjacent sidewalls and each fillet extends from one of said sidewalls and adjacent parts of adjacent sidewalls to one component terminal.
Claim 7
Dependent Claim
15 words
The printed circuit card assembly of claim 1 in which said component is a capacitor.
Claim 8
Dependent Claim
196 words
A process of making a printed circuit board assembly comprising: A. forming an opening in a substrate of insulating material, said forming including selecting dimensions of said opening adapted to receive a component; B. producing circuit leads on said substrate, said producing including extending at least one lead into said opening to form one bonding pad on one sidewall of said opening, extending at least another lead into said opening to form another bonding pad on another sidewall, and selecting said one and another sidewalls for said bonding pads to confront terminals of the component; C. placing in said opening an electrical component dimensioned to fit in said opening, said component having terminals at its ends and said placing including locating said component in said opening with said terminals confronting said one and another bonding pads; and D. melting solder paste in said opening to leave a solder fillet extending between each said bonding pad and component terminal, said fillets substantially center and fasten the component in the opening both axially of the component and in the height of the opening to provide both mechanical and electrical connections between said bonding pads and said component terminals.
Claim 9
Dependent Claim
196 words
A process of making a printed circuit board assembly comprising: A. forming an opening in a substrate of insulating material, said forming including selecting dimensions of said opening adapted to receive a component; B. producing circuit leads on said substrate, said producing including extending at least one lead into said opening to form one bonding pad on one sidewall of said opening, extending at least another lead into said opening to form another bonding pad on another sidewall, and selecting said one and another sidewalls for said bonding pads to confront terminals of the component; C. placing in said opening an electrical component dimensioned to fit in said opening, said component having terminals at its ends and said placing including locating said component in said opening with said terminals confronting said one and another bonding pads; and D. melting solder paste in said opening to leave a solder fillet extending between each said bonding pad and component terminal, said fillets substantially center and fasten the component in the opening both axially of the component and in the height of the opening to provide both mechanical and electrical connections between said bonding pads and said component terminals.
Claim 10
Dependent Claim
37 words
The process of claim 6 including forming said opening through said substrate, said substrate having opposed sides and a median plane between said sides, and said melting includes mounting said component substantially coplanar with said median plane.
Claim 11
Dependent Claim
20 words
The process of claim 7 including selecting said component to have a thickness less than the thickness of said substrate.
Claim 12
Dependent Claim
21 words
The process of claim 7 in which said extending said leads includes extending said leads onto opposed sidewalls of said opening.
Claim 13
Dependent Claim
28 words
The process of claim 10 in which said extending said leads includes extending said leads onto said opposed sidewalls and parts of adjacent side walls of said opening.
Claim 14
Dependent Claim
12 words
The process of claim 7 in which said component is a capacitor.
References Cited (Backward Citations)
GB1240789A
Cited
US4732446A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-02-18 | 1994-08-20 | 1995-02-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-02-18 | 1998-08-20 | 1999-02-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-02-18 | 2002-08-20 | 2003-02-19 | $7700.00 | Window Closed / Lapsed |