US4949220A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid IC with heat sink
Assignee: NEC Electronics Corp
•
Filing: 1989-02-23
•
Granted: 1990-08-14
•
Expires: 2009-02-23
Abstract
Abstract A hybrid IC with a heat sink includes a conductive substrate, a heat sink, an insulating sheet, a plurality of terminals, a power-consuming component, and a resin. The heat sink is separated from the conductive substrate. The insulating sheet is arranged on the conductive substrate. Electric components, wiring conductors, and connecting electrodes are arranged on a surface of the insulating sheet. The terminals are connected to the connecting electrodes on the insulating sheet. The power-consuming component is disposed on the heat sink to be connected to the wiring conductors on the insulating sheet through bonding wires. The resin seals the insulating sheet and a portion of the heat sink on which the power-consuming component is disposed.
Inventors
- 👤 Tadafumi Tashiro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W70/461; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W74/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
103 words
A hybrid IC comprising: a conductive substrate; a heat sink separated from said conductive substrate; an insulating sheet arranged on said conductive substrate, electric components, wiring conductors, and connecting electrodes being arranged on a surface of said insulating sheet; a plurality of terminal each terminal being connected to a respective electrode on said insulating sheet; at least one power-consuming component disposed on said heat sink to be connected to said wiring conductors on said insulating sheet through connecting means; and a resin sealing said insulating sheet and a portion of said heat sink on which said at least one power-consuming component is disposed.
Claim 2
Dependent Claim
103 words
A hybrid IC comprising: a conductive substrate; a heat sink separated from said conductive substrate; an insulating sheet arranged on said conductive substrate, electric components, wiring conductors, and connecting electrodes being arranged on a surface of said insulating sheet; a plurality of terminal each terminal being connected to a respective electrode on said insulating sheet; at least one power-consuming component disposed on said heat sink to be connected to said wiring conductors on said insulating sheet through connecting means; and a resin sealing said insulating sheet and a portion of said heat sink on which said at least one power-consuming component is disposed.
Claim 3
Dependent Claim
20 words
An IC according to claim 1, wherein said substrate and said heat sink are formed by dimpling a metal ribbon.
Claim 4
Dependent Claim
23 words
An IC according to claim 1, wherein said substrate and said heat sink are formed into a recess lower than a ribbon surface.
Claim 5
Dependent Claim
16 words
An IC according to claim 2, wherein said terminals are directly connected to said connecting electrodes.
Claim 6
Dependent Claim
19 words
An IC according to claim 1, wherein said at least one power-consuming component comprises a plurality of power-consuming components.
Claim 7
Dependent Claim
23 words
An IC according to claim 5, wherein said at least one power-consuming component is arranged on said heat sink through an insulating member.
Claim 8
Dependent Claim
25 words
An IC according to claim 1, wherein said heat sink and said terminals are arranged so as to oppose each other through said conductive substrate.
Claim 9
Dependent Claim
111 words
An hybrid IC comprising: a conductive substrate; a heat sink separated from said conductive substrate; an insulating sheet arranged on said conductive substrate, electric components, wiring conductors, and connecting electrodes being arranged on a surface of said insulating sheet; a plurality of terminals arranged to oppose said heat sink through said conductive substrate and connected to said connecting electrodes on said insulating sheet; at least one power-consuming component disposed on said heat sink to be connected to said wiring conductors on said insulating sheet through connecting means; and a resin sealing said insulating sheet and a portion of said heat sink on which said at least one power-consuming component is disposed.
Claim 10
Dependent Claim
111 words
An hybrid IC comprising: a conductive substrate; a heat sink separated from said conductive substrate; an insulating sheet arranged on said conductive substrate, electric components, wiring conductors, and connecting electrodes being arranged on a surface of said insulating sheet; a plurality of terminals arranged to oppose said heat sink through said conductive substrate and connected to said connecting electrodes on said insulating sheet; at least one power-consuming component disposed on said heat sink to be connected to said wiring conductors on said insulating sheet through connecting means; and a resin sealing said insulating sheet and a portion of said heat sink on which said at least one power-consuming component is disposed.
References Cited (Backward Citations)
US4639759A
Cited
US4521828A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |