Abstract A semiconductor element string having a number of semiconductor elements, each of which has the first and second leads mounted on a transverse plate. The first leads are cut off from the transverse plate, when the semiconductor element string is to be mounted on the printed circuit board. The second leads connected to the transverse plate serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate to be mounted on the printed circuit board. A linking piece is provided crossing over the middle portions of the first and second leads so as to make the whole construction more stable. The second leads are bent into a S-shaped structure. Each second lead and its corresponding first lead are located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of the semiconductor element string by an angle.
A semiconductor element string comprising a transverse plate, and a plurality of semiconductor elements, each of which has a first lead and a second lead mounted on said transverse plate, said first leads being cut off from said transverse plate when said string is to be mounted on a printed circuit board, said second leads being connected to said transverse plate and serving as ground lines for said respective semiconductor elements by bending two distal ends of said transverse plate to be mounted on said printed circuit board; the improvement comprising: said second leads are bent into a substantially S-shaped structure to reinforce the structure of said semiconductor element string, each said second lead and its corresponding first lead being located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of said semiconductor element string by an angle which is not normal to said second vertical plane such that each said second lead of said semiconductor element string is readily accessible for repair.
Claim 2
Dependent Claim
172 words
A semiconductor element string comprising a transverse plate, and a plurality of semiconductor elements, each of which has a first lead and a second lead mounted on said transverse plate, said first leads being cut off from said transverse plate when said string is to be mounted on a printed circuit board, said second leads being connected to said transverse plate and serving as ground lines for said respective semiconductor elements by bending two distal ends of said transverse plate to be mounted on said printed circuit board; the improvement comprising: said second leads are bent into a substantially S-shaped structure to reinforce the structure of said semiconductor element string, each said second lead and its corresponding first lead being located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of said semiconductor element string by an angle which is not normal to said second vertical plane such that each said second lead of said semiconductor element string is readily accessible for repair.