US4956035A
Expired / Lapsed
US
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Composition and process for promoting adhesion on metal surfaces
Assignee: RBP Chemical Technology Inc
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Filing: 1989-08-01
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Granted: 1990-09-11
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Expires: 2009-08-01
Abstract
Abstract The adhesion of organic chemicals to metal surfaces is enhanced by treating the metal surface with a composition comprising an etching component, a quaternary ammonium cationic surfactant, and a solubilizing secondary surfactant.
Inventors
- 👤 Rudolf P. Sedlak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 19:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/383; C; C23; C23C; C23C22/00; C23C22/05; C23C22/06; C23C22/48; C23C22/53; H05K2203/00; H05K2203/12; H05K2203/125; H05K3/02; H05K3/06; H05K3/061; H05K3/064
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
34 words
A composition for improving adhesion of organic compounds to metal surfaces, said composition comprising: an etching composition; an effective amount of a quaternary ammonium cationic surfactant; and a solubilizing amount of a secondary surfactant.
Claim 2
Dependent Claim
34 words
A composition for improving adhesion of organic compounds to metal surfaces, said composition comprising: an etching composition; an effective amount of a quaternary ammonium cationic surfactant; and a solubilizing amount of a secondary surfactant.
Claim 3
Dependent Claim
18 words
The composition of claim 1, wherein said secondary surfactant is selected from nonionic surfactants and polar organic solvents.
Claim 4
Dependent Claim
13 words
The composition of claim 2, wherein said secondary surfactant is an ethoxylated nonylphenol.
Claim 5
Dependent Claim
21 words
The composition of claim 1, wherein said etching composition comprises FeCl 3 , CuCl 2 , peroxysulfuric acid, or peroxyphosphoric acid.
Claim 6
Dependent Claim
44 words
A composition for improving adhesion of organic compounds to metal surfaces, said composition comprising: an etching composition; about 0.0001 weight % to about 5 weight % of a quaternary ammonium cationic surfactant; and about 0.01 weight % to about 25% of a secondary surfactant.
Claim 7
Dependent Claim
44 words
A composition for improving adhesion of organic compounds to metal surfaces, said composition comprising: an etching composition; about 0.0001 weight % to about 5 weight % of a quaternary ammonium cationic surfactant; and about 0.01 weight % to about 25% of a secondary surfactant.
Claim 8
Dependent Claim
22 words
The composition of claim 5, which comprises: about 0.1-0.5 weight % quaternary ammonium cationic surfactant; and about 1-10 weight % secondary surfactant.
Claim 9
Dependent Claim
13 words
The composition of claim 6, wherein said secondary surfactant is an ethoxylated nonylphenol.
Claim 10
Dependent Claim
51 words
A process for improving the adhesion of organic compounds to metal surfaces, said process comprising: contacting said metal surface with a composition comprising an aqueous etching composition, an effective amount of a quaternary ammonium cationic surfactant, and a solubilizing amount of a secondary surfactant; and rinsing said metal surface with water.
Claim 11
Dependent Claim
51 words
A process for improving the adhesion of organic compounds to metal surfaces, said process comprising: contacting said metal surface with a composition comprising an aqueous etching composition, an effective amount of a quaternary ammonium cationic surfactant, and a solubilizing amount of a secondary surfactant; and rinsing said metal surface with water.
Claim 12
Dependent Claim
21 words
The process of claim 8, wherein said etching composition comprises FeCl 3 , and said secondary surfactant is an ethoxylated nonylphenol.
Claim 13
Dependent Claim
52 words
A process for improving the adhesion of photoresist to a board having a copper surface, comprising: contacting said copper surface with a composition comprising an aqueous etching composition, an effective amount of a quaternary ammonium cationic surfactant, and a solubilizing amount of a secondary surfactant; and rinsing said metal surface with water.
Claim 14
Dependent Claim
52 words
A process for improving the adhesion of photoresist to a board having a copper surface, comprising: contacting said copper surface with a composition comprising an aqueous etching composition, an effective amount of a quaternary ammonium cationic surfactant, and a solubilizing amount of a secondary surfactant; and rinsing said metal surface with water.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 1993-09-10 | 1994-03-12 | 1994-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-10 | 1998-03-12 | 1998-09-11 | $3760.00 | Window Closed / Lapsed |
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