Abstract A method of fine-tuning the dielectric constant value of an insulating ceramic alloy, and the resulting alloy, and uses thereof, are disclosed. The alloy has the general formula: Mg.sub.x Al.sub.y Ti.sub.z O.sub.4 wherein x+y+z=3 x=1-2 y=0.1-1.9 z=0.1-0.9 and is preferably made from 10 to 90 mol percent of magnesium titanate and 90 to 10 mol percent of magnesium aluminate. The mole ratio of the titanate to the aluminate in the alloy is varied in order to vary the value of the dielectric constant of the alloy. The alloy has a density which is at least 98% of the theoretical density of the alloy, and a dielectric constant of 8.5 to 13.8. The alloy can be used in applications wherein dielectric materials have previously been utilized, such as a substrate for an electrical circuit.
An array of a printed circuit and a substrate therefor, said substrate consisting essentially of an alloy of the formula: Mg.sub.x Al.sub.y Ti.sub. O.sub.4 wherein x+y+z=3 x=1 -2 y=0.1-1.9 z=0.1-0.9 said alloy having a dielectric constant of 8.5 to 13.8 and a density which is at least 98% of the theoretical density of the alloy.
Claim 2
Dependent Claim
55 words
An array of a printed circuit and a substrate therefor, said substrate consisting essentially of an alloy of the formula: Mg.sub.x Al.sub.y Ti.sub. O.sub.4 wherein x+y+z=3 x=1 -2 y=0.1-1.9 z=0.1-0.9 said alloy having a dielectric constant of 8.5 to 13.8 and a density which is at least 98% of the theoretical density of the alloy.
Claim 3
Independent Claim
82 words
A method of forming and array of electrical circuits stacked on and electrically insulated from one another, said method comprising forming a plurality of unfired substrates having thicknesses of 0.007 to 0.025 inches, and of the formula: Mg.sub.x Al.sub.y Ti.sub.z O.sub.4 wherein x+y+z=3 x=1-2 y=0.1-1.9 z=0.1-0.9 printing an electrical circuit on each of said substrates, and firing the substrates while in stacked configuration at a temperature 1325° C. to 1450° C. to form dielectric alloys between each pair of adjacent electrical circuits.
Claim 4
Independent Claim
82 words
A method of forming and array of electrical circuits stacked on and electrically insulated from one another, said method comprising forming a plurality of unfired substrates having thicknesses of 0.007 to 0.025 inches, and of the formula: Mg.sub.x Al.sub.y Ti.sub.z O.sub.4 wherein x+y+z=3 x=1-2 y=0.1-1.9 z=0.1-0.9 printing an electrical circuit on each of said substrates, and firing the substrates while in stacked configuration at a temperature 1325° C. to 1450° C. to form dielectric alloys between each pair of adjacent electrical circuits.