US4937655A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film segment having integrated circuit chip bonded thereto and fixture therefor
Assignee: Fujitsu Semiconductor Ltd
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Filing: 1988-10-05
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Granted: 1990-06-26
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Expires: 2008-10-05
Abstract
Abstract A film segment has a flexible beam lead frame formed thereon, to which an IC chip is adapted to be bound in a wireless manner. The film segment having a rectangular shape is provided with at least two positioning perforations formed therein, each of which is adapted to receive and fit a positioning pin element, the positioning perforations being located along one of the diagonal lines of said film segment and in the vicinity of said flexible beam lead frame. The fixture is held by a fixture having a window encompassing the positioning perforations. The film segment can be positioned for testing the IC chip at a given test position with respect to the fixture by inserting the positioning pin elements into the positioning perforations through said window.
Inventors
- 👤 Tatsuya Miyazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
281 words
A circuit chip device, comprising: an integrated circuit chip; a film segment for carrying said integrated circuit chip, said film segment including: (a) a film segment body having a substantially rectangular shape, said film segment body having a central opening passing through a center portion thereof, and (b) a plurality of sprocket perforations passing therethrough, said sprocket perforations arranged in two rows, one row of said sprocket perforations being located near one of two opposing side edges of said film segment body, the other row of said sprocket perforations being located near an opposing side edge of said film segment body, and said two rows of said sprocket perforations being in parallel with said two opposing side edges of said film segment body; and a lead pattern having a plurality of lead elements formed on said film segment body, each of said lead elements including an outer portion secured to said film segment body and an inner portion extending into said central opening, said integrated circuit chip being bonded to each of said lead element inner portion so that said integrated circuit chip is substantially disposed within said central opening, said lead pattern further having a plurality of conductor pads electrically and respectively connected to said plurality of lead elements, said conductor pads being formed in rows in said film segment body for surrounding said central opening, wherein said rows of conductor pads are formed within a region in said film segment body between said rows of sprocket perforations and said central opening, wherein said film segment body further has at least two positioning perforations passing therethrough substantially aligned with each of said rows formed by said plurality of conductor pads.
Claim 2
Dependent Claim
281 words
A circuit chip device, comprising: an integrated circuit chip; a film segment for carrying said integrated circuit chip, said film segment including: (a) a film segment body having a substantially rectangular shape, said film segment body having a central opening passing through a center portion thereof, and (b) a plurality of sprocket perforations passing therethrough, said sprocket perforations arranged in two rows, one row of said sprocket perforations being located near one of two opposing side edges of said film segment body, the other row of said sprocket perforations being located near an opposing side edge of said film segment body, and said two rows of said sprocket perforations being in parallel with said two opposing side edges of said film segment body; and a lead pattern having a plurality of lead elements formed on said film segment body, each of said lead elements including an outer portion secured to said film segment body and an inner portion extending into said central opening, said integrated circuit chip being bonded to each of said lead element inner portion so that said integrated circuit chip is substantially disposed within said central opening, said lead pattern further having a plurality of conductor pads electrically and respectively connected to said plurality of lead elements, said conductor pads being formed in rows in said film segment body for surrounding said central opening, wherein said rows of conductor pads are formed within a region in said film segment body between said rows of sprocket perforations and said central opening, wherein said film segment body further has at least two positioning perforations passing therethrough substantially aligned with each of said rows formed by said plurality of conductor pads.
Claim 3
Dependent Claim
108 words
The circuit chip device as in claim 1, further comprising: a fixture means for holding said film segment, said fixture means including: (a) a fixture body having a recess with a bottom portion formed thereon for receiving said film segment, said fixture body having a window passing through said bottom portion of said recess, and (b) at least two projections extending from a said bottom portion of said recess for respectively accommodating therein said plurality of sprocket perforations, wherein said window is smaller than said film segment body, and is formed so as to receive therein said plurality of said positioning perforations and said plurality of conductor pads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-25 | 1993-12-25 | 1994-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-25 | 1997-12-25 | 1998-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-25 | 2001-12-25 | 2002-06-26 | $7700.00 | Window Closed / Lapsed |