Characteristic impedance-correct chip carrier for microwave semiconductor components

Claim 1

A chip carrier for microwave components comprising: a chip support having a single electrically conductive region; a dielectric substrate having upper and lower surfaces and at least one opening of a prescribed shape and size, said dielectric substrate being arranged on said support such that said lower surface rests on said support including the single electrically conductive region with said opening disposed over the single electrically conductive region, said dielectric substrate having larger lateral dimensions than said support, and thereby having portions protruding laterally outward away from said single electrically conductive region, the chip support and dielectric substrate defining an area of contact having an outer border; at least one microwave semiconductor component including a ground terminal and arranged on said support within said opening and the ground terminal electrically connected to said single electrically conductive region within said opening; and a plurality of microwave strip lines disposed on the upper surface of the dielectric substrate and electrically connected to the component, the strip lines each defining a width transition portion located substantially above the outer border as projected to the upper surface of the dielectric substrate, a narrow portion extending outward from the component to the width transition portion, and a widened portion extending outward from the width transition portion, wherein the strip lines are widened at the width transition portion such that the impedance of the strip lines remain substantially constant along the length of the strip lines; the widened portions also functioning to facilitate the electrical connection of other materials which will later be applied to the chip carrier.