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US4923718A Expired / Lapsed US ⏱️ 0.0 years remaining

Functional film and process for its production

Assignee: Takiron Co Ltd
•
Filing: 1987-10-08
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Granted: 1990-05-08
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Expires: 2007-10-08
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Abstract

Abstract Functional films comprising a thermoplastic resin having formed thereon a coating layer and a process for their production are disclosed. The films have improved properties including improved heat resistance, are inexpensive, and are for general-purpose. They are produced by baking a thin film of a phenol resin, an epoxy resin, a silicone resin, etc., onto a thermoplastic resin substrate and can be utilized for flexible printed circuit base, insulating tapes, etc.

Inventors

  • 👤 Kosuke Iida
  • 👤 Hiroshi Yamato
  • 👤 Yoji Kadono

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 04:27
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; C; C08; C08J; C08J7/00; C08J7/04; C08J7/0427; C08J7/043; C08J7/046; C08J7/05; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/015; H05K2201/0154; H05K2201/0162; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0759; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24942; Y10T428/2495; Y10T428/24967; Y10T428/26; Y10T428/269; Y10T428/31504; Y10T428/31507; Y10T428/31511; Y10T428/3154; Y10T428/31544; Y10T428/31652; Y10T428/31663; Y10T428/31667; Y10T428/31721; Y10T428/31786; Y10T428/31797; Y10T428/31855; Y10T428/31935; Y10T428/31942

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 100 words
A process for producing a functional film, which comprises a step of forming a thin film of a solution of one, two or more resins selected from among phenol resin, epoxy resin, melamine resin, silicone resin, fluorine resin, polyimide resin, polyamidoimide resin, polyparabanic acid resin, and polyhydantoin resin on one or both sides of a base substrate composed of a flexible thermoplastic resin, and a step of baking said thin film at 130° to 300° C. for 0.5 to 5 minutes with keeping it in a flatly form-retained state without looseness using a clipping mechanism to form a coating layer.
Claim 2
Dependent Claim 100 words
A process for producing a functional film, which comprises a step of forming a thin film of a solution of one, two or more resins selected from among phenol resin, epoxy resin, melamine resin, silicone resin, fluorine resin, polyimide resin, polyamidoimide resin, polyparabanic acid resin, and polyhydantoin resin on one or both sides of a base substrate composed of a flexible thermoplastic resin, and a step of baking said thin film at 130° to 300° C. for 0.5 to 5 minutes with keeping it in a flatly form-retained state without looseness using a clipping mechanism to form a coating layer.
Claim 3
Dependent Claim 55 words
The process as claimed in claim 1, wherein a base substrate composed of one of polyvinyl chloride resin, polycarbonate resin, polyarylate resin, polyethylene terephthalate resin, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, and polyether imide resin is used, and a phenol resin solution is used as the resin solution for forming the thin film.
Claim 4
Dependent Claim 29 words
The process as claimed in claim 2, wherein said base substrate has a thickness of 1 to 1,000μ, and said coating layer has a thickness of 1 to 10μ.
Claim 5
Dependent Claim 107 words
The process as claimed in claim 1, wherein a base substrate composed of one of polyethylene terephthalate resin, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, and polyether imide resin is used as said base substrate, a solution of one, two or more resins selected from among polyimide resin, polyamidoimide resin, polyparabanic acid resin, and polyhydantoin resin or a solution of a mixture of said resin and one, two or more resins selected from among phenol resin, epoxy resin, and melamine resin is used as said resin solution for forming the thin film, and baking of the formed thin film is conducted at 200° to 300° C.
Claim 6
Dependent Claim 29 words
The process as claimed in claim 4, wherein said base substrate has a thickness of 1 to 350μ, and said coating layer has a thickness of 1 to 10μ.
Claim 7
Dependent Claim 80 words
The process as claimed in claim 1, wherein a base substrate composed of one of polyethylene terephthalate resin, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyetherimide resin, polyvinyl chloride resin, polycarbonate resin, polyarylate resin, triacetate resin, and methyl methacrylate resin is used as said base substrate, a solution of silicone resin or fluorine resin is used as a resin solution for forming the thin film, and baking of the formed thin film is conducted at 150° to 300° C.
Claim 8
Dependent Claim 29 words
The process as claimed in claim 6, wherein said base substrate has a thickness of 1 to 350μ, and said coating layer formed has thickness of 1 to 10μ.
Claim 9
Dependent Claim 58 words
The process as claimed in claim 6, wherein a base substrate composed of one of polyvinyl chloride resin, polycarbonate resin, polyarylate resin, triacetate resin, and methyl methacrylate resin is used as said base substrate, and an aqueous solution or alcohol solution of silicone resin or fluorine resin is used as said resin solution for forming said thin film.
Claim 10
Dependent Claim 67 words
The process as claimed in claim 1, wherein a base substrate composed of a triacetate resin or a methyl methacrylate resin is used as said base substrate, a solution of one, two or more resins selected from among phenol resin, epoxy resin, and melamine resin is used as said thin film-forming resin solution, and baking of the formed thin film is conducted at 150° to 300° C.
Claim 11
Dependent Claim 30 words
The process as claimed in claim 9, wherein said base substrate has a thickness of 1 to 350μ, and said coating layer formed has a thickness of 1 to 10μ.

References Cited (Backward Citations)

JPS5054670A Cited
JPS50146686A Cited
CA1070575A Cited
JPS5898334A Cited
JPS58136941A Cited
JPS59219335A Cited
JPS6024552A Cited
JPS61108639A Cited
JPS6194948A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-05-07 1993-11-06 1994-05-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-05-07 1997-11-06 1998-05-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-05-07 2001-11-06 2002-05-08 $7700.00 Window Closed / Lapsed

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