Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymer having at least one fluorine-containing linking group

Abstract

Abstract The present invention provides polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO 2 , O, S, CO, C 1 to C 6 alkylene, perfluoroalkylene or perfluoroarylalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C 1 to C 4 alkoxy. The PA-PA-PI polymers of this invention are prepared by reacting compounds of the above formula alone or admixed with other aromatic diamines, with carboxyphenyl trimellitimide or the acid halide or ester derivatives thereof, alone or admixed with one or more aromatic diacid chlorides and/or one or more aromatic tetracarboxylic acids or anhydrides thereof. Polybenzoxazole-polyamide-polyimide derivatives of such polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C 1 to C 4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyamide-polyimide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyamide-polyimide polymers.

Inventors

• 👤 Dinesh N. Khanna

Bibliographic Details