Molded circuit board with buried circuit layer

Claim 1

A molded circuit substrate having at least one embedded metal layer therewithin electrically connected to selected circuits of circuitry disposed on major substrate surfaces, each at least one metal layer comprising a metal disposed between upper and lower plastic layers and having substantial length and width with respect to the substrate, a plurality of joints at a plurality of locations defined by plastic material molded to extend past edge portions of said metal member and integrally join together said upper and lower plastic layers, at least one of said upper and lower plastic layers including conductive circuit paths plated onto an outwardly facing major surface thereof, at least one of said circuit paths being electrically connected to the embedded metal layer by plating material along side walls of a respective first aperture through one of said upper and lower plastic layers at a first connection site extending to an exposed surface of said metal layer, at least a pair of said joints being disposed on respective substantially opposed sides of said connection site and closely spaced thereto, whereby said metal layer underlies a substantial portion of said major surfaces enabling a corresponding substantial range of possible locations for said first connection site and said upper and lower plastic layers are joined together against said metal layer at said connection site by said pair of joints on substantially opposing sides of said first connection site irrespective of the location thereof, thereby minimizing possible delamination of said plastic layers from said metal layer and possible resulting cracking of said plating material at said connection site.