US4937206A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for preventing cross contamination of species during the processing of semiconductor wafers
Assignee: Applied Materials Inc
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Filing: 1989-07-10
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Granted: 1990-06-26
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Expires: 2009-07-10
Abstract
Abstract A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the wafer while it is engaged with the support member, and removing the process compatible material from the support assembly after said material is considered to be contaminated. A shield particularly adapted for this process includes a shield portion made from a process compatible material and a process-compatible adhesive for attaching the shield portion to the support assembly.
Inventors
- 👤 Peter R. Jaffe
- 👤 Kevin Fairbairn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:42
CPC Classifications
H; H10; H10P; H10P50/00; H10P30/00; H10P30/20; Y; Y10; Y10S; Y10S148/00; Y10S148/083; Y10S438/00; Y10S438/905; Y10S438/907; Y10S438/908
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
77 words
A method for preventing cross contamination during semiconductor wafer processing comprising the steps of: covering a surface portion of a support means which would otherwise be exposed to a semiconductor processing environment with a process compatible material; engaging at least one semiconductor wafer with said support means; processing said at least one semiconductor wafer while it is engaged with said support means; and removing said process compatible material from said support means after said material is contaminated.
Claim 2
Independent Claim
77 words
A method for preventing cross contamination during semiconductor wafer processing comprising the steps of: covering a surface portion of a support means which would otherwise be exposed to a semiconductor processing environment with a process compatible material; engaging at least one semiconductor wafer with said support means; processing said at least one semiconductor wafer while it is engaged with said support means; and removing said process compatible material from said support means after said material is contaminated.
Claim 3
Dependent Claim
28 words
A method as recited in claim 1 wherein said step of covering an area of a support means comprises applying an adhesive backed shield to said support means.
Claim 4
Dependent Claim
31 words
A method as recited in claim 2 wherein said shield is made from a material which does not have substantial quantities of any components having an atomic weight greater than fourteen.
Claim 5
Dependent Claim
22 words
A method as recited in claim 3 wherein said material includes a component selected from the group of aluminum, silicon, and carbon.
Claim 6
Dependent Claim
16 words
A method as recited in claim 2 wherein said shield is made from an organic material.
Claim 7
Dependent Claim
26 words
A method as recited in claim 1 wherein said step of covering an area of a support means comprises applying a coating to said support means.
Claim 8
Dependent Claim
16 words
A method as recited in claim 6 wherein said coating is made from an organic material.
Claim 9
Independent Claim
101 words
A method for preventing cross contamination during semiconductor wafer processing comprising the steps of: covering a surface portion of a support means which would otherwise be exposed to a semiconductor processing environment with a process compatible material wherein said step of covering an area of a support means comprises applying an adhesive backed shield to said support means; engaging at least one semiconductor wafer with said support means; processing said at least one semiconductor wafer while it is engaged with said support means; and removing said process compatible material from said support means after said material is considered to be contaminated.
Claim 10
Independent Claim
101 words
A method for preventing cross contamination during semiconductor wafer processing comprising the steps of: covering a surface portion of a support means which would otherwise be exposed to a semiconductor processing environment with a process compatible material wherein said step of covering an area of a support means comprises applying an adhesive backed shield to said support means; engaging at least one semiconductor wafer with said support means; processing said at least one semiconductor wafer while it is engaged with said support means; and removing said process compatible material from said support means after said material is considered to be contaminated.
Claim 11
Dependent Claim
31 words
A method as recited in claim 8 wherein said shield is made from a material which does not have substantial quantities of any components having an atomic weight greater than fourteen.
Claim 12
Dependent Claim
22 words
A method as recited in claim 9 wherein said material includes a component selected from the group of aluminum, silicon, and carbon.
Claim 13
Dependent Claim
16 words
A method as recited in claim 8 wherein said shield is made from an organic material.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-25 | 1993-12-25 | 1994-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-25 | 1997-12-25 | 1998-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-25 | 2001-12-25 | 2002-06-26 | $7700.00 | Window Closed / Lapsed |