US4970576A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Power semiconductor module and method for producing the module
Assignee: ASEA BROWN BOVERI AG
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Filing: 1988-05-19
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Granted: 1990-11-13
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Expires: 2008-05-19
Abstract
Abstract A power semiconductor module and method for producing the module includes a plastic housing having a lower surface. An electrically insulating substrate having an upper surface is inserted in the lower surface of the plastic housing for supporting electrical components. A metallization is disposed at least on the upper surface of the substrate. The metallization on the upper surface of the substrate is patterned to form conductor tracks. Components are soldered onto the patterned metallization. Locating compartments disposed in the plastic housing form a soldering jig for the components during production of the module.
Inventors
- 👤 Arno Neidig
- 👤 Hubert Hettmann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/60; H10W90/00; H10W90/811; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W74/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
118 words
Power semiconductor module, comprising a plastic housing having a lower surface, an electrically insulating substrate having an upper surface and being disposed on said lower surface of said plastic housing for supporting electrical components, a metallization disposed at least on said upper surface of said substrate, said metallization on said upper surface of said substrate being patterned to form conductor tracks, electrical components soldered onto said patterned metallization with soft solder having a given soldering temperature, and locating compartments disposed in said plastic housing forming a soldering jig for said electrical components during production of the module, said housing being formed of a temperature-resistant plastic which withstands a temperature at least as high as said given soldering temperature.
Claim 2
Dependent Claim
118 words
Power semiconductor module, comprising a plastic housing having a lower surface, an electrically insulating substrate having an upper surface and being disposed on said lower surface of said plastic housing for supporting electrical components, a metallization disposed at least on said upper surface of said substrate, said metallization on said upper surface of said substrate being patterned to form conductor tracks, electrical components soldered onto said patterned metallization with soft solder having a given soldering temperature, and locating compartments disposed in said plastic housing forming a soldering jig for said electrical components during production of the module, said housing being formed of a temperature-resistant plastic which withstands a temperature at least as high as said given soldering temperature.
Claim 3
Dependent Claim
25 words
Power semiconductor module according to claim 1, wherein said components are semiconductor components and connecting elements for plug connectors being soldered onto said patterned metallization.
Claim 4
Dependent Claim
22 words
Power semiconductor module according to claim 1, wherein said locating compartments are in the form of recesses formed in said plastic housing.
Claim 5
Dependent Claim
57 words
Power semiconductor module according to claim 1, wherein said components include connecting lugs having a lug part and a connecting part formed thereon, and said locating compartments have a cross-shaped structure as seen in a plan view, with a wide compartment part for guiding said lug part and a narrow compartment part for guiding said connecting part.
Claim 6
Dependent Claim
21 words
Power semiconductor module according to claim 1, wherein said plastic housing is subdivided into a housing frame and a housing cover.
Claim 7
Dependent Claim
39 words
Power semiconductor module according to claim 1, wherein said plastic housing includes a housing frame and other parts of said housing, and at least said housing frame is formed of a plastic with a melting point above 200° C.
Claim 8
Dependent Claim
24 words
Power semiconductor module according to claim 1, including control terminals having plug connectors with a welded-on piece of wire connected to said patterned metallization.
Claim 9
Dependent Claim
20 words
Power semiconductor module according to claim 7, wherein said plug connectors are inserted in pockets formed in said housing frame.
Claim 10
Dependent Claim
14 words
Power semiconductor module according to claim 1, wherein said substrate is a ceramic substrate.
Claim 11
Dependent Claim
34 words
Power semiconductor module according to claim 1, wherein said substrate is a metal substrate having an electrically insulating layer to which said conductor tracks are applied, and said conductor tracks are formed of copper.
Claim 12
Dependent Claim
19 words
Power semiconductor module according to claim 1, wherein said locating components are also formed of said temperature- resistant plastic.
Claim 13
Dependent Claim
18 words
Power semiconductor module according to claim 1, wherein said locating components are formed directly in said plastic housing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-12 | 1994-05-14 | 1994-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-12 | 1998-05-14 | 1998-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-12 | 2002-05-14 | 2002-11-13 | $7700.00 | Window Closed / Lapsed |