US4946733A
Expired / Lapsed
US
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Electric carrier devices and methods of manufacture
Assignee: Syensqo Specialty Polymers USA LLC
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Filing: 1988-07-21
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Granted: 1990-08-07
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Expires: 2008-07-21
Abstract
Abstract New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
Inventors
- 👤 Richard E. Seeger, Jr.
- 👤 Noredin H. Morgan
- 👤 Joseph R. Landry, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 09:33
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W70/67; H10W70/68; H10W70/69; H10W70/695; B; B33; B33Y; B33Y80/00; H10W70/682; H10W90/00; H10W90/701; H10W90/731; H10W90/734; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/256
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
112 words
A three-dimensional device comprising an insulating surface carried by a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate having a thickness and defining a first side surface comprising an electronic component mounting area, a flange extending at an angle from the mounting area and defining a lip area having an outer peripheral edge, a particle loaded ink lying in a plurality of distinct circuit paths and extending from the vicinity of said mounting area toward said lip, said particle of said ink comprising a metallic component, said particle loaded ink being bound to said substrate by a curable cross-linkable thermosetting organic resin, and a conductive metal plating plated over said ink.
Claim 2
Dependent Claim
112 words
A three-dimensional device comprising an insulating surface carried by a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate having a thickness and defining a first side surface comprising an electronic component mounting area, a flange extending at an angle from the mounting area and defining a lip area having an outer peripheral edge, a particle loaded ink lying in a plurality of distinct circuit paths and extending from the vicinity of said mounting area toward said lip, said particle of said ink comprising a metallic component, said particle loaded ink being bound to said substrate by a curable cross-linkable thermosetting organic resin, and a conductive metal plating plated over said ink.
Claim 3
Dependent Claim
15 words
A three-dimensional device in accordance with claim 1 wherein said device is a chip carrier.
Claim 4
Dependent Claim
35 words
The three-dimensional device in accordance with claim 2 and further comprising an adhesive resin bonding said ink to said substrate with said adhesive resin bonded by a cured thermoset interfacial bonding layer with said binder.
Claim 5
Dependent Claim
33 words
A three-dimensional device in accordance with claim 2 wherein said device is a chip carrier, said substrate is an electrically insulating organic resin and said conductive metal plating being an electroless metal plating.
Claim 6
Dependent Claim
18 words
A three-dimensional device in accordance with claim 4 wherein said metal plating is plural layered of different metals.
Claim 7
Independent Claim
114 words
A method of forming a three-dimensional device comprising a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate having an electronic component area and defining a lip area having an outer peripheral edge said method comprising, providing said device in a preformed three-dimensional configuration, applying a resilient, compressible printing means to said flange and lip area to deposit a printing ink in a plurality of distinct circuit paths in a three-dimensional array with said ink having a thermosetting binder, adhering said ink to said device, by forming a cured thermoset interfacial bonding layer and plating said paths with an electrically conductive coating to have a surface resistivity no more than 0.05 ohms per square.
Claim 8
Independent Claim
114 words
A method of forming a three-dimensional device comprising a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate having an electronic component area and defining a lip area having an outer peripheral edge said method comprising, providing said device in a preformed three-dimensional configuration, applying a resilient, compressible printing means to said flange and lip area to deposit a printing ink in a plurality of distinct circuit paths in a three-dimensional array with said ink having a thermosetting binder, adhering said ink to said device, by forming a cured thermoset interfacial bonding layer and plating said paths with an electrically conductive coating to have a surface resistivity no more than 0.05 ohms per square.
Claim 9
Dependent Claim
19 words
A method in accordance with the method of claim 6 wherein said plating is carried out by electroless means.
Claim 10
Dependent Claim
32 words
A method in accordance with the method of claim 7 wherein a layer of thermosetting resin adhesive is applied to said flange and lip area and lies intermediate said ink and substrate.
Claim 11
Dependent Claim
28 words
A method in accordance with the method of claim 8 wherein said thermosetting binder in said thermosetting adhesive layer are bonded by a cured thermoset interfacial bonding layer.
Claim 12
Dependent Claim
39 words
A method in accordance with the method of claim 9 wherein said printing ink is highly/loaded with metal-containing particles in the range of from 54 to 87 percent of volume fraction based on the volume of the dry film.
Claim 13
Dependent Claim
24 words
A method in accordance with the method of claim 10 wherein said particles are selected from the class consisting of noble and non-noble metals.
Claim 14
Dependent Claim
22 words
A method in accordance with the method of claim 11 wherein said printing ink is applied by means of a compressible pad.
Claim 15
Dependent Claim
29 words
A method in accordance with the method of claim 12 wherein said pad is a silicone rubber pad which is deformable to enable printing discrete lines on said substrate.
Claim 16
Dependent Claim
50 words
A method in accordance with the method of claim 13 and further comprising positioning said ink into a pickup gravure carrier surface, moving said ink in the form of a conductive pattern from said pickup surface in a plane and transferring said ink to said substrate in said applying step.
