High density circuit assembly

Claim 1

A high density interconnection computer circuit assembly comprising: a bookcase-shaped frame having vertical support members and lateral support shelf members between said vertical members; a plurality of generally rectangular book packages, each book package slidably mounted along one edge to at least one shelf member with the book packages having a broad surface extending between the shelf members, each package including support board means having printed circuit interconnect conductors and including mounted to said board means a plurality of high density circuit modules coupled to said interconnect conductors, power supply, a panel of connectors, and a multi-conductor coupler coupled between said printed circuit interconnect conductors and said panel of connectors, said interconnect conductors and said multi-conductor coupler interconnecting said high density circuit modules to connectors on said panel of connectors, each said package further including power bus lines between said high density circuit modules and said power supply for providing self contained power to said modules on said packages; each of said panel of connectors mounted across that one end of each of said support board means that faces a given broad face of the frame when each said package is in its operating position between the shelf members; and conductor means coupled between at least one pair of said panel of connectors for interconnecting said packages via said pair of said panel of connectors with said conductor means extending along the given face of the frame.