Heat pipe type cooling apparatus for semiconductor

Claim 2

A heat pipe type cooling apparatus for a semiconductor, comprising: a plurality of first metal pipes which extend substantially parallel to each other, and one end of each of which is open, each of said first metal pipes having a plurality of first grooves formed in an inner surface thereof, each of said first grooves extending into said first metal pipes in the thickness direction of said first metal pipes and having a bottom portion within the thickness of said first metal pipes, each of said first grooves having an opening at the innermost surface of said first metal pipes which is broader than an interior portion of said first grooves; a plurality of second metal pipes which extend substantially parallel to each other, one end of each of which is closed to provide a closed-end system and the other end of each of which is open, each of said second metal pipes having a plurality of second grooves formed in an inner surface thereof, each of said second grooves extending into said second metal pipes in the thickness direction of said second metal pipes and having an inner and bottom portion within the thickness of said second metal pipes, each of said second grooves having an opening at the innermost surface of said second metal pipes which is narrower than the inner portion of said second grooves; an electrically insulating working liquid received in said first and second metal pipes; a plurality of electrically insulating pipes, each connecting said one open end of said first metal pipes to said other open end of a corresponding one of said second metal pipes so as to allow the interiors of said first and second metal pipes to communicate with each other, each of said first and second metal pipes, each of said electrically insulating pipes and said electrically insulating working liquid comprising a closed-end heat pipe assembly; and a conductive block to which said one closed end of each of said second metal pipes is connected, said conductive block having a receiving surface for directly receiving a semiconductor which is to be cooled thereon, without any intermediary between said receiving surface and said semiconductor which is to be cooled.

Claim 3

An apparatus according to claim 1, further comprising a plurality of fins connected to said first metal pipes for dissipating heat from said first metal pipes.

Claim 4

An apparatus according to claim 2, wherein the other end of each of said first metal pipes is tapered and formed into a hemispherical shape, and has a nozzle formed thereon.

Claim 5

An apparatus according to claim 2, wherein the other end of each of said first metal pipes is tapered and formed into a conical shape, and has a nozzle formed thereon.

Claim 6

An apparatus according to claim 1, wherein said first grooves formed in said first metal pipes are V-shaped grooves.

Claim 7

An apparatus according to claim 5, wherein said second grooves formed in said second metal pipes are partially circular grooves.

Claim 8

An apparatus according to claim 1, wherein said second grooves formed in said second metal pipes are partially circular grooves.

Claim 9

An apparatus according to claim 1, wherein said heat pipe assembly includes a vibration damping member formed substantially midway along a longitudinal direction of said heat pipe assembly.

Claim 10

An apparatus according to claim 6, wherein said said vibration damping member is coupled to said first metal pipe, and includes a bellowslike portion constituting part of said first metal pipe.

Claim 11

An apparatus according to claim 9, wherein said damping member includes a plurality of said bellowslike portions, each coupled to a respective first metal pipe.

Claim 12

An apparatus according to claim 10, wherein said bellowslike portions are made of the same material as that of said first metal pipes, and are integrally formed therewith.

Claim 13

An apparatus according to claim 7, wherein said bellowslike portion is made of the same material as that of said first metal pipe, and is integrally formed therewith.

Claim 14

A heat pipe type cooling apparatus for a semiconductor, comprising: a plurality of first pipes made of cooper, one end of each of which is open, each of said first pipes having a plurality of first V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, said V-shaped grooves extending into said first pipes in the thickness direction of said first pipes and having the widest portions of said V-shaped grooves at the inner surface of said first pipes; a plurality of second pipes made of an element selected from the group consisting of aluminum and copper, one end of each of which is closed to provide a closed-end system and the other end of each of which is open, each of said second pipes having a plurality of second grooves formed in an inner surface thereof, each of said second grooves extending into said second pipes in the thickness direction of said second pipes and having an inner and bottom portion within the thickness of said second pipes, each of said second grooves having an opening at the innermost surface of said second pipes which is narrower than the inner portion of said second grooves; an electrically insulating working liquid provided in said first and second pipes; a plurality of ceramic pipes arranged between said one open end of each of said first pipes and said other open end of a corresponding one of said second pipes; a plurality of intermediate pipes made of an element selected from the group consisting of Koval and a nickel-iron alloy, and respectively coupled between at least one end of said ceramic pipes and at least one of said first and second pipes, each of said first and second pipes, said working liquid, each of said ceramic pipes, and each of said intermediate pipes comprising a closed-end heat pipe assembly; and a conductive block having an end face in which said one closed end of each of said second heat pipes is inserted, and said conductive block having a receiving surface for directly receiving a semiconductor which is to be cooled thereon, without any intermediary between said receiving surface and said semiconductor which is to be cooled.

