US4981725A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process and composition for sensitizing articles for metallization
Assignee: MECHATRONICS LLC
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Filing: 1978-02-21
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Granted: 1991-01-01
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Expires: 1998-02-21
Abstract
Abstract Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the elemnt(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.
Inventors
- 👤 Francis J. Nuzzi
- 👤 Edward J. Leech
- 👤 Richard W. Charm
- 👤 Joseph Polichette
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:13
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/208; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
150 words
A process for sensitizing the surface of a non-metallic article for the deposition of an adherent metal from an electroless metal deposition solution in contact therewith, comprising the steps of: (a) adsorbing on the surface or selected areas of the surface of said article, copper (I) ion compound by contacting said surface with a first medium comprising an aqueous solution containing a compound of said copper (I) ion compound and a compound of stannous tin; (b) next rinsing said article with an aqueous second medium to decrease the solubility of the copper (I) ion compound adsorbed on said surface, while at the same time, removing from said surface with said second medium unadsorbed copper (I) ion compound carried over from said first medium; and (c) treating said article with at least one reducing agent to render said adsorbed copper (I) ion compound catalytically active for the electroless deposition of metal.
Claim 2
Dependent Claim
150 words
A process for sensitizing the surface of a non-metallic article for the deposition of an adherent metal from an electroless metal deposition solution in contact therewith, comprising the steps of: (a) adsorbing on the surface or selected areas of the surface of said article, copper (I) ion compound by contacting said surface with a first medium comprising an aqueous solution containing a compound of said copper (I) ion compound and a compound of stannous tin; (b) next rinsing said article with an aqueous second medium to decrease the solubility of the copper (I) ion compound adsorbed on said surface, while at the same time, removing from said surface with said second medium unadsorbed copper (I) ion compound carried over from said first medium; and (c) treating said article with at least one reducing agent to render said adsorbed copper (I) ion compound catalytically active for the electroless deposition of metal.
Claim 3
Dependent Claim
11 words
The process of claim 1, wherein said first medium is acidic.
Claim 4
Dependent Claim
22 words
The process of claim 1, wherein said reducing agent is a member of the group consisting of borohydrides, amine boranes and formaldehyde.
Claim 5
Dependent Claim
24 words
The process of claim 1, wherein the treatment with a reducing agent is carried out in two separate stages, employing two separate reducing agents.
Claim 6
Dependent Claim
28 words
The process of claim 4, wherein the reducing agent in the first separate stage is formaldehyde, and the reducing agent in the second separate stage is a borohydride.
Claim 7
Dependent Claim
166 words
A process for metallizing the surface of a non-metallic article by the deposition of an adherent metal from an electroless metal deposition solution in contact therewith, comprising the steps of: (a) adsorbing on the surface or selected areas of the surface of said article, copper (I) ion compound by contacting said surface with a first medium comprising an aqueous solution containing a compound of said copper (I) ion compound and a compound of stannous tin; (b) next rinsing said article with an aqueous second medium to decrease the solubility of the copper (I) ion compound adsorbed on said surface, while at the same time removing from said surface with said second medium unadsorbed copper (I) ion compound carried over from said first medium; (c) treating said article with at least one reducing agent to render said adsorbed copper (I) ion compound catalytically active for the electroless deposition of metal; and (d) contacting said catalytically active article with an electroless metal deposition bath, to deposit metal thereon.
Claim 8
Dependent Claim
166 words
A process for metallizing the surface of a non-metallic article by the deposition of an adherent metal from an electroless metal deposition solution in contact therewith, comprising the steps of: (a) adsorbing on the surface or selected areas of the surface of said article, copper (I) ion compound by contacting said surface with a first medium comprising an aqueous solution containing a compound of said copper (I) ion compound and a compound of stannous tin; (b) next rinsing said article with an aqueous second medium to decrease the solubility of the copper (I) ion compound adsorbed on said surface, while at the same time removing from said surface with said second medium unadsorbed copper (I) ion compound carried over from said first medium; (c) treating said article with at least one reducing agent to render said adsorbed copper (I) ion compound catalytically active for the electroless deposition of metal; and (d) contacting said catalytically active article with an electroless metal deposition bath, to deposit metal thereon.
Claim 9
Dependent Claim
11 words
The process of claim 6, wherein said first medium is acidic.
Claim 10
Dependent Claim
22 words
The process of claim 6, wherein said reducing agent is a member of the group consisting of borohydrides, amine boranes and formaldehyde.
Claim 11
Dependent Claim
24 words
The process of claim 6, wherein the treatment with a reducing agent is carried out in two separate stages, employing two separate reducing agents.
Claim 12
Dependent Claim
28 words
The process of claim 9, wherein the reducing agent in the first separate stage is formaldehyde, and the reducing agent in the second separate stage is a borohydride.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-31 | 1994-07-02 | 1995-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-31 | 1998-07-02 | 1999-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-31 | 2002-07-02 | 2003-01-01 | $7700.00 | Window Closed / Lapsed |