Claim 17
Dependent Claim
25 words
A method in accordance with the method of claim 14 and further comprising applying a thermosetting ashesive to said substrate prior to applying said ink.
Claim 18
Dependent Claim
20 words
A method in accordance with the method of claim 15 wherein said thermosetting adhesive is applied over said entire surface.
Claim 19
Dependent Claim
33 words
A method in accordance with the method of claim 16 wherein said thermosetting adhesive is picked up by a transfer pad and applied to said substrate in the same pattern as said ink.
Claim 20
Dependent Claim
89 words
In a method of forming a three-dimensional device comprising a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate the steps comprising, applying a thermosetting adhesive resin to a three-dimensional chip carrier subsrtate, drying said adhesive, printing a circuit pattern from a platable ink onto a carrier, using a deformable pad means for transferring said pattern to said adhesive-covered substrate, curing said ink and substrate to bond said ink to said substrate through said adhesive, electrolessly nickel plating said chip carrier and post curing said carrier at elevated termperature.
Claim 21
Dependent Claim
89 words
In a method of forming a three-dimensional device comprising a thermoplastic or thermosetting, or mixtures thereof, organic resin substrate the steps comprising, applying a thermosetting adhesive resin to a three-dimensional chip carrier subsrtate, drying said adhesive, printing a circuit pattern from a platable ink onto a carrier, using a deformable pad means for transferring said pattern to said adhesive-covered substrate, curing said ink and substrate to bond said ink to said substrate through said adhesive, electrolessly nickel plating said chip carrier and post curing said carrier at elevated termperature.
Claim 22
Dependent Claim
31 words
A method in accordance with the method of claim 18 and further comprising compressing the circuit pattern printed on said chip carrier, and mounting an electrical component on said chip carrier.
Claim 23
Dependent Claim
60 words
A method in accordance with the method of claim 19 and further comprising aligning said chip carrier circuit with a corresponding electrical circuit of a printed circuit base board carrying a solder paste, vapor phase reflow soldering to electrically connect and bond said chip carrier to said circuit board and forming a bond therebetween which meets the Tensile Pull Test.
Claim 24
Dependent Claim
65 words
In a method of forming electrically conductive circuit paths on a three-dimensional surface by placing a particle-loaded ink on said surface, the improvement comprising, preforming said ink in an electrically conductive pattern on a carrier surface, removing said pattern from said surface on a resilient compressible three-dimensional printing means, transferring said pattern to a three-dimensional surface and forming an electrically conductive plating over said pattern.
Claim 25
Dependent Claim
65 words
In a method of forming electrically conductive circuit paths on a three-dimensional surface by placing a particle-loaded ink on said surface, the improvement comprising, preforming said ink in an electrically conductive pattern on a carrier surface, removing said pattern from said surface on a resilient compressible three-dimensional printing means, transferring said pattern to a three-dimensional surface and forming an electrically conductive plating over said pattern.
Claim 26
Dependent Claim
27 words
A method in accordance with the method of claim 21 and further comprising applying an adhesive layer prior to transferring said ink pattern to said three-dimensional surface.
Claim 27
Dependent Claim
24 words
A method in accordance with the method of claim 22 wherein said means is a pad and said three-dimensional surface comprises a chip carrier.
Claim 28
Dependent Claim
33 words
The method of claim 23 wherein said Fe 2 P particles are admixed with a thermosetting resin binder in a volume of from 54 to 87 percent by weight of the volume fraction.
Claim 29
Dependent Claim
99 words
In a method of forming a three-dimensional device comprising an organic resin substrate and defining a first side surface comprising an electronic component mounting area, a flange extending at an angle from the mounting area and an outwardly extending lip area having an outer peripheral edge, the improvement comprising forming a metal component containing particle in an ink layer strongly bonded to said first side surface in the form of an electrical pattern, compressing said ink to make a later plated surface thereover highly suitable for wire bonding of electrical leads thereto, and forming a highly electrically-conductive plating thereover.
Claim 30
Dependent Claim
99 words
In a method of forming a three-dimensional device comprising an organic resin substrate and defining a first side surface comprising an electronic component mounting area, a flange extending at an angle from the mounting area and an outwardly extending lip area having an outer peripheral edge, the improvement comprising forming a metal component containing particle in an ink layer strongly bonded to said first side surface in the form of an electrical pattern, compressing said ink to make a later plated surface thereover highly suitable for wire bonding of electrical leads thereto, and forming a highly electrically-conductive plating thereover.
Claim 31
Dependent Claim
16 words
A three-dimensional device in accordance with claim 1 wherein said device meets the Plateability Standard Test.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-06 | 1994-02-05 | 1994-08-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-06 | 1998-02-05 | 1998-08-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-06 | 2002-02-05 | 2002-08-07 | $7700.00 | Window Closed / Lapsed |