Claim 15

A heat pipe type cooling apparatus for a semiconductor, comprising: a plurality of first pipes made of cooper, one end of each of which is open, each of said first pipes having a plurality of first V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, said V-shaped grooves extending into said first pipes in the thickness direction of said first pipes and having the widest portions of said V-shaped grooves at the inner surface of said first pipes; a plurality of second pipes made of an element selected from the group consisting of aluminum and copper, one end of each of which is closed to provide a closed-end system and the other end of each of which is open, each of said second pipes having a plurality of second grooves formed in an inner surface thereof, each of said second grooves extending into said second pipes in the thickness direction of said second pipes and having an inner and bottom portion within the thickness of said second pipes, each of said second grooves having an opening at the innermost surface of said second pipes which is narrower than the inner portion of said second grooves; an electrically insulating working liquid provided in said first and second pipes; a plurality of ceramic pipes arranged between said one open end of each of said first pipes and said other open end of a corresponding one of said second pipes; a plurality of intermediate pipes made of an element selected from the group consisting of Koval and a nickel-iron alloy, and respectively coupled between at least one end of said ceramic pipes and at least one of said first and second pipes, each of said first and second pipes, said working liquid, each of said ceramic pipes, and each of said intermediate pipes comprising a closed-end heat pipe assembly; and a conductive block having an end face in which said one closed end of each of said second heat pipes is inserted, and said conductive block having a receiving surface for directly receiving a semiconductor which is to be cooled thereon, without any intermediary between said receiving surface and said semiconductor which is to be cooled.

Claim 16

An apparatus according to claim 9, wherein said first pipe includes a bellowslike vibration damping portion formed near said intermediate pipe.

Claim 17

An apparatus according to claim 13, wherein said intermediate pipes are coupled to each end of said ceramic pipes, between said ceramic pipes and said first and second pipes, respectively.

Claim 18

A heat pipe type cooling apparatus for a semiconductor, comprising: a plurality of first metal pipes which extend substantially parallel to each other, and one end of each of which is open, each of said first metal pipes having a plurality of first grooves formed in an inner surface thereof, each of said first grooves extending into said first metal pipes in the thickness direction of said first metal pipes and having a bottom portion within the thickness of said first metal pipes, each of said first grooves having an opening at the innermost surface of said first metal pipes which is broader than an interior portion of said first grooves; a plurality of second metal pipes which extend substantially parallel to each other, one end of each of which is closed to provide a closed-end system and the other end of each of which is open, each of said second metal pipes having a plurality of second and third grooves formed in an inner surface thereof to form boiling cores, each of said second and third grooves being generally V-shaped and extending into said second metal pipes in the thickness direction of said second metal pipes having an opening at the inner most surface of said second metal pipes which is broader than an inner part of the respective second and third grooves thereof, said second grooves extending in a first direction and said third grooves extending in a second direction so as to cross or intersect with said second grooves, whereby said first and second grooves which are crossed or intersect with one another form a large number of small recesses so that a number of boiling cores defined by said intersecting second and third grooves are increased; an electrically insulating working liquid received in said first and second metal pipes; a plurality of electrically insulating pipes, each connecting said one open end of each of said first metal pipes to said other closed end of a corresponding one of said second metal pipes so as to allow the interiors of said first and second metal pipes to communicate with each other, each of said first and second metal pipes, each of said electrically insulating pipes and said electrically insulating working liquid comprising a closed heat pipe assembly; and a conductive block to which said one closed end of each of said second metal pipes is connected, and said conductive block having a receiving surface for directly receiving a semiconductor which is to be cooled thereon, without any intermediary between said receiving surface and said semiconductor which is to be cooled.

Claim 19

A heat pipe type cooling apparatus for a semiconductor, comprising: a plurality of first metal pipes which extend substantially parallel to each other, and one end of each of which is open, each of said first metal pipes having a plurality of first grooves formed in an inner surface thereof, each of said first grooves extending into said first metal pipes in the thickness direction of said first metal pipes and having a bottom portion within the thickness of said first metal pipes, each of said first grooves having an opening at the innermost surface of said first metal pipes which is broader than an interior portion of said first grooves; a plurality of second metal pipes which extend substantially parallel to each other, one end of each of which is closed to provide a closed-end system and the other end of each of which is open, each of said second metal pipes having a plurality of second and third grooves formed in an inner surface thereof to form boiling cores, each of said second and third grooves being generally V-shaped and extending into said second metal pipes in the thickness direction of said second metal pipes having an opening at the inner most surface of said second metal pipes which is broader than an inner part of the respective second and third grooves thereof, said second grooves extending in a first direction and said third grooves extending in a second direction so as to cross or intersect with said second grooves, whereby said first and second grooves which are crossed or intersect with one another form a large number of small recesses so that a number of boiling cores defined by said intersecting second and third grooves are increased; an electrically insulating working liquid received in said first and second metal pipes; a plurality of electrically insulating pipes, each connecting said one open end of each of said first metal pipes to said other closed end of a corresponding one of said second metal pipes so as to allow the interiors of said first and second metal pipes to communicate with each other, each of said first and second metal pipes, each of said electrically insulating pipes and said electrically insulating working liquid comprising a closed heat pipe assembly; and a conductive block to which said one closed end of each of said second metal pipes is connected, and said conductive block having a receiving surface for directly receiving a semiconductor which is to be cooled thereon, without any intermediary between said receiving surface and said semiconductor which is to be cooled.