US4939619A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged solid-state surge protector
Assignee: Nortel Networks Technology Corp
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Filing: 1989-07-20
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Granted: 1990-07-03
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Expires: 2009-07-20
Abstract
Abstract A solid-state surge protection device comprises a semiconductor chip sandwiched between two electrodes. A resilient sealing member or layer comprised of a thermoplastic or thermosetting resin extends around the periphery of the device, adhering to both electrodes, so as to seal the interface region between the chip and each electrode. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditions in the device, is environmentally inert, and preferably remains compliant under exteremely cold conditions. The electrodes of the device can move together into electric-conductive contact in the event of chip destruction, or can move back into contact with the chip if separated therefrom by an arc.
Inventors
- 👤 Jerzy Borkowicz
- 👤 William P. Trumble
- 👤 James E. Anderson
- 👤 Robin McIntyre
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:09
CPC Classifications
H; H01; H01C; H01C7/00; H01C7/10; H01C7/12; H02; H02H; H02H9/00; H02H9/04; H02H9/044; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W72/00; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
151 words
An electronic system comprising at least one circuit that includes surge-protecting means for protecting said circuit against a current surge up to 10 amps or more, said surge-protecting means comprising a first electrode and a second electrode; a semiconductor chip that is in electrical-conductive relation with said first and second electrodes, respectively, such that an interface region exists between said semiconductor chip and each of said first and second electrodes; and sealing means for sealing said interface region between said semiconductor chip and each electrode, said sealing means comprising a sealing layer that (a) is adhered to both electrodes, (b) defines with said electrodes a cavity wherein said chip is provided, and (c) is comprised of a dielectric resin material that is resilient under both room-temperature and high-heat conditions, wherein said electrodes are capable of moving into a electrical-conductive relation to sustain a short circuit in the event of chip destruction.
Claim 2
Dependent Claim
151 words
An electronic system comprising at least one circuit that includes surge-protecting means for protecting said circuit against a current surge up to 10 amps or more, said surge-protecting means comprising a first electrode and a second electrode; a semiconductor chip that is in electrical-conductive relation with said first and second electrodes, respectively, such that an interface region exists between said semiconductor chip and each of said first and second electrodes; and sealing means for sealing said interface region between said semiconductor chip and each electrode, said sealing means comprising a sealing layer that (a) is adhered to both electrodes, (b) defines with said electrodes a cavity wherein said chip is provided, and (c) is comprised of a dielectric resin material that is resilient under both room-temperature and high-heat conditions, wherein said electrodes are capable of moving into a electrical-conductive relation to sustain a short circuit in the event of chip destruction.
Claim 3
Dependent Claim
24 words
An electronic system as claimed in claim 1, wherein said dielectric resin material is resilient in a temperature range as low as -40° C.
Claim 4
Dependent Claim
18 words
An electronic system as claimed in claim 1, wherein said resin material comprises a thermoplastic olefin acrylic copolymer.
Claim 5
Dependent Claim
37 words
An electronic system as claimed in claim 3, wherein said copolymer comprises a monomer from the group consisting of an ethylene acrylic acid, an ethylene methacrylic acid, a propylene acrylic acid and a propylene methacrylic acid copolymer.
Claim 6
Dependent Claim
25 words
An electronic system as claimed in claim 4, wherein said copolymer is an ethylene acrylic acid copolymer containing from about 6% to 30% acrylic acid.
Claim 7
Dependent Claim
19 words
An electronic system as claimed in claim 5, wherein said ethylene acrylic acid copolymer contains about 20% acrylic acid.
Claim 8
Dependent Claim
16 words
An electronic system as claimed in claim 1, wherein said resin material comprises a thermosetting resin.
Claim 9
Dependent Claim
28 words
An electronic system as claimed in claim 7, wherein said thermosetting resin is selected from the group consisting of a polyimide elastomer, a polyurethane, and a silicone rubber.
Claim 10
Dependent Claim
16 words
An electronic system as claimed in claim 8, wherein said thermosetting resin is an RTV resin.
Claim 11
Dependent Claim
31 words
An electronic system as claimed in claim 1, wherein said first and second electrodes are comprised of copper, each of said electrode having a thickness of at least about 20 mil.
Claim 12
Dependent Claim
31 words
An electronic system as claimed in claim 10, further comprising a conductive layer, comprised of a metal foil, that is interposed between said chip and said first and second electrodes, respectively.
Claim 13
Dependent Claim
26 words
An electronic system as claimed in claim 1, further comprising a conductive layer, comprised of solder, that joins an electrode to a surface of said chip.
Claim 14
Dependent Claim
22 words
An electronic system as claimed in claim 12, wherein said conductive layer has a thickness of between about 0.3 and 3 mil.
Claim 15
Dependent Claim
25 words
An electronic system as claimed in claim 13, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 16
Dependent Claim
28 words
An electronic system as claimed in claim 14, wherein said second electrode is disc-shaped and has a diameter approximately equal to the maximum transverse dimension of said chip.
Claim 17
Dependent Claim
28 words
An electronic system as claimed in claim 15, wherein each of said first and second electrodes is a copper disc having a thickness of at least 9 mil.
Claim 18
Dependent Claim
25 words
An electronic system as claimed in claim 1, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 19
Dependent Claim
21 words
An electronic system as claimed in claim 1, wherein said first electrode and said second electrode are approximately the same size.
Claim 20
Dependent Claim
19 words
An electronic system as claimed in claim 1, wherein said first electrode and said second electrode differ in shape.
Claim 21
Dependent Claim
127 words
A semiconductor surge protection device comprising a first electrode and a second electrode; a semiconductor chip that is in electrical-conductive relation with said first and second electrodes, respectively, such that an interface region exists between said semiconductor chip and each of said first and second electrodes; and sealing means for sealing said interface region between said semiconductor chip and each electrode, said sealing means comprising a sealing layer that (a) is adhered to both electrodes, (b) defines with said electrodes a cavity wherein said chip is provided, and (c) is comprised of a dielectric resin material that is resilient under both room-temperature and high-heat conditions, wherein said electrodes are capable of moving into a electrical-conductive relation to sustain a short circuit in the event of chip destruction.
Claim 22
Dependent Claim
127 words
A semiconductor surge protection device comprising a first electrode and a second electrode; a semiconductor chip that is in electrical-conductive relation with said first and second electrodes, respectively, such that an interface region exists between said semiconductor chip and each of said first and second electrodes; and sealing means for sealing said interface region between said semiconductor chip and each electrode, said sealing means comprising a sealing layer that (a) is adhered to both electrodes, (b) defines with said electrodes a cavity wherein said chip is provided, and (c) is comprised of a dielectric resin material that is resilient under both room-temperature and high-heat conditions, wherein said electrodes are capable of moving into a electrical-conductive relation to sustain a short circuit in the event of chip destruction.
Claim 23
Dependent Claim
23 words
A device as claimed in claim 20, wherein said dielectric resin material is resilient in a temperature range as low as -40° C.
Claim 24
Dependent Claim
17 words
A device as claimed in claim 20, wherein said resin material comprises a thermoplastic olefin acrylic copolymer.
Claim 25
Dependent Claim
42 words
A device as claimed in claim 22, wherein said copolymer comprises a monomer from the group consisting of an ethylene-acrylic acid, an ethylene methacrylic acid, a propylene acrylic acid and a propylene methacrylic acid copolymer, or a metal salt or ester thereof.
Claim 26
Dependent Claim
23 words
A device as claimed in claim 23, wherein said copolymer is an ethylene-acrylic acid copolymer containing from about 6% to 30% acrylic acid.
Claim 27
Dependent Claim
17 words
A device as claimed in claim 24, wherein said ethylene-acrylic acid copolymer contains about 20% acrylic acid.
Claim 28
Dependent Claim
15 words
A device as claimed in claim 20, wherein said resin material comprises a thermosetting resin.
Claim 29
Dependent Claim
28 words
A device as claimed in claim 26, wherein said thermosetting resin is selected from the group consisting of a polyimide elastomer, an epoxy elastomer and a silicone rubber.
Claim 30
Dependent Claim
15 words
A device as claimed in claim 27, wherein said thermosetting resin is an RTV resin.
Claim 31
Dependent Claim
30 words
A device as claimed in claim 20, wherein said first and second electrodes are comprised of copper, each of said electrode having a thickness of at least about 20 mil.
Claim 32
Dependent Claim
30 words
A device as claimed in claim 29, further comprising a conductive layer, comprised of a metal foil, that is interposed between said chip and said first and second electrodes, respectively.
Claim 33
Dependent Claim
25 words
A device as claimed in claim 20, further comprising a conductive layer, comprised of solder, that joins an electrode to a surface of said chip.
Claim 34
Dependent Claim
21 words
A device as claimed in claim 31, wherein said solder layer has a thickness of between about 0.3 and 3 mil.
Claim 35
Dependent Claim
24 words
A device as claimed in claim 32, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 36
Dependent Claim
27 words
A device as claimed in claim 33, wherein said second electrode is disc-shaped and has a diameter approximately equal to the maximum transverse dimension of said chip.
Claim 37
Dependent Claim
27 words
A device as claimed in claim 34, wherein each of said first and second electrodes is a copper disc having a thickness of at least 9 mil.
Claim 38
Dependent Claim
24 words
A device as claimed in claim 20, wherein said first electrode has a total area that is larger than that of said second electrode.
Claim 39
Dependent Claim
20 words
A device as claimed in claim 20, wherein said first electrode and said second electrode are the same approximate size.
Claim 40
Dependent Claim
18 words
A device as claimed in claim 20, wherein said first electrode and said second electrode differ in shape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-02 | 1994-01-01 | 1994-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-02 | 1998-01-01 | 1998-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-02 | 2002-01-01 | 2002-07-03 | $7700.00 | Window Closed / Lapsed |