US4961879A
Expired / Lapsed
US
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Conductive metal-filled substrates via developing agents
Assignee: Akzo NV
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Filing: 1988-06-08
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Granted: 1990-10-09
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Expires: 2008-06-08
Abstract
Abstract A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
Inventors
- 👤 Paul Y. Y. Moy
- 👤 William J. E. Parr
- 👤 Dieter Frank
- 👤 Ronald E. Hutton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:19
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0083; C; C08; C08K; C08K3/00; C08K3/02; C08K3/08; H01; H01B; H01B1/00; H01B1/20; H01B1/22
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
182 words
A method of forming a conductive metal-filled substrate, comprising: a. an intermingling step of intermingling metal particles in a deformable substrate, wherein the metal particles are selected from the group consisting of copper, nickel, and combinations thereof, and are intermingled in a quantity sufficient to achieve a conductive three-dimensional substrate; b. a contacting step of contacting the metal particles with a developing agent comprising a material selected from the group consisting of a long-chain aliphatic tertiary amine; a tertiary phosphine or a tertiary phosphite; and a bifunctional compound having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen, the first and second atoms being separated by at least two other atoms, the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal-filled substrate.
Claim 2
Independent Claim
182 words
A method of forming a conductive metal-filled substrate, comprising: a. an intermingling step of intermingling metal particles in a deformable substrate, wherein the metal particles are selected from the group consisting of copper, nickel, and combinations thereof, and are intermingled in a quantity sufficient to achieve a conductive three-dimensional substrate; b. a contacting step of contacting the metal particles with a developing agent comprising a material selected from the group consisting of a long-chain aliphatic tertiary amine; a tertiary phosphine or a tertiary phosphite; and a bifunctional compound having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen, the first and second atoms being separated by at least two other atoms, the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal-filled substrate.
Claim 3
Dependent Claim
18 words
The method of claim 1 wherein said intermingling step comprises melt blending the metal particles into the substrate.
Claim 4
Dependent Claim
21 words
The method of claim 1 wherein said intermingling step comprises blending the metal particles into an uncured resin at ambient temperature.
Claim 5
Dependent Claim
22 words
The method of claim 1 wherein the copper or nickel contains less than about 40 weight % of nonconductive substrate forming metals.
Claim 6
Dependent Claim
22 words
The method of claim 1 wherein the copper or nickel contains less than about 20 weight % of nonconductive substrate forming metals.
Claim 7
Dependent Claim
21 words
The method of claim 1 wherein the metal particles have a number average particle size of less than about 30 um.
Claim 8
Dependent Claim
28 words
The method of claim 1 wherein the metals are present in the form of an mixture containing less than about 25 weight % of other nonconductive-substrate forming metals.
Claim 9
Dependent Claim
22 words
The method of claim 1 wherein said heating step takes place at temperature below the melting point of any substantially present metal.
Claim 10
Dependent Claim
20 words
The method of claim 1 wherein said heating step takes place at or above the softening point of the substrate.
Claim 11
Dependent Claim
12 words
The method of claim 1 wherein the substrate is a synthetic resin.
Claim 12
Dependent Claim
12 words
The method of claim 10 wherein the substrate is a thermoplastic resin.
Claim 13
Dependent Claim
26 words
The method of claim 1 wherein said contacting step comprises contacting the developing agent in liquid form with the metal particles prior to said intermingling step.
Claim 14
Dependent Claim
20 words
The method of claim 1 wherein said contacting step and said heating step take place prior to said intermingling step.
Claim 15
Dependent Claim
22 words
The method of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate prior to said intermingling step.
Claim 16
Dependent Claim
22 words
The method of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate simultaneous with said intermingling step.
Claim 17
Dependent Claim
22 words
The method of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate subsequent to said intermingling step.
Claim 18
Dependent Claim
13 words
The method of claim 1 wherein the developing agent is a tertiary amine.
Claim 19
Dependent Claim
20 words
The method of claim 17 wherein the tertiary amine has at least on C 8 to C 20 alkyl group.
Claim 20
Dependent Claim
25 words
The method of claim 18 wherein the at least one C 8 to C 20 alkyl group is a coco, tallow, or hydrogenated tallow group.
Claim 21
Dependent Claim
14 words
The method of claim 19 wherein the tertiary amine also contains a hydroxyalkyl group.
Claim 22
Dependent Claim
15 words
The method of claim 20 wherein the tertiary amine is N,N bis(2-hydroxyethyl)cocoamine or N,N-bis(2-hydroxyethyl)tallow amine.
Claim 23
Dependent Claim
17 words
The method of claim 1 wherein the developing agent is a tertiary phosphine or a tertiary phosphite.
Claim 24
Dependent Claim
13 words
The method of claim 1 wherein the developing agent is a bifunctional compound.
Claim 25
Dependent Claim
16 words
The method of claim 23 wherein the bifunctional compound is a chelant for copper or nickel.
Claim 26
Dependent Claim
22 words
The method of claim 23 wherein said first and second atoms have a minimum theoretical intramolecular distance of less than 0.40 nm.
Claim 27
Dependent Claim
11 words
The method of claim 23 wherein said first atom is nitrogen.
Claim 28
Dependent Claim
15 words
The method of claim 23 wherein the bifunctional compound is an alkanolamine or a diamine.
Claim 29
Dependent Claim
14 words
The method of claim 26 wherein said bifunctional compound is a di(hydroxyalkyl) tertiary amide.
Claim 30
Dependent Claim
23 words
The method of claim 28 wherein said di(hydroxyalkyl) tertiary amide is a di(2-hydroxyethyl)alkyl amide having 5 to 20 carbons in the alkyl moity.
Claim 31
Dependent Claim
12 words
The method of claim 29 wherein said di(2-hydroxyethyl) alkyl amide is di(2-hydroxyethyl)dodecanamide.
References Cited (Backward Citations)
EP0170063A2
Cited
EP0221434A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-10-08 | 1994-04-09 | 1994-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-08 | 1998-04-09 | 1998-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-08 | 2002-04-09 | 2002-10-09 | $7700.00 | Window Closed / Lapsed |