US4991287A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for fabricating printed circuit boards
Assignee: Eastman Kodak Co
•
Filing: 1989-12-26
•
Granted: 1991-02-12
•
Expires: 2009-12-26
Abstract
Abstract A process for fabricating a printed circuit board includes the steps of producing data in a printing-scan format representative of a designed area circuit pattern; with such data, printing a mask pattern, corresponding to said circuit pattern, on the metal surface of a dielectric substrate; and etching to remove unmasked portions of the metal layer.
Inventors
- 👤 Michael J. Piatt
- 👤 Mark E. Brown
- 👤 Michael A. Walters
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 23:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/03; H05K2203/0338; H05K2203/05; H05K2203/0502; H05K2203/0528; H05K2203/11; H05K2203/1105; H05K3/04; H05K3/046; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
167 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a raster-scan printing format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the metal surface of a metal coated dielectric substrate by: (1) feeding said sheet on a print platen so that successive lines of its metal surface pass through a print zone; (2) traversing a thermal print head across the print zone to address successive lines of the metal surface then at the print zone; (3) supplying a solder coated support ribbon between the print head and said substrate so that the solder contacts such metal surface; and (4) energizing the thermal print head during each traverse in accord with the raster-scan data whereby solder is transferred onto said metal surface selectively to form said mask pattern; and (c) etching said substrate to remove unmasked portions of said metal layer.
Claim 2
Dependent Claim
167 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a raster-scan printing format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the metal surface of a metal coated dielectric substrate by: (1) feeding said sheet on a print platen so that successive lines of its metal surface pass through a print zone; (2) traversing a thermal print head across the print zone to address successive lines of the metal surface then at the print zone; (3) supplying a solder coated support ribbon between the print head and said substrate so that the solder contacts such metal surface; and (4) energizing the thermal print head during each traverse in accord with the raster-scan data whereby solder is transferred onto said metal surface selectively to form said mask pattern; and (c) etching said substrate to remove unmasked portions of said metal layer.
Claim 3
Dependent Claim
175 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a vector-scan printing format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the metal surface of a planar circuit board comprising a metal coated dielectric substrate by: (1) moving said board on a first axis so that portions orthogonal to that axis pass under a print zone; (2) traversing a thermal print head on a second axis parallel to the surface of said circuit board and perpendicular to said first axis; (3) supplying a solder coated support ribbon between the print head and said substrate so that the solder contacts such metal surface; and (4) energizing the print head in synchronized relation with traverse and orthogonal movements in accord with the vector-scan data whereby solder is transferred to said metal surface to form said mask pattern; and (c) etching said substrate to remove unmasked portions of said metal layer.
Claim 4
Dependent Claim
175 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a vector-scan printing format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the metal surface of a planar circuit board comprising a metal coated dielectric substrate by: (1) moving said board on a first axis so that portions orthogonal to that axis pass under a print zone; (2) traversing a thermal print head on a second axis parallel to the surface of said circuit board and perpendicular to said first axis; (3) supplying a solder coated support ribbon between the print head and said substrate so that the solder contacts such metal surface; and (4) energizing the print head in synchronized relation with traverse and orthogonal movements in accord with the vector-scan data whereby solder is transferred to said metal surface to form said mask pattern; and (c) etching said substrate to remove unmasked portions of said metal layer.
Claim 5
Dependent Claim
102 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a printing-scan format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the surface of a metal layer coated on a dielectric substrate; (c) etching said substrate to remove unmasked portions of said metal; (d) placing circuit components at predetermined locations on the printed mask pattern overlying non-removed metal layer regions; and (e) heating said mask pattern to couple said components to said non-removed metal layer regions.
Claim 6
Dependent Claim
102 words
A process for fabricating a printed circuit board comprising the steps of: (a) producing, in a memory device, data representative in a printing-scan format of a designed area circuit pattern; (b) under the control of such data, printing a mask pattern, corresponding to said circuit pattern, onto the surface of a metal layer coated on a dielectric substrate; (c) etching said substrate to remove unmasked portions of said metal; (d) placing circuit components at predetermined locations on the printed mask pattern overlying non-removed metal layer regions; and (e) heating said mask pattern to couple said components to said non-removed metal layer regions.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-02-11 | 1994-08-13 | 1995-02-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-02-11 | 1998-08-13 | 1999-02-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-02-11 | 2002-08-13 | 2003-02-12 | $7700.00 | Window Closed / Lapsed |