Abstract A lower core is formed on the surface of a wafer and then a protection film made of substance that has a lower ion milling rate than that of the lower core is formed so as to coat the lower core. Then, the protection film is ground to expose the lower core under the film, and the surface of the protection film and that of the lower core are finished smooth and level. Then, ion beams are radiated to simultaneously mill both the protection film and the lower core and thereby form a recess above the lower core. Next, a gap layer is formed on the surfaces of both the protection film and the lower core. Then, an upper core is formed in the recess above the lower core with a gap layer between them. Accordingly, only the part in which the pole of the upper core and the pole of the lower core face each other in parallel is magnetically effective. This ensures a constant track width even in mass production provided that only the lower core is formed strictly in accordance with the design. In this case, formation of a lower core in accordance with the design is possible. Further, since the surplus part of the upper core does not actually provide a read/write function of a head, cross-talk is seldom generated between adjacent tracks. Conducting milling before forming an upper core elminates magnetic shortcircuiting between the upper and lower cores.
A method for producing a thin film head, comprising the steps of: forming a lower core on the surface of a wafer; coating the lower core with a protection film made of a substance having an ion milling rate lower than that of the lower core; grinding the protection film so that the upper surface of the lower core and the upper surface of the protection film are substantially level and smoothly finished; milling the protection film and the lower core simultaneously with radiated ion beams upon completion of the grinding step so that the upper surface of the lower core is recessed with respect to the upper surface of the protection film; forming a gap layer on the upper surface of the lower core and the upper surface of the protection film; and forming an upper core in the recess while maintaining the gap layer between the upper core and the lower core.
Claim 2
Independent Claim
154 words
A method for producing a thin film head, comprising the steps of: forming a lower core on the surface of a wafer; coating the lower core with a protection film made of a substance having an ion milling rate lower than that of the lower core; grinding the protection film so that the upper surface of the lower core and the upper surface of the protection film are substantially level and smoothly finished; milling the protection film and the lower core simultaneously with radiated ion beams upon completion of the grinding step so that the upper surface of the lower core is recessed with respect to the upper surface of the protection film; forming a gap layer on the upper surface of the lower core and the upper surface of the protection film; and forming an upper core in the recess while maintaining the gap layer between the upper core and the lower core.
Claim 3
Dependent Claim
87 words
The method according to claim 1, wherein the step of milling includes milling the protection film and the lower core until the thickness of the lower core at the recess is less than the thickness of the protection film, said recess being defined by the top surface of the lower core and inclined surfaces of the protection film, the recess being formed such that the inclined surfaces of the protection film intersect the lower core at an upper edge of the top surface of the lower core.
Claim 4
Dependent Claim
17 words
The method according to claim 1, including forming the recess with bevelled surfaces on the protection film.
Claim 5
Dependent Claim
32 words
The method according to claim 3, wherein said upper core is wider than said lower core so that outer edges of the upper core coincide with the bevelled surfaces of the recess.