Surface acoustic wave device

Claim 2

A surface acoustic wave device comprising: a substrate having a piezoelectric outer surface on one side, said substrate having on said one side a recessed portion extending part-way through said substrate to define a recess with a piezoelectric floor on which a pair of spaced excitation portions are applied, each excitation portion having excitation transducer electrodes formed on the piezoelectric surface of said recess floor and a propagating portion between said excitation portions; taking-out electrodes applied upon said substrate and extending from each of said transducer electrodes to the surface of said substrate outside of said recessed portion; a plate-shaped covering body covering said recessed portion, said recessed portion being sufficiently deep that an air gap remains on the inner side of said covering body over said exciting portions and said propagating portion; an encapsulation body sealingly covering at least the outer surfaces of said covering body; and leads connected to said take-out electrodes and projecting beyond said encapsulation body to make connection to an external circuit.

Claim 3

A surface acoustic wave device according to claim 1 wherein said covering body is fixed to said subtrate by adhesive applied to the surface of said substrate along and outside the margins of said recessed portion.

Claim 4

A surface acoustic wave device according to claim 2 wherein said adhesive is made of a sound-absorbing material.

Claim 5

A surface acoustic wave device comprising: a layered substrate including at least an insulating base and a piezoelectric thin film disposed on said base, said base and piezoelectric film having a recessed portion formed thereon having a pair of spaced acoustic wave excitation portions formed on said piezoelectric film and each having excitation transducer electrodes formed thereon and a propagating portion between said excitation portions and a conductive area formed on said propagating portion; taking-out electrodes on said piezoelectric film extending from each of said transducer electrodes and conductive area to the surface of said substrate outside of said recessed portion; a covering body comprising a plate covering said recessed portion, said recessed portion being sufficiently deep that an air gap remains on the inner side of said covering body over said exciting portions and said propagating portion; an encapsulation body sealingly covering at least the outer surfaces of said plate; and leads connected to said take-out electrodes and projecting beyond said encapsulation body to make connection to an external circuit.

Claim 6

A surface acoustic wave device comprising: a layered substrate including at least an insulating base and a piezoelectric thin film disposed on said base, said base and piezoelectric film having a recessed portion formed thereon having a pair of spaced acoustic wave excitation portions formed on said piezoelectric film and each having excitation transducer electrodes formed thereon and a propagating portion between said excitation portions and a conductive area formed on said propagating portion; taking-out electrodes on said piezoelectric film extending from each of said transducer electrodes and conductive area to the surface of said substrate outside of said recessed portion; a covering body comprising a plate covering said recessed portion, said recessed portion being sufficiently deep that an air gap remains on the inner side of said covering body over said exciting portions and said propagating portion; an encapsulation body sealingly covering at least the outer surfaces of said plate; and leads connected to said take-out electrodes and projecting beyond said encapsulation body to make connection to an external circuit.

Claim 7

A surface acoustic wave device according to claim 1 or 4 wherein said leads and said covering body are initially formed as one substantially coplanar body in a lead frame which is then cut to separate the same.

Claim 8

A surface acoustical wave device according to claim 1 or 4 wherein said encapsulating body sealingly covers all outer surfaces of said covering body, all outer surfaces of said substrate, and both sides of the interior portions of said leads, the outer ends of which project beyond said encapsulating body.

Claim 9

A surface acoustic wave device comprising: a substrate, one side of said substrate having opposite end surfaces interconnected by side surfaces, said end and side surfaces defining the margins of a recess extending part way through said substrate and having a piezoelectric surface floor, said substrate having conductive acoustic wave excitation portions disposed on the piezoelectric floor of said recess, spaced conductive pads on said one side of the substrate, conductive areas applied to said substrate surfaces and to the defining walls of said recess for interconnecting said conductive pads and excitation portions, a covering body adhesively secured over said recess along the margins of said recess and defining an air gap in said recess between said recess floor and covering body, conductive leads conductively secured to said pads, and an encapsulation body applied over the outer surfaces of said covering body and substrate, with said leads projecting from said encapsulating body.

Claim 10

A surface acoustic wave device comprising: a substrate, one side of said substrate having opposite end surfaces interconnected by side surfaces, said end and side surfaces defining the margins of a recess extending part way through said substrate and having a piezoelectric surface floor, said substrate having conductive acoustic wave excitation portions disposed on the piezoelectric floor of said recess, spaced conductive pads on said one side of the substrate, conductive areas applied to said substrate surfaces and to the defining walls of said recess for interconnecting said conductive pads and excitation portions, a covering body adhesively secured over said recess along the margins of said recess and defining an air gap in said recess between said recess floor and covering body, conductive leads conductively secured to said pads, and an encapsulation body applied over the outer surfaces of said covering body and substrate, with said leads projecting from said encapsulating body.

Claim 11

The acoustic wave device of claim 7 wherein said end and side surfaces of said substrate are coplanar.

Claim 12

The acoustic wave device of claim 7 wherein said excitation portions are opposite said end surfaces, a pair of said conductive pads are provided on each of said end surfaces of said substrate, with a pair of said conductive areas extending from each of said pair of pads to the adjacent acoustic wave excitation portion.

Claim 13

The acoustic wave device of claim 7 wherein said adhesive extends onto the floor of said recess to form a sound absorber preventing acoustic wave deflection thereat.

Claim 14

The acoustic wave device of claim 1, 4 or 7 wherein said recess floor has applied thereto a first conductive area between said excitation portions and other conductive areas on the defining walls of said recess and on said one side of said substrate outside of said recess for electrically coupling said first conductive area to the exterior of said device, and a conductive lead connected to a portion of said other conductive areas and projecting beyond said encapsulation body to provide electrical connection to an external circuit.

Claim 15

The surface acoustic wave device of claim 1, 4 or 7 wherein said covering body covers and seals over the entire marginal portion of the recess in the substrate.

Claim 16

The surface acoustic wave device of claim 1, 4 or 7 wherein said air gap is provided over the entire inner side of said covering